Intel EM64T User Guide - Page 83
Using 3D Micromanipulator to Secure Bead Location, Measuring Resistance
UPC - 675900697546
View all Intel EM64T manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 83 highlights
Case Temperature Reference Metrology R Figure 35. Using 3D Micromanipulator to Secure Bead Location 11. Measure resistance from thermocouple end wires (hold both wires to a DMM probe) to the IHS surface. This should be the same value as measured during the thermocouple conditioning see Section D.6.1, step 2 and Figure 36. Figure 36. Measuring Resistance between Thermocouple and IHS 12. Place a small amount of Loctite 498 adhesive in the groove where the bead is installed. Using a fine point device, spread the adhesive in the groove around the needle, the thermocouple bead and the thermocouple wires already installed in the groove during step 5 above. Be careful not to move the thermocouple bead during this step (Figure 37). Thermal/Mechanical Design Guide 83