Intel DH87RL Technical product specification - Page 60

Reliability, Environmental

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Intel Desktop Board DH87RL Technical Product Specification 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using a parts count method. The calculation is based on the Telcordia SR-332, Issue 2; Method I Case 3 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the Intel Desktop Board DH87RL is 356,510 hours. 2.8 Environmental Table 35 lists the environmental specifications for the board. Table 35. Environmental Specifications Parameter Specification Temperature Non-Operating -20 °C to +70 °C (Note) Operating 0 °C to +55 °C The operating temperature of the board may be determined by measuring the air temperature from within 1 inch of the edge of the chipset/PCH heatsink and 1 inch above the board, in a closed chassis, while the system is in operation. Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/s² Packaged Half sine 2 millisecond Product Weight (pounds) Free Fall (inches) Velocity Change (inches/s²)

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Intel Desktop Board DH87RL Technical Product Specification
60
2.7
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using a parts count
method.
The calculation is based on the Telcordia SR-332, Issue 2; Method I Case 3
50% electrical stress, 55 ºC ambient.
The MTBF prediction is used to estimate repair
rates and spare parts requirements.
The MTBF data is calculated from predicted data
at 55 ºC.
The MTBF for the Intel Desktop Board DH87RL is 356,510 hours.
2.8
Environmental
Table 35 lists the environmental specifications for the board.
Table 35.
Environmental Specifications
Parameter
Specification
Temperature
Non-Operating
-20
°
C to +70
°
C
(Note)
Operating
0
°
C to +55
°
C
The operating temperature of the board may be determined by measuring the
air temperature from within 1 inch of the edge of the chipset/PCH heatsink and
1 inch above the board, in a closed chassis, while the system is in operation.
Shock
Unpackaged
50 g trapezoidal waveform
Velocity change of 170 inches/s²
Packaged
Half sine 2 millisecond
Product Weight (pounds)
Free Fall (inches)
Velocity Change (inches/s²)
<20
36
167
21-40
30
152
41-80
24
136
81-100
18
118
Vibration
Unpackaged
5 Hz to 20 Hz:
0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz:
0.02 g² Hz (flat)
Packaged
5 Hz to 40 Hz:
0.015 g² Hz (flat)
40 Hz to 500 Hz:
0.015 g² Hz sloping down to 0.00015 g² Hz
Note: Before attempting to operate this board, the overall temperature of the board must be above the
minimum operating temperature specified. It is recommended that the board temperature be at least
room temperature before attempting to power on the board.