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Intel DH77EB Technical Product Specification - Page 64

Reliability, Environmental

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Intel Desktop Board DH77EB Technical Product Specification 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Issue 2; Method I Case 3 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the Intel Desktop Board DH77EB is 328,467 hours. 2.8 Environmental Table 39 lists the environmental specifications for the board. Table 39. Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -20 °C to +70 °C 0 °C to +55 °C 50 g trapezoidal waveform Velocity change of 170 inches/s² Half sine 2 millisecond Product Weight (pounds) Free Fall (inches)

Section	Page
Intel® Desktop Board DH77EB Technical Product Specification	1
Revision History	2
Board Identification Information	3
Errata	3
Preface	5
Contents	7
1 Product Description	11
1.1 Overview	11
1.1.1 Feature Summary	11
1.1.2 Board Layout	13
1.1.3 Block Diagram	15
1.2 Online Support	16
1.3 Processor	16
1.3.1 Graphics Subsystem	17
1.4 System Memory	19
1.4.1 Memory Configurations	20
1.5 Intel® H77 Express Chipset	22
1.5.1 Direct Media Interface (DMI)	22
1.5.2 Display Interfaces	22
1.5.3 USB	25
1.5.4 SATA Interfaces	25
1.6 Real-Time Clock Subsystem	27
1.7 Legacy I/O Controller	27
1.7.1 Consumer Infrared (CIR)	27
1.8 Audio Subsystem	28
1.8.1 Audio Subsystem Software	28
1.8.2 Audio Subsystem Components	28
1.9 LAN Subsystem	30
1.9.1 Intel® 82579V Gigabit Ethernet Controller	30
1.9.2 LAN Subsystem Software	31
1.9.3 RJ-45 LAN Connector with Integrated LEDs	31
1.10 Hardware Management Subsystem	32
1.10.1 Hardware Monitoring	32
1.10.2 Fan Monitoring	32
1.10.3 Chassis Intrusion and Detection	32
1.10.4 Thermal Monitoring	33
1.11 Power Management	34
1.11.1 ACPI	34
1.11.2 Hardware Support	36
2 Technical Reference	41
2.1 Memory Resources	41
2.1.1 Addressable Memory	41
2.1.2 Memory Map	43
2.2 Connectors and Headers	43
2.2.1 Back Panel Connectors	44
2.2.2 Component-side Connectors and Headers	45
2.3 Jumper Block	57
2.4 Mechanical Considerations	59
2.4.1 Form Factor	59
2.5 Electrical Considerations	60
2.5.1 Power Supply Considerations	60
2.5.2 Power Supervisor	60
2.5.3 Fan Header Current Capability	61
2.5.4 Add-in Board Considerations	61
2.6 Thermal Considerations	61
2.7 Reliability	64
2.8 Environmental	64
3 Overview of BIOS Features	65
3.1 Introduction	65
3.2 BIOS Flash Memory Organization	66
3.3 Resource Configuration	66
3.3.1 PCI Express Autoconfiguration	66
3.4 System Management BIOS (SMBIOS)	67
3.5 Legacy USB Support	67
3.6 BIOS Updates	68
3.6.1 Language Support	68
3.6.2 Custom Splash Screen	69
3.7 BIOS Recovery	69
3.8 Boot Options	70
3.8.1 Optical Drive Boot	70
3.8.2 Network Boot	70
3.8.3 Booting Without Attached Devices	70
3.8.4 Changing the Default Boot Device During POST	70
3.9 Adjusting Boot Speed	71
3.9.1 Peripheral Selection and Configuration	71
3.9.2 BIOS Boot Optimizations	71
3.10 BIOS Security Features	72
3.11 BIOS Performance Features	73
4 Error Messages and Beep Codes	75
4.1 Speaker	75
4.2 BIOS Beep Codes	75
4.3 Front-panel Power LED Blink Codes	76
4.4 BIOS Error Messages	76
4.5 Port 80h Power On Self Test (POST) Codes	77
5 Regulatory Compliance and Battery Disposal Information	83
5.1 Regulatory Compliance	83
5.1.1 Safety Standards	83
5.1.2 European Union Declaration of Conformity Statement	84
5.1.3 Product Ecology Statements	85
5.1.4 China RoHS	88
5.1.5 EMC Regulations	89
5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP Compliance	91
5.1.7 Regulatory Compliance Marks (Board Level)	92