Intel DQ77CP Technical Product Specification - Page 9

Regulatory Compliance and Battery Disposal Information, s, Tables

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Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance 83 5.1.1 Safety Standards 83 5.1.2 European Union Declaration of Conformity Statement 84 5.1.3 5.1.4 5.1.5 Product Ecology Statements 85 China RoHS 88 EMC Regulations 89 5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP Compliance 91 5.1.7 Regulatory Compliance Marks (Board Level 92 5.2 Battery Disposal Information 93 Figures 1. Major Board Components 13 2. Block Diagram 15 3. Memory Channel and DIMM Configuration 21 4. Back Panel Audio Connectors 26 5. LAN Connector LED Locations 28 6. Thermal Sensors and Fan Headers 30 7. Location of the Intel ME "M" State LED 35 8. Location of the Standby Power LED 42 9. Detailed System Memory Address Map 44 10. Back Panel Connectors 46 11. Component-side Connectors and Headers 47 12. Connection Diagram for Front Panel Header 54 13. Connection Diagram for Front Panel USB 2.0 Headers 56 14. Location of the Jumper Block 57 15. Intel MEBX Reset Header 58 16. Board Dimensions 59 17. Localized High Temperature Zones 62 18. Intel Desktop Board DQ77CP China RoHS Material Self Declaration Table 88 Tables 1. Feature Summary 11 2. Components Shown in Figure 1 14 3. Supported Memory Configurations 19 4. Audio Jack Support 25 5. LAN Connector LED States 28 6. Intel ME "M" State LED Behavior 35 7. Effects of Pressing the Power Switch 36 8. Power States and Targeted System Power 37 9. Wake-up Devices and Events 38 10. System Memory Map 45 11. Component-side Connectors and Headers Shown in Figure 11 48 ix

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Contents
ix
5
Regulatory Compliance and Battery Disposal Information
5.1
Regulatory Compliance
......................................................................
83
5.1.1
Safety Standards
...................................................................
83
5.1.2
European Union Declaration of Conformity Statement
................
84
5.1.3
Product Ecology Statements
...................................................
85
5.1.4
China RoHS
..........................................................................
88
5.1.5
EMC Regulations
...................................................................
89
5.1.6
ENERGY STAR* 5.0, e-Standby, and ErP Compliance
.................
91
5.1.7
Regulatory Compliance Marks (Board Level)
.............................
92
5.2
Battery Disposal Information
..............................................................
93
Figures
1.
Major Board Components
..................................................................
13
2.
Block Diagram
..................................................................................
15
3.
Memory Channel and DIMM Configuration
............................................
21
4.
Back Panel Audio Connectors
.............................................................
26
5.
LAN Connector LED Locations
.............................................................
28
6.
Thermal Sensors and Fan Headers
......................................................
30
7.
Location of the Intel ME “M” State LED
................................................
35
8.
Location of the Standby Power LED
.....................................................
42
9.
Detailed System Memory Address Map
................................................
44
10. Back Panel Connectors
......................................................................
46
11. Component-side Connectors and Headers
............................................
47
12. Connection Diagram for Front Panel Header
.........................................
54
13. Connection Diagram for Front Panel USB 2.0 Headers
...........................
56
14. Location of the Jumper Block
.............................................................
57
15. Intel MEBX Reset Header
...................................................................
58
16. Board Dimensions
.............................................................................
59
17. Localized High Temperature Zones
.....................................................
62
18. Intel Desktop Board DQ77CP China RoHS Material Self
Declaration Table
..............................................................................
88
Tables
1.
Feature Summary
.............................................................................
11
2.
Components Shown in Figure 1
..........................................................
14
3.
Supported Memory Configurations
......................................................
19
4.
Audio Jack Support
...........................................................................
25
5.
LAN Connector LED States
.................................................................
28
6.
Intel ME “M” State LED Behavior
........................................................
35
7.
Effects of Pressing the Power Switch
...................................................
36
8.
Power States and Targeted System Power
...........................................
37
9.
Wake-up Devices and Events
.............................................................
38
10. System Memory Map
.........................................................................
45
11. Component-side Connectors and Headers Shown in Figure 11
................
48