Intel DH61CR DH61CR Technical Product Specification - Page 9

Regulatory Compliance and Battery Disposal Information, s, Tables - memory

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Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance 75 5.1.1 Safety Standards 75 5.1.2 European Union Declaration of Conformity Statement 76 5.1.3 Product Ecology Statements 77 5.1.4 EMC Regulations 79 5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance 82 5.1.6 Regulatory Compliance Marks (Board Level 83 5.2 Battery Disposal Information 84 Figures 1. Major Board Components 13 2. Block Diagram 15 3. Memory Channel and DIMM Configuration 19 4. Back Panel Audio Connector Options 25 5. LAN Connector LED Locations 27 6. Thermal Sensors and Fan Headers 29 7. Location of the Standby Power LED (Green 37 8. Detailed System Memory Address Map 40 9. Back Panel Connectors 42 10. Component-side Connectors and Headers 43 11. Connection Diagram for Front Panel Header 49 12. Connection Diagram for Front Panel USB Headers 51 13. Location of the Jumper Block 52 14. Intel MEBX Reset Header 54 15. Board Dimensions 55 16. Localized High Temperature Zones 59 Tables 1. Feature Summary 11 2. Components Shown in Figure 1 14 3. Supported Memory Configurations 18 4. Audio Jack Support 23 5. LAN Connector LED States 27 6. Effects of Pressing the Power Switch 31 7. Power States and Targeted System Power 32 8. Wake-up Devices and Events 33 9. System Memory Map 41 10. Component-side Connectors and Headers Shown in Figure 10 44 11. TPM Header 45 12. Serial Port Header 45 13. S/PDIF Header 45 14. Internal Mono Speaker Header 45 15. Front Panel Audio Header for Intel HD Audio 46 ix

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Contents
ix
5
Regulatory Compliance and Battery Disposal Information
5.1
Regulatory Compliance
......................................................................
75
5.1.1
Safety Standards
...................................................................
75
5.1.2
European Union Declaration of Conformity Statement
................
76
5.1.3
Product Ecology Statements
...................................................
77
5.1.4
EMC Regulations
...................................................................
79
5.1.5
ENERGY STAR* 5.0, e-Standby, and ErP Compliance
.................
82
5.1.6
Regulatory Compliance Marks (Board Level)
.............................
83
5.2
Battery Disposal Information
..............................................................
84
Figures
1.
Major Board Components
..................................................................
13
2.
Block Diagram
..................................................................................
15
3.
Memory Channel and DIMM Configuration
............................................
19
4.
Back Panel Audio Connector Options
...................................................
25
5.
LAN Connector LED Locations
.............................................................
27
6.
Thermal Sensors and Fan Headers
......................................................
29
7.
Location of the Standby Power LED (Green)
.........................................
37
8.
Detailed System Memory Address Map
................................................
40
9.
Back Panel Connectors
......................................................................
42
10. Component-side Connectors and Headers
............................................
43
11. Connection Diagram for Front Panel Header
.........................................
49
12. Connection Diagram for Front Panel USB Headers
.................................
51
13. Location of the Jumper Block
.............................................................
52
14. Intel MEBX Reset Header
...................................................................
54
15. Board Dimensions
.............................................................................
55
16. Localized High Temperature Zones
.....................................................
59
Tables
1.
Feature Summary
.............................................................................
11
2.
Components Shown in Figure 1
..........................................................
14
3.
Supported Memory Configurations
......................................................
18
4.
Audio Jack Support
...........................................................................
23
5.
LAN Connector LED States
.................................................................
27
6.
Effects of Pressing the Power Switch
...................................................
31
7.
Power States and Targeted System Power
...........................................
32
8.
Wake-up Devices and Events
.............................................................
33
9.
System Memory Map
........................................................................
41
10. Component-side Connectors and Headers Shown in Figure 10
................
44
11. TPM Header
.....................................................................................
45
12. Serial Port Header
............................................................................
45
13. S/PDIF Header
.................................................................................
45
14. Internal Mono Speaker Header
...........................................................
45
15. Front Panel Audio Header for Intel HD Audio
........................................
46