Intel EM64T User Guide - Page 19
Thermal Profile
UPC - 675900697546
View all Intel EM64T manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 19 highlights
Processor Thermal/Mechanical Information R Figure 2. Processor Case Temperature Measurement Location Measure TC at this point (geometric center of the package) 37.5 mm 2.2.2 37.5 mm Thermal Profile The Thermal Profile defines the maximum case temperature as a function of processor power dissipation. The TDP and Maximum Case Temperature are defined as the maximum values of the thermal profile. By design the thermal solutions must meet the thermal profile for all system operating conditions and processor power levels. The slope of the thermal profile was established assuming a generational improvement in thermal solution performance of about 10% based on previous Intel reference designs. This performance is expressed as the slope on the thermal profile and can be thought of as the thermal resistance of the heatsink attached to the processor, Ψ CA (Refer to Section 3.1). The intercept on the thermal profile assumes a maximum ambient operating condition that is consistent with the available chassis solutions. To determine compliance to the thermal profile, a measurement of the actual processor power dissipation is required. Contact your Intel sales representative for assistance in processor power measurement. The measured power is plotted on the Thermal Profile to determine the maximum case temperature. Using the example in Figure 3 for a processor dissipating 70 W the maximum case temperature is 61 °C. For the Pentium 4 processor in the 775-land LGA package, there are two thermal profiles to consider. The Platform Requirement Bit (PRB) indicates which thermal profile is appropriate for a specific processor. This document will focus on the development of thermal solutions to meet the thermal profile for PRB=1. See the processor datasheet for the thermal profile and additional discussion on the PRB. Thermal/Mechanical Design Guide 19