Intel E1400 Design Guidelines

Intel E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU Manual

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  • Intel E1400 | Design Guidelines - Page 1
    ® Core™2 Duo Processor, Intel® Pentium® Dual Core Processor, and Intel® Celeron® Dual-Core Processor Thermal and Mechanical Design Guidelines Supporting the: - Intel® Core™2 Duo Processor E6000 and E4000 Series - Intel® Pentium® Dual Core Processor E2000 Series - Intel® Celeron® Dual-Core Processor
  • Intel E1400 | Design Guidelines - Page 2
    ® Dual Core processor and Intel® Pentium® 4 processor may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel processor numbers are not a measure of performance. Processor
  • Intel E1400 | Design Guidelines - Page 3
    Example 28 3.2 Processor Thermal Solution Performance Assessment 29 3.3 Local Ambient Temperature Measurement Guidelines 29 3.4 Processor Case Temperature Measurement Guidelines 32 4 Thermal Management Logic and Thermal Monitor Feature 33 4.1 Processor Power Dissipation 33 4.2 Thermal
  • Intel E1400 | Design Guidelines - Page 4
    for Reference Design 58 6.2.1 6.2.2 6.2.3 6.2.4 Heatsink Performance 58 Acoustics 59 Altitude 60 Heatsink Thermal Validation 60 6.3 Environmental Reliability Testing 61 6.3.1 6.3.2 6.3.3 Structural Reliability Testing 61 Power Cycling 63 Recommended BIOS/CPU/Memory Test Procedures 63
  • Intel E1400 | Design Guidelines - Page 5
    Preload Requirement Limitations 75 A.2.2 Motherboard Deflection Metric Definition 76 Performance 87 Appendix D Case Temperature Reference Metrology 89 D.1 Objective and Scope 89 D.2 Supporting Test Performance for Reference Design 125 Appendix H Mechanical Drawings 128 Appendix I Intel
  • Intel E1400 | Design Guidelines - Page 6
    Intel Type II TMA 65 W Reference Design 50 Figure 5-5. Upward Board Deflection During Shock 51 Figure 5-6. Minimum Required Processor 6-3. Bottom View of Copper Core Applied by TC-1996 Grease 6 o'clock Exit Orientation Relative to the LGA775 Socket 94 Figure 7-16. Inspection of Insulation on
  • Intel E1400 | Design Guidelines - Page 7
    . Thermal sensor Location Illustration 123 Figure 7-47. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components . Intel® D60188-001 Reference Solution Assembly 143 Figure 7-62. Intel® D60188-001 Reference Solution Heatsink 144 Figure 7-63. Intel® E18764
  • Intel E1400 | Design Guidelines - Page 8
    Tables Table 2-1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions 24 Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions ... 24 Table 5-1. Balanced Technology Extended (BTX) Type II Reference TMA Performance 42 Table 5-2. Acoustic Targets 43 Table 5-3.
  • Intel E1400 | Design Guidelines - Page 9
    temperature assumption Added Intel® Pentium® Dual Core processor E2220 specifications Added Intel® Core™2 Duo Desktop processor E4700 specifications Added Intel® Celeron® Dual-Core processor E1400 Added Intel® Celeron® Dual-Core processor E1500 Added Intel® Celeron® Dual-Core processor E1600 July
  • Intel E1400 | Design Guidelines - Page 10
    10 Thermal and Mechanical Design Guidelines
  • Intel E1400 | Design Guidelines - Page 11
    on single processor systems using the Intel® Core™2 Duo processor E6000 and E4000 series, Intel® Pentium® Dual Core processor E2000 series, and Intel® Celeron® DualCore processor E1000 series. The concepts given in this document are applicable to any system form factor. Specific examples used
  • Intel E1400 | Design Guidelines - Page 12
    to the Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Sequences Datasheet, Intel® Pentium® Dual-Core Desktop Processor E2000 Series Datasheet, or Intel® Celeron ® Dual-Core Processor E1000 Series Datasheet. If needed for clarity, the specific processor
  • Intel E1400 | Design Guidelines - Page 13
    Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Series Datasheet Intel® Pentium® Dual-Core Desktop Processor E2000 Series Datasheet Intel® Celeron ® Dual-Core Processor E1000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification
  • Intel E1400 | Design Guidelines - Page 14
    Term Description SA TIM PMAX TDP IHS LGA775 Socket ACPI Bypass Thermal Monitor TCC TDIODE FSC TCONTROL PWM Health Monitor Component BTX TMA Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (TS - TA) / Total
  • Intel E1400 | Design Guidelines - Page 15
    a 775-Land LGA package that interfaces with the motherboard using a LGA775 socket. Refer to the datasheet for detailed mechanical specifications. The processor connects to the motherboard through a land grid array (LGA) surface mount socket. The socket contains 775 contacts arrayed about a cavity in
  • Intel E1400 | Design Guidelines - Page 16
    features a step that interfaces with the LGA775 socket load plate, as described in LGA775 Socket Mechanical Design Guide. The load from the load plate is corresponding specification given in the processor datasheet. When a compressive static load is necessary to ensure mechanical performance, it
  • Intel E1400 | Design Guidelines - Page 17
    and vibration is constrained by the LGA775 socket load plate (refer to the LGA775 Socket Mechanical Design Guide for further information). 2.1.2.2 Heatsink Clip Load Requirement The attach mechanism for the heatsink developed to support the processor should create a static preload on the package
  • Intel E1400 | Design Guidelines - Page 18
    into the chassis. Minimizes contact with the motherboard surface during installation and actuation to avoid scratching the motherboard. 2.2 Thermal Requirements Refer to the datasheet for the processor thermal specifications. The majority of processor power is dissipated through the IHS. There are
  • Intel E1400 | Design Guidelines - Page 19
    of processor power dissipation. The TDP and processor TDP at an inlet temperature of 35 °C + 0.5 °C = 35.5 °C. The slope of the thermal profile was established assuming a generational improvement in thermal solution performance of the reference design. For an example of Intel® Core™2 Duo processor
  • Intel E1400 | Design Guidelines - Page 20
    processor power dissipation is required. The measured power is plotted on the Thermal Profile to determine the maximum case temperature. Using the example in Figure 2-3 for the Intel® Core™2 Duo processor The TCONTROL parameter defines a very specific processor operating region where fan speed can
  • Intel E1400 | Design Guidelines - Page 21
    Processor Thermal/Mechanical Information 2.3 TCONTROL will dissipate more power than a part with lower value (farther from 0, e.g., more negative number) of TCONTROL when running the same application. This is achieved in part by using the CA vs. RPM and RPM vs. Acoustics (dBA) performance curves
  • Intel E1400 | Design Guidelines - Page 22
    the increase in fin surface required to meet a required performance. As the heatsink fin density (the number of fins socket in Appendix H of this design guide. The motherboard primary side height constraints defined in the ATX Specification V2.1 and the microATX Motherboard Interface Specification
  • Intel E1400 | Design Guidelines - Page 23
    during the design phase. Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to capture any impact of IHS flatness change due to combined socket and heatsink loading. While socket loading alone may increase the IHS warpage, the heatsink preload
  • Intel E1400 | Design Guidelines - Page 24
    is 5 °C. Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions Boxed Processor for Intel® Core™2 Duo Processor E6000 and E4000 Series, Intel® Pentium® Dual Core Processor E2000 Series, and Intel® Celeron® Dual- Core Processor E1000 Series Heatsink Inlet Temperature 40
  • Intel E1400 | Design Guidelines - Page 25
    is a function of chassis design. The thermal design power (TDP) of the processor, and the corresponding maximum TC as calculated from the thermal profile. These parameters are usually combined in a single lump cooling performance parameter, CA (case to air thermal characterization parameter). More
  • Intel E1400 | Design Guidelines - Page 26
    Processor Thermal/Mechanical Information § 26 Thermal and Mechanical Design Guidelines
  • Intel E1400 | Design Guidelines - Page 27
    discusses guidelines for testing thermal solutions, including measuring processor temperatures. In all cases, the thermal engineer must measure power dissipation and temperature to validate a thermal solution. To define the performance of a thermal solution the "thermal characterization parameter
  • Intel E1400 | Design Guidelines - Page 28
    following provides an illustration of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any specific Intel processor thermal specifications, and are for illustrative purposes only. 28 Thermal and Mechanical Design
  • Intel E1400 | Design Guidelines - Page 29
    even when running the maximum power application provided by Intel, due to variances in the manufacturing process. The TTV provides consistent power and power density for thermal solution characterization and results can be easily translated to real processor performance. Accurate measurement of the
  • Intel E1400 | Design Guidelines - Page 30
    . When measuring TA in a chassis with a live motherboard, add-in cards, and other system components, it to 25 mm [0.5 to 1.0 in] away from processor and heatsink as shown in Figure 3-3. The thermocouples should the fan regulation and power the fan directly, based on guidance from
  • Intel E1400 | Design Guidelines - Page 31
    Thermal Metrology Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink Note: Drawing Not to Scale Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink Note: Drawing Not to Scale Thermal and Mechanical Design Guidelines 31
  • Intel E1400 | Design Guidelines - Page 32
    a reference procedure for attaching a thermocouple to the IHS of a 775-Land LGA processor package for TC measurement. This procedure takes into account the specific features of the 775-Land LGA package and of the LGA775 socket for which it is intended. § 32 Thermal and Mechanical Design Guidelines
  • Intel E1400 | Design Guidelines - Page 33
    circuits can significantly reduce processor power consumption. An on-die thermal management feature called Thermal Monitor is available on the processor. It provides a thermal management approach to support the continued increases in processor frequency and performance. By using a highly accurate
  • Intel E1400 | Design Guidelines - Page 34
    processor to operate within specifications. The Thermal Monitor's TCC, when active, will attempt to lower the processor temperature by reducing the processor power consumption the internal processor clocks and PROCHOT#. Performance counter registers, status bits in model specific registers (MSRs
  • Intel E1400 | Design Guidelines - Page 35
    bus-to-core multiplier to its minimum available value) and input voltage identification (VID) value. This combination of reduced frequency and VID results in a reduction in processor power consumption. A processor enabled for TM2 includes two operating points, each consisting of a specific operating
  • Intel E1400 | Design Guidelines - Page 36
    (model specific register). Enabling the Thermal Control Circuit allows the processor to attempt to maintain a safe operating temperature without the need for special software drivers or interrupt handling routines. When the Thermal Control Circuit has been enabled, processor power consumption will
  • Intel E1400 | Design Guidelines - Page 37
    processor. The power reduction mechanism of thermal monitor can also be activated manually driver performance processor power than applications that are I/O intensive or have low cache hit rates. The processor TDP is based on measurements of processor power consumption while running various high power
  • Intel E1400 | Design Guidelines - Page 38
    system designed to meet the thermal profile specification published in the processor datasheet greatly reduces the probability of real power must be removed from the processor. THERMTRIP# activation is independent of processor activity and does not generate any bus cycles. Refer to the processor
  • Intel E1400 | Design Guidelines - Page 39
    70 0 60 20 50 Temperature 30 40 Power 40 30 50 20 Fan Speed 60 10 70 Time Note: The processor has both the DTS and thermal diode. . The PECI bus is available on pin G5 of the LGA 775 socket. Intel chipsets beginning with the ICH8 have included PECI host controller. The PECI interface
  • Intel E1400 | Design Guidelines - Page 40
    Thermal Management Logic and Thermal Monitor Feature QST), see Chapter 7 and the Intel® Quiet System Technology Configuration and Tuning Manual. Intel has worked with many vendors that provide fan speed control devices to provide PECI host controllers. Please consult the local representative for
  • Intel E1400 | Design Guidelines - Page 41
    the reference BTX motherboard keep-out and height recommendations defined Section 6.6. The solution comes as an integrated assembly. An isometric view of the assembly is provided Figure 5-4. Target Heatsink Performance Table 5-1 provides the target heatsink performance for the processor with the BTX
  • Intel E1400 | Design Guidelines - Page 42
    thermal solution performance of the Intel® Core™2 Duo processor with 4 MB / 2 MB cache at Tc-max of 72.0 °C, Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 73.3 °C, Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C, and Intel® Celeron® Dual-Core Processor E1000 Series
  • Intel E1400 | Design Guidelines - Page 43
    workloads by adapting the maximum fan speed to support the processor thermal profile, additional acoustic improvements can be achieved at lower processor workload by using the TCONTROL specifications described in Section 2.2.3. Intel's recommendation is to use the fan with 4 Wire PWM Controlled
  • Intel E1400 | Design Guidelines - Page 44
    be made to accommodate or predict the reduction in Thermal Module performance due to the reduction in heatsink airflow from chassis impedance. For speed will be driven by the system airflow requirements and not the processor thermal limits. Figure 5-1 shows the effective fan curve for the reference
  • Intel E1400 | Design Guidelines - Page 45
    Thermal Management The BTX TMA is integral to the cooling of the processor voltage regulator (VR). The reference design TMA will include a flow the voltage regulator (VR) chipset and system memory components on the motherboard. The Thermal Module is required to have features that allow for
  • Intel E1400 | Design Guidelines - Page 46
    power is at a maximum in order to support the 775_VR_CONFIG_06 processors at TDP power processor is met at the targeted altitude. 5.1.6 Reference Heatsink Thermal Validation The Intel reference heatsink will be validated within the specific the specified thermal performance targets after these
  • Intel E1400 | Design Guidelines - Page 47
    @ 0.01 g2/Hz (slope up) 20 Hz to 500 Hz @ 0.01 g2/Hz (flat) Power Spectral Density (PSD) Profile: 2.2 G RMS Figure 5-2. Random Vibration PSD 0.1 0.01 0.001 Vibration 1 10 100 Hz 1000 5.2.1.2 Shock Test Procedure Recommended performance requirement for a system: Quantity: 2 drops for +
  • Intel E1400 | Design Guidelines - Page 48
    then BIOS/CPU/Memory motherboard surface due to impact of heatsink or heatsink attach mechanism. 5. No visible physical damage to the processor package. 6. Successful BIOS/Processor/memory test of post-test samples. 7. Thermal compliance testing to demonstrate that the case temperature specification
  • Intel E1400 | Design Guidelines - Page 49
    . Testing setup should include the following components, properly assembled and/or connected: Appropriate system motherboard Processor All enabling components, including socket and thermal solution parts Power supply Disk drive Video card DIMM Keyboard Monitor The pass criterion is that the system
  • Intel E1400 | Design Guidelines - Page 50
    maximum height of the TMA above the motherboard is 60.60 mm [2.386 inches], for compliance with the motherboard primary side height constraints defined in the BTX Interface Specification for Zone A, found at http://www.formfactors.org. Figure 5-4. Intel Type II TMA 65 W Reference Design Development
  • Intel E1400 | Design Guidelines - Page 51
    strategy for the Intel Type II TMA is to minimize upward board deflection during shock to help protect the LGA775 socket. BTX thermal solutions against fatigue failure of socket solder joint. The allowable preload range for BTX platforms is provided in Table 5-4, but the specific target value is a
  • Intel E1400 | Design Guidelines - Page 52
    for Thermal Module assembly effective stiffness and processor preload combinations. The Thermal Module design specific to the TMA mounting scheme that meets the BTX Interface Specification and Support Retention Mechanism (SRM) Design Guide. For TMA mounting schemes that use only the motherboard
  • Intel E1400 | Design Guidelines - Page 53
    15N greater than the values stipulated in Figure 5-6; however, Intel has not conducted any validation testing with this TMA mounting screws in the thermal module pass through the rear holes in the motherboard designated in the socket keep-in Figure 7-50 through Figure 7-54 in Appendix H and screw
  • Intel E1400 | Design Guidelines - Page 54
    Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 54 Thermal and Mechanical Design Guidelines
  • Intel E1400 | Design Guidelines - Page 55
    of the heatsink. The thermal technology required for the processor. The processors of Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 60.1 °C, Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 61.4 °C and Intel® Pentium® Dual Core processor E2000 series at Tc-max of 61.4 °C require
  • Intel E1400 | Design Guidelines - Page 56
    - Exploded View The processors of Intel® Core™2 Duo processor with 4 MB / 2 MB cache at Tc-max of 72.0 °C, Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 73.3 °C, Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C, and Intel® Celeron® Dual-Core processor E1000 series at
  • Intel E1400 | Design Guidelines - Page 57
    Core Applied by TC-1996 Grease The ATX motherboard keep-out and the height recommendations defined Section 6.6 remain the same for a thermal solution for the processor contact with the energized fan by the user during user servicing. Note: Development vendor information for the reference design is
  • Intel E1400 | Design Guidelines - Page 58
    Reference Heatsink Performance Processor Intel® Core™2 Duo processor with 4 MB / 2 MB cache at Tc-max of 72.0 °C Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 73.3 °C Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C Intel® Celeron® Dual-Core processor E1000 series
  • Intel E1400 | Design Guidelines - Page 59
    at Tc-max of 72.0 °C) 0.67 C/W (Intel Core™2 Duo processor, 2 MB at Tc-max of 73.3 °C) 0.67 C/W (E2000 series at Tc-max of 73.3 °C) 0.67 C/W (E1000 Series of Tc-max of 73.3 °C) Thermal Design Power, Fan speed limited by the fan hub thermistor NOTES: 1. Acoustic performance is defined in terms of
  • Intel E1400 | Design Guidelines - Page 60
    some degradation in thermal solution performance compared to what is obtained at sea level, with lower fan performance and higher surface temperatures. the processor is met at the targeted altitude. 6.2.4 Heatsink Thermal Validation Intel recommends evaluation of the heatsink within the specific
  • Intel E1400 | Design Guidelines - Page 61
    Hz Power Spectral Density (PSD) Profile: 3.13 G RMS Figure 6-4. Random Vibration PSD 0.1 3.13GRMS (10 minutes per axis) (20, 0.02) (500, 0.02) (5, 0.01) 0.01 0.001 1 5 Hz 10 100 Frequency (Hz) 500 Hz 1000 6.3.1.2 Shock Test Procedure Recommended performance requirement for a motherboard
  • Intel E1400 | Design Guidelines - Page 62
    then BIOS/CPU/Memory motherboard surface due to impact of heatsink or heatsink attach mechanism. 5. No visible physical damage to the processor package. 6. Successful BIOS/Processor/memory test of post-test samples. 7. Thermal compliance testing to demonstrate that the case temperature specification
  • Intel E1400 | Design Guidelines - Page 63
    . Testing setup should include the following components, properly assembled and/or connected: Appropriate system motherboard Processor All enabling components, including socket and thermal solution parts Power supply Disk drive Video card DIMM Keyboard Monitor The pass criterion is that the system
  • Intel E1400 | Design Guidelines - Page 64
    allows for appropriate fan inlet airflow to ensure fan performance, and therefore overall cooling solution performance. This is compliant with the recommendations found in both ATX Specification V2.1 and microATX Motherboard Interface Specification V1.1 documents. 64 Thermal and Mechanical Design
  • Intel E1400 | Design Guidelines - Page 65
    upward board deflection during shock to help protect the LGA775 socket. The reference design uses a high clip stiffness that resists reference design is 191.3 N ± 44.5 N [43 lb ± 10 lb]. Note: Intel reserves the right to make changes and modifications to the design as necessary to the reference
  • Intel E1400 | Design Guidelines - Page 66
    design can be used by other 3rd party cooling solutions. The attach mechanism consists of: A metal attach clip that interfaces with the heatsink core, see Appendix H, Figure 7-55 and Figure 7-56 for the component drawings. Four plastic fasteners, see Appendix H, Figure 7-57, Figure 7-58, Figure 7-59
  • Intel E1400 | Design Guidelines - Page 67
    ATX Thermal/Mechanical Design Information Figure 6-8. Critical Parameters for Interfacing to Reference Clip Fan Fin Array Core See Detail A Clip Fin Array 1.6 mm Clip Core Detail A Figure 6-9. Critical Core Dimension 1.00 +/- 0.10 mm 1.00 mm min 38.68 +/- 0.30 mm 36.14 +/- 0.10 mm Gap
  • Intel E1400 | Design Guidelines - Page 68
    ATX Thermal/Mechanical Design Information 68 Thermal and Mechanical Design Guidelines
  • Intel E1400 | Design Guidelines - Page 69
    complete discussion of programming the Intel QST in the ME please consult the Intel® Quiet System Technology (Intel® QST) Configuration and Tuning Manual. Note: Fan speed control algorithms and Intel QST in particular rely on a thermal solution being compliant to the processor thermal profile. It is
  • Intel E1400 | Design Guidelines - Page 70
    processor heatsink fan and a 2nd fan in the system. By placing a factor in this matrix additional the Intel QST could command the processor temperature readings and specific temperature targets. a fixed temperature vs. PWM output relationship temperature, the algorithm will instruct the fan to speed
  • Intel E1400 | Design Guidelines - Page 71
    limit temperatures are assigned for each temperature sensor. For Intel QST, the TCONTROL for the processor and chipset are to be used as the limit Integral gain Kd = derivative gain The Intel® Quiet System Technology (Intel® QST) Configuration and Tuning Manual provides initial values for the each
  • Intel E1400 | Design Guidelines - Page 72
    shown in Figure 7-3 and listed below: ME system (S0-S1) with Controller Link connected and powered DRAM with Channel A DIMM 0 installed and 2MB reserved for Intel® QST FW execution SPI Flash with sufficient space for the Intel® QST Firmware SST-based thermal sensors to provide board thermal data for
  • Intel E1400 | Design Guidelines - Page 73
    -die thermal diode that is in all of the processors in the 775-land LGA packages shipped before the Intel® Core™2 Duo processor. With the proper configuration information the ME can be accommodate inputs from PECI or SST for the processor socket. Additional SST sensors can be added to monitor system
  • Intel E1400 | Design Guidelines - Page 74
    motherboard and initial settings for fan control, fan monitoring, voltage and thermal monitoring. This initial data is generated using the Intel CA sufficient to meet the thermal profile of the processor. Intel QST, by measuring the processor Digital thermal sensor will command the fan to reduce
  • Intel E1400 | Design Guidelines - Page 75
    in shock and vibration and TIM performance, LGA775 socket requires a minimum heatsink preload to protect against fatigue failure of socket solder joints. Solder ball tensile stress is originally created when, after inserting a processor into the socket, the LGA775 socket load plate is actuated. In
  • Intel E1400 | Design Guidelines - Page 76
    design for ATX//µATX form factor. A.2.2 Motherboard Deflection Metric Definition Motherboard deflection is measured along either diagonal (refer Table 7-1. Board Deflection Configuration Definitions Configuration Parameter Processor + Socket load plate d_ref yes d_BOL yes d_EOL yes
  • Intel E1400 | Design Guidelines - Page 77
    LGA775 Socket Heatsink Loading Figure 7-6. Board Deflection Definition d1 d'1 d2 d'2 remain within the static load limits defined in the processor datasheet at all times. 2. Board deflection should not exceed motherboard manufacturer specifications. Thermal and Mechanical Design Guidelines 77
  • Intel E1400 | Design Guidelines - Page 78
    LGA775 Socket Heatsink Loading A.2.4 Board Deflection Metric Implementation Example This section is for is a result of the creep phenomenon. The example accounts for the creep expected to occur in the motherboard. It assumes no creep to occur in the clip. However, there is a small amount of creep
  • Intel E1400 | Design Guidelines - Page 79
    LGA775 Socket Heatsink Loading Figure 7-7. Example: Defining Heatsink Preload Meeting Board Deflection Limit A.2.5 Additional Considerations Intel recommends (Refer to processor datasheet) 2. Board deflection should not exceed motherboard manufacturer specifications. Thermal and Mechanical Design
  • Intel E1400 | Design Guidelines - Page 80
    will collaborate with vendors participating in its third party test house program to evaluate third party solutions. Vendor information now is available in Intel® Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 80 Thermal and Mechanical Design Guidelines
  • Intel E1400 | Design Guidelines - Page 81
    socket Quantify preload degradation under bake conditions. Note: This document reflects the current metrology used by Intel. Intel is to maintain the load cells in place during the heatsink installation on the processor and motherboard (Refer to Figure 7-9). The depth of the pocket depends on the
  • Intel E1400 | Design Guidelines - Page 82
    Heatsink Clip Load Metrology Remarks: Alternate Heatsink Sample Preparation As mentioned above, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results. An alternate method to make sure that the test setup will measure loads representative
  • Intel E1400 | Design Guidelines - Page 83
    cell in position during heatsink installation Load cell protrusion (Note: to be optimized depending on assembly stiffness) Figure 7-10. Preload Test Configuration Preload Fixture (copper core with milled out pocket) Load Cells (3x) Thermal and Mechanical Design Guidelines 83
  • Intel E1400 | Design Guidelines - Page 84
    plate, attach to chassis, etc.). Prior to any test, make sure that the load cell has been calibrated against known loads, following load cell vendor's instructions. 84 Thermal and Mechanical Design Guidelines
  • Intel E1400 | Design Guidelines - Page 85
    on the board as needed prior to mounting the motherboard on an appropriate support fixture that replicate the board attach to a target Install relevant test vehicle (TTV, processor) in the socket 3. Assemble the heatsink reworked with the load cells to motherboard as shown for the reference design
  • Intel E1400 | Design Guidelines - Page 86
    Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines
  • Intel E1400 | Design Guidelines - Page 87
    of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area and of the interface material has a significant impact on the thermal performance of the overall thermal solution. The higher the thermal resistance,
  • Intel E1400 | Design Guidelines - Page 88
    Thermal Interface Management 88 Thermal and Mechanical Design Guidelines
  • Intel E1400 | Design Guidelines - Page 89
    account the specific features of the 775-land LGA package and of the LGA775 socket for which it listed the following table as a convenience to Intel's general customers and the list may be Address 1837 Whipple Road, Hayward, Ca 94544 Supporting Test Equipment To apply the reference thermocouple
  • Intel E1400 | Design Guidelines - Page 90
    Case Temperature Reference Metrology Item Description Part Number Solder Flux Loctite* 498 Adhesive Adhesive Accelerator Kapton* Tape Thermocouple Ice Point Cell Hot Point Cell Miscellaneous Hardware Indium Corp. of America Alloy 57BI / 42SN / 1AG 0.010 Diameter Indium Corp. of America Super
  • Intel E1400 | Design Guidelines - Page 91
    of temperature measurement equipment be performed before attempting to perform temperature case measurement. Intel recommends checking the meter the IHS notch to allow the thermocouple wire to be routed under the socket lid. This will protect the thermocouple from getting damaged or pinched when
  • Intel E1400 | Design Guidelines - Page 92
  • Intel E1400 | Design Guidelines - Page 93
  • Intel E1400 | Design Guidelines - Page 94
    processor is installed in the LGA775 socket, the groove is parallel to the socket socket load. A larger groove may cause the IHS to warp under the socket load such that it does not represent the performance of an ungrooved IHS on production packages. Inspect parts for compliance to specifications
  • Intel E1400 | Design Guidelines - Page 95
    block heater, as it can take up to 30 minutes to reach the target temperature of 153 - 155 °C. Note: To avoid damage to the processor ensure the IHS temperature does not exceed 155 °C. As a complement to the written procedure a video Thermocouple Attach Using Solder - Video CD-ROM is available
  • Intel E1400 | Design Guidelines - Page 96
    Case Temperature Reference Metrology Figure 7-17. Bending the Tip of the Thermocouple D.5.2 Thermocouple Attachment to the IHS 12. Clean groove and IHS with Isopropyl Alcohol (IPA) and a lint free cloth removing all residues prior to thermocouple attachment. 13. Place the thermocouple wire inside
  • Intel E1400 | Design Guidelines - Page 97
    7-19. Thermocouple Bead Placement (A) (B) 16. Place the package under the microscope to continue with process. It is also recommended to use a fixture (like processor tray or a plate) to help holding the unit in place for the rest of the attach process. 17. While still at the microscope, press the
  • Intel E1400 | Design Guidelines - Page 98
    Case Temperature Reference Metrology Figure 7-20. Position Bead on the Groove Step Kapton* tape Wire section into the groove to prepare for final bead placement Figure 7-21. Detailed Thermocouple Bead Placement TC Wire with Insulation IHS with Groove Figure 7-22. Third Tape Installation TC Bead
  • Intel E1400 | Design Guidelines - Page 99
    Case Temperature Reference Metrology 18. Place a 3rd piece of tape at the end of the step in the groove as shown in Figure 7-22. This tape will create a solder dam to prevent solder from flowing into the larger IHS groove section during the melting process. 19. Measure resistance from thermocouple
  • Intel E1400 | Design Guidelines - Page 100
    Case Temperature Reference Metrology Figure 7-24. Applying Flux to the Thermocouple Bead 21. Cut two small pieces of solder 1/16 inch (0.065 inch / 1.5 mm) from the roll using tweezers to hold the solder while cutting with a fine blade(see Figure 7-25) Figure 7-25. Cutting Solder 22. Place the two
  • Intel E1400 | Design Guidelines - Page 101
    Case Temperature Reference Metrology Figure 7-26. Positioning Solder on IHS D.5.3 23. Measure the resistance from the thermocouple end wires again using the DMM (refer to Section D.5.1.step 2) to ensure the bead is still properly contacting the IHS. Solder Process 24. Make sure the thermocouple
  • Intel E1400 | Design Guidelines - Page 102
    Figure 7-27. Solder Station Setup Case Temperature Reference Metrology 27. Remove the land side protective cover and place the device to be soldered in the solder station. Make sure the thermocouple wire for the device being soldered is exiting the heater toward you. Note: Do not touch the copper
  • Intel E1400 | Design Guidelines - Page 103
    Case Temperature Reference Metrology Figure 7-28. View Through Lens at Solder Station Figure 7-29. Moving Solder back onto Thermocouple Bead Thermal and Mechanical Design Guidelines 103
  • Intel E1400 | Design Guidelines - Page 104
    Case Temperature Reference Metrology 31. Lift the heater block and magnified lens, using tweezers quickly rotate the device 90 degrees clockwise. Using the back of the tweezers press down on the solder this will force out the excess solder Figure 7-30. Removing Excess Solder 32. Allow the device to
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    Case Temperature Reference Metrology D.5.4 Cleaning and Completion of Thermocouple Installation 33. Remove the device from the solder station and continue to monitor IHS Temperature with a handheld meter. Place the device under the microscope and remove the three pieces of Kapton* tape with
  • Intel E1400 | Design Guidelines - Page 106
    Case Temperature Reference Metrology 36. Clean the surface of the IHS with Alcohol and use compressed air to remove any remaining contaminants. 37. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope that the thermocouple wire is below the surface along the entire
  • Intel E1400 | Design Guidelines - Page 107
    the center of the IHS. Note: The adhesive shaving step should be performed while the adhesive is partially cured, but still soft. This will help and a wipe. 42. Replace the land side cover on the device. 43. Perform a final continuity test. 44. Wind the thermocouple wire into loops and secure or
  • Intel E1400 | Design Guidelines - Page 108
    or bag until it is ready to be used for thermal testing use. D.6 Thermocouple Wire Management When installing the processor into the socket, the thermocouple wire should route under the socket lid, as shown in Figure 7-37. This will keep the wire from getting damaged or pinched when removing and
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    motherboard processor datasheet for the specific values. The designer needs to ensure that when the heat sink fan is operating at full speed the thermal solution will meet the TC-MAX limits at TDP. The slope of the thermal profile will allow the designer to make tradeoffs in thermal performance
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    the design, such as the processor voltage regulator, or by functional limits of the fan design. Per the Fan Specification for 4 wire PWM Controlled stop running when the current provided to the motor windings is insufficient to support commutation. The fan would turn off at 0% PWM duty cycle input.
  • Intel E1400 | Design Guidelines - Page 111
    discrete device or a super IO (SIO) with the functionality embedded. Intel has engaged with a number of major manufacturers of FSC components to provide the fan is operating at full speed (100% PWM duty cycle). By specification this is TCONTROL. The minimum fan speed (PWM duty cycle). For any on
  • Intel E1400 | Design Guidelines - Page 112
    7-40 for an example. There may be vendor specific options that offer enhanced functionality. See the appropriate processor The first two cases can create a poor acoustic response for the user. The third case the user could notice a drop in performance as the thermal control circuit reduces the power
  • Intel E1400 | Design Guidelines - Page 113
    significantly reduced Maximum fan speed is lower The rate of change of CA vs. RPM is an exponential curve with a larger decrease at the beginning TSENSOR reading the thermal solution can keep up with rate of change in processor power. The rate of change in acoustics (dBA) is more linear with RPM
  • Intel E1400 | Design Guidelines - Page 114
    TDP power levels and high system ambient. See Section E.4 for additional discussion on TCONTROL versus Thermal Profile For use with the ATX Boxed Processor system idle Voltage regulator cooling For a motherboard design intending to use the Boxed Processor or the enabled reference thermal solution the
  • Intel E1400 | Design Guidelines - Page 115
    TCONTROL The processor thermal specification is comprised of Intel requires monitoring the on-die thermal sensor to implement acoustic fan speed control. The value of the on-die thermal sensor temperature determines which specification power dissipation. Thermal and Mechanical Design Guidelines 115
  • Intel E1400 | Design Guidelines - Page 116
    Fan Speed Control To use all of the features in the Intel reference heatsink design or the Boxed Processor, system integrators should verify the following functionality is present in the board design. Please refer to the Fan Specification for 4 wire PWM Controlled Fans and Chapter 6 for complete
  • Intel E1400 | Design Guidelines - Page 117
    part of the design necessary to meet specifications. Should be considered a pass or or expanded by the system integrator. The motherboard needs to have a fan speed control component the Boxed Processor. External/remote thermal sensor measurement capability (required). Must support PECI and thermal
  • Intel E1400 | Design Guidelines - Page 118
    of 25 kHz is the design target for the reference and for the Intel® Boxed Processor and the reference design. 2. Use the lowest time available in this range for the device selected. 3. To ensure compliance with the thermal specification, thermal profile and usage of the TSENSOR for fan speed control
  • Intel E1400 | Design Guidelines - Page 119
    PWM frequency of 25 kHz is the design target for the reference and for the Intel® Boxed Processor and BTX reference design. 2. Use the lowest time available in this range for see Appendix F. 6. To ensure compliance with the thermal specification, thermal profile and usage of the TSENSOR for fan speed
  • Intel E1400 | Design Guidelines - Page 120
    Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines
  • Intel E1400 | Design Guidelines - Page 121
    conditions in which the processor power may be low but other system component powers may be high. ensuring compliance with the component temperature specifications at all operating conditions and, therefore (see Figure 7-45 and Figure 7-46).The Intel Boxed Boards in BTX form factor have implemented
  • Intel E1400 | Design Guidelines - Page 122
    . Lisle, IL 60532 1-800-78MOLEX phone 1-630-969-1352 fax [email protected] Figure 7-45. System Airflow Illustration with System Monitor Point Area Identified Power Supply Unit Graphics Add-In Card Memory Monitor Point MCH Thermal Module OM16791 122 Thermal and Mechanical Design Guidelines
  • Intel E1400 | Design Guidelines - Page 123
    Balanced Technology Extended (BTX) System Thermal Considerations Figure 7-46. Thermal sensor Location Illustration Thermal Sensor MCH Heatsink § Thermal and Mechanical Design Guidelines 123
  • Intel E1400 | Design Guidelines - Page 124
    Balanced Technology Extended (BTX) System Thermal Considerations 124 Thermal and Mechanical Design Guidelines
  • Intel E1400 | Design Guidelines - Page 125
    Performance for Reference Design The fan power requirements for proper operation are given Table 7-6. Table 7-6. Fan Electrical Performance spec for performance after 7,500 on/off cycles with each cycle specified as 3 minutes on, 2 minutes off, at a temperature of 70 °C. See the Fan Specification
  • Intel E1400 | Design Guidelines - Page 126
    Fan Performance for Reference Design § 126 Thermal and Mechanical Design Guidelines
  • Intel E1400 | Design Guidelines - Page 127
    Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127
  • Intel E1400 | Design Guidelines - Page 128
    refer to the reference thermal mechanical enabling components for the processor. Note: Intel reserves the right to make changes and modifications to the design as necessary. Drawing Description ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components
  • Intel E1400 | Design Guidelines - Page 129
    39.01 36.00 33.00 32.51 27.51 ( 16.87 ) 27.51 32.51 36.00 39.01 47.50 45.26 44.00 40.00 36.78 36.49 27.00 23.47 5.90 0.00 2 7.30 23.47 27.81 36.78 40.00 45.26 47.50
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    DWG. NO. SH. 1 REV.
  • Intel E1400 | Design Guidelines - Page 146
    components. The part numbers listed in the tables identify these reference components. End-users are responsible for the verification of the Intel enabled component offerings with the supplier. OEMs and System Integrators are responsible for thermal, mechanical, and environmental validation of these
  • Intel E1400 | Design Guidelines - Page 147
    .Chen@Foxcon n.com 847-2992222 [email protected] om Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of
  • Intel E1400 | Design Guidelines - Page 148
    prior to the next revision of this document. 2. The user should note that for the 2004 Type I Intel reference Thermal Module Assembly: also meets 2005 Performance (130 W) and Mainstream (84 W) as well as the 2004 Performance 775_VR_CONFIG_04 (115 W). 3. The user should note that for the 2004 Type II
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Document Number:
317804-011
Intel
®
Core
™
2 Duo Processor,
Intel
®
Pentium
®
Dual Core
Processor, and Intel
®
Celeron
®
Dual-Core Processor
Thermal and Mechanical Design Guidelines
Supporting the:
- Intel
®
Core™2 Duo Processor E6000
and E4000
Series
- Intel
®
Pentium
®
Dual Core Processor E2000
Series
- Intel
®
Celeron
®
Dual-Core Processor E1000
Series
June 2009