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Intel DQ77CP Technical Product Specification - Page 64

Reliability, Environmental

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Intel Desktop Board DQ77CP Technical Product Specification 2.8 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Issue 2; Method I Case 3 50% electrical stress, 50 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 50 ºC. The MTBF for the Intel Desktop Board DQ77CP is 284,618 hours. 2.9 Environmental Table 36 lists the environmental specifications for the board. Table 36. Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -20 °C to +70 °C 0 °C to +55 °C 50 g trapezoidal waveform Velocity change of 170 inches/s² Half sine 2 millisecond Product Weight (pounds) Free Fall (inches)

Section	Page
Intel® Desktop Board DQ77CP Technical Product Specification	1
Revision History	2
Board Identification Information	3
Errata	3
Preface	5
Contents	7
1 Product Description	11
1.1 Overview	11
1.1.1 Feature Summary	11
1.1.2 Board Layout	13
1.1.3 Block Diagram	15
1.2 Online Support	16
1.3 Processor	16
1.3.1 Graphics Subsystem	17
1.4 System Memory	19
1.4.1 Memory Configurations	20
1.5 Intel® Q77 Express Chipset	22
1.5.1 Direct Media Interface (DMI)	22
1.5.2 Display Interfaces	22
1.5.3 USB	23
1.5.4 SATA Interfaces	23
1.6 Real-Time Clock Subsystem	24
1.7 Legacy I/O Controller	24
1.8 Audio Subsystem	25
1.8.1 Audio Subsystem Software	25
1.8.2 Audio Connectors and Headers	26
1.9 LAN Subsystem	27
1.9.1 Intel® 82579LM Gigabit Ethernet Controller	27
1.9.2 LAN Subsystem Software	28
1.9.3 RJ-45 LAN Connector with Integrated LEDs	28
1.10 Hardware Management Subsystem	29
1.10.1 Hardware Monitoring	29
1.10.2 Fan Monitoring	29
1.10.3 Chassis Intrusion and Detection	29
1.10.4 Thermal Monitoring	30
1.11 Intel® Security and Manageability Technologies	31
1.11.1 Intel® vPro™ Technology	31
1.11.2 Intel Small Business Technology	34
1.12 Intel® Management Engine (Intel® ME) Software and Drivers	35
1.13 Power Management	36
1.13.1 ACPI	36
1.13.2 Hardware Support	38
2 Technical Reference	43
2.1 Memory Resources	43
2.1.1 Addressable Memory	43
2.1.2 Memory Map	45
2.2 Connectors and Headers	45
2.2.1 Back Panel Connectors	46
2.2.2 Component-side Connectors and Headers	47
2.3 Jumper Block	57
2.4 Intel® Management Engine BIOS Extension (Intel® MEBX) Reset Header	58
2.5 Mechanical Considerations	59
2.5.1 Form Factor	59
2.6 Electrical Considerations	60
2.6.1 Power Supply Considerations	60
2.6.2 Power Supervisor	61
2.6.3 Fan Header Current Capability	61
2.6.4 Add-in Board Considerations	61
2.7 Thermal Considerations	61
2.8 Reliability	64
2.9 Environmental	64
3 Overview of BIOS Features	65
3.1 Introduction	65
3.2 BIOS Flash Memory Organization	66
3.3 Resource Configuration	66
3.3.1 PCI Express Autoconfiguration	66
3.4 System Management BIOS (SMBIOS)	67
3.5 Legacy USB Support	67
3.6 BIOS Updates	68
3.6.1 Language Support	68
3.6.2 Custom Splash Screen	69
3.7 BIOS Recovery	69
3.8 Boot Options	70
3.8.1 Optical Drive Boot	70
3.8.2 Network Boot	70
3.8.3 Booting Without Attached Devices	70
3.8.4 Changing the Default Boot Device During POST	70
3.9 Adjusting Boot Speed	71
3.9.1 Peripheral Selection and Configuration	71
3.9.2 BIOS Boot Optimizations	71
3.10 BIOS Security Features	72
3.11 BIOS Performance Features	73
4 Error Messages and Beep Codes	75
4.1 Speaker	75
4.2 BIOS Beep Codes	75
4.3 Front-panel Power LED Blink Codes	76
4.4 BIOS Error Messages	76
4.5 Port 80h Power On Self Test (POST) Codes	77
5 Regulatory Compliance and Battery Disposal Information	83
5.1 Regulatory Compliance	83
5.1.1 Safety Standards	83
5.1.2 European Union Declaration of Conformity Statement	84
5.1.3 Product Ecology Statements	85
5.1.4 China RoHS	88
5.1.5 EMC Regulations	89
5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP Compliance	91
5.1.7 Regulatory Compliance Marks (Board Level)	92