Intel Q9450 Design Guidelines

Intel Q9450 - Core 2 Quad Quad-Core Processor Manual

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  • Intel Q9450 | Design Guidelines - Page 1
    Intel® Core™2 Extreme QuadCore Processor and Intel® Core™2 Quad Processor Thermal and Mechanical Design Guidelines Supporting:  Intel® Core™2 Extreme quad-core processor QX6000Δ series at 775_VR_CONFIG_05B  Intel® Core™2 Quad processor Q6000Δ series at 105 W  Intel® Core™2 Quad processor Q6000Δ
  • Intel Q9450 | Design Guidelines - Page 2
    , Intel® Core™2 Extreme Processor QX9000 series Intel® Core™2 Quad processor Q9000, Q9000S, Q8000, and Q8000S series and Intel® Core™2 Quad processor Q6000 Δ series may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current
  • Intel Q9450 | Design Guidelines - Page 3
    12 1.2 References 13 1.3 Definition of Terms 14 2 Processor Thermal/Mechanical Information 17 2.1 Mechanical Requirements 17 2.1.1 Processor Package 17 2.1.2 Heatsink Attach 19 2.1.2.1 General Guidelines 19 2.1.2.2 Heatsink Clip Load Requirement 19 2.1.2.3 Additional Guidelines 20
  • Intel Q9450 | Design Guidelines - Page 4
    6.2 Board and System Implementation of Intel® Quiet System Technology .......60 6.3 Intel® QST Configuration and Tuning 62 6.4 Fan Hub Thermistor and Intel® QST 62 LGA775 Socket Heatsink Loading 63 A.1 LGA775 Socket Heatsink Considerations 63 A.2 Metric for Heatsink Preload for ATX/uATX Designs
  • Intel Q9450 | Design Guidelines - Page 5
    Appendix E B.2 Test Preparation 69 B.2.1 Heatsink Preparation 69 B.2.2 Typical Test Equipment 72 Metrology 77 D.1 Objective and Scope 77 D.2 Supporting Test Equipment 77 D.3 Thermal calibration and F Mechanical Drawings 103 Appendix G Intel® Enabled Reference Solution Information 123
  • Intel Q9450 | Design Guidelines - Page 6
    Processor Thermal Characterization Parameter Relationships 30 Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink Heatsink Assembly 54 Figure 17. Critical Parameters for Interfacing to Reference Clip 55 Figure 18. Critical Core Dimension 55 Figure 19. Intel Groove Step 87
  • Intel Q9450 | Design Guidelines - Page 7
    - Sheet 4 117 Figure 72. Intel® RCFH4 Reference Solution Assembly 118 Figure 73. Intel® RCFH4 Reference Solution Assembly - Page 2 119 Figure 74. Intel® D60188-001 Reference Solution Assembly 120 Figure 75. Intel® D60188-001 Reference Solution Heatsink 121 Thermal and Mechanical Design
  • Intel Q9450 | Design Guidelines - Page 8
    Thermal Solutions 27 Table 2. Heatsink Inlet Temperature of Intel® Boxed Processor thermal solutions .....27 Table 3. ATX Reference Heatsink Performance (RCFH-4) for 775_VR_CONFIG 05B Processors 45 Table 4. ATX Reference Heatsink Performance (D60188-001) for Listed Processors at 95 W 46 Table
  • Intel Q9450 | Design Guidelines - Page 9
     Removed Legacy Fan Speed Control appendix.  Added Intel® Core™2 Quad processors Q9550, Q9450, and Q9300  Added Intel® Core™2 Quad processors Q9650 and Q9400  Added Intel® Core™2 Quad processors Q8200  Added Intel® Core™2 Quad processors Q8300  Added Intel® Core™2 Quad processor Q9000S and
  • Intel Q9450 | Design Guidelines - Page 10
    10 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 11
    the Intel® Core™2 Extreme quad-core processor QX6000 series, Intel® Core™2 Quad processor Q6000 series, Intel® Core™2 Quad processor Q9000 and Q8000series, and Intel® Core™2 Extreme processor QX9650. The concepts given in this document are applicable to any system form factor. Specific examples
  • Intel Q9450 | Design Guidelines - Page 12
    Q9400S  Intel® Core™2 Quad processor Q8000S series at 65 W applies to the Intel® Core™2 Quad processors Q8200S and Q8400S In this document when a reference is made to "the processor" it is intended that this includes all the processors supported by this document. If needed for clarity, the specific
  • Intel Q9450 | Design Guidelines - Page 13
    Series and Intel® Core™2 Quad Processor Q9000, Q9000S, Q8000, and Q8000SSeries Datasheet Intel® Core™2 Duo Processor E8000 and E7000 Series and Intel® Pentium® Dual-Core Processor E5000 Series Thermal and Mechanical Design Guide LGA775 Socket Mechanical Design Guide Fan Specification for 4-wire
  • Intel Q9450 | Design Guidelines - Page 14
    use the PWM duty cycle % from the fan speed controller to modulate the fan speed. The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink. The case temperature of the
  • Intel Q9450 | Design Guidelines - Page 15
    factory specifications. Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink. Thermal Module Assembly. The heatsink, fan and
  • Intel Q9450 | Design Guidelines - Page 16
    Introduction 16 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 17
    socket. Refer to the datasheet for detailed mechanical specifications. The processor connects to the motherboard through a land grid processor datasheet supersedes dimensions provided in this document. Figure 1. Package IHS Load Areas Substrate Top Surface of IHS to install a heatsink IHS Step
  • Intel Q9450 | Design Guidelines - Page 18
    described in LGA775 Socket Mechanical Design Guide. The load from the load plate is distributed across two sides of the package onto a step on each side of the IHS material between the heatsink base and the IHS, it should not exceed the corresponding specification given in the processor datasheet. 
  • Intel Q9450 | Design Guidelines - Page 19
    by the LGA775 socket load plate (refer to the LGA775 Socket Mechanical Design Guide for further information). 2.1.2.2 Heatsink Clip Load Requirement The attach mechanism for the heatsink developed to support the processor should create a static preload on the package between 18 lbf and 70 lbf
  • Intel Q9450 | Design Guidelines - Page 20
    heatsink attach mechanism must comply with the package specifications described in the processor datasheet. One of the key design parameters is the height of the top surface of the processor reflow, given in the LGA775 Socket Mechanical Design Guide with its tolerances  The height of the
  • Intel Q9450 | Design Guidelines - Page 21
    Advantaged Chassis thermal and mechanical requirements. For ATX platforms using the Intel® Core™2 Quad processor Q6000 series at 105 W, an active air-cooled design in an ATX Chassis, with a fan installed at the top of the heatsink equivalent to the RCBFH-3 reference design (see the document of
  • Intel Q9450 | Design Guidelines - Page 22
    Thermal/Mechanical Information For ATX platforms using the Intel® Core™2 Quad processor Q6000 series at 95 W, an active air-cooled design, assumed be used in ATX Chassis, with a fan installed at the top of the heatsink equivalent to the D60188-001 reference design (see Chapter 5) should be designed
  • Intel Q9450 | Design Guidelines - Page 23
    fan speed is being controlled by the digital thermal sensor. The TCONTROL parameter defines a very specific processor operating region where fan vs. RPM and RPM vs. Acoustics (dBA) performance curves from the Intel enabled thermal solution. A thermal solution designed to meet the thermal profile
  • Intel Q9450 | Design Guidelines - Page 24
    the register and calculating TCONTROL. See Chapter 6 Intel® Quiet System Technology (Intel® QST) for details on implementing a design using TCONTROL and the Thermal Profile. Heatsink Design Considerations To remove the heat from the processor, three basic parameters should be considered:  The
  • Intel Q9450 | Design Guidelines - Page 25
    guide.  The motherboard primary side height constraints defined in the ATX Specification V2.2 and the microATX Motherboard Interface Specification the fan and the heatsink only. The attach mechanism (clip, fasteners, etc.) are not included. The mass limit for BTX heatsinks that use Intel reference
  • Intel Q9450 | Design Guidelines - Page 26
    Processor Thermal/Mechanical Information reviewed in depth in the Balanced Technology Extended (BTX) System Design Guide v1.0. Note: The 550g mass limit for ATX solutions is based on the capabilities of the reference design components that retain the heatsink to the board and apply the necessary
  • Intel Q9450 | Design Guidelines - Page 27
    of Intel® Boxed Processor thermal solutions Type Boxed Processor Heatsink for Intel® Core™2 Extreme quad-core processor QX6000 series at the 775_VR_CONFIG_05B, Intel® Core™2 Quad processor Q6000 series, Intel® Core™2 Extreme processor QX9000 series, and Intel® Core™2 Quad processor Q9000
  • Intel Q9450 | Design Guidelines - Page 28
    2.5 Processor Thermal/Mechanical Information ATX Thermal Design Suggestions or microATX Thermal Design Suggestions or Balanced Technology Extended (BTX) System Design Guide v1.0 documents available on the http://www.formfactors.org/ web site. In addition to passive heatsinks, fan heatsinks and
  • Intel Q9450 | Design Guidelines - Page 29
    thermal characterization parameter value (CA) is used as a measure of the thermal performance of the overall thermal solution that is attached to the processor package. It is defined by the following equation, and measured in units of °C/W: CA = (TC - TA) / PD (Equation 1) Where: CA TC TA PD
  • Intel Q9450 | Design Guidelines - Page 30
    on the air velocity through the fins of the heatsink. Figure 4 illustrates the combination of the different thermal characterization parameters. Figure 4. Processor Thermal Characterization Parameter Relationships TA Heatsink TIM IHS Processor CA TS TC LGA775 Socket System Board 30 Thermal
  • Intel Q9450 | Design Guidelines - Page 31
    numbers used here are not related to any specific Intel processor thermal specifications, and are for illustrative purposes only. Assume - 38) / 100 = 0.29 °C/W To determine the required heatsink performance, a heatsink solution provider would need to determine CS performance for the selected TIM
  • Intel Q9450 | Design Guidelines - Page 32
    is the temperature of the ambient air surrounding the processor. For a passive heatsink, TA is defined as the heatsink approach air temperature; for an actively cooled heatsink, it is the temperature of inlet air to the active cooling fan. It is worthwhile to determine the local ambient temperature
  • Intel Q9450 | Design Guidelines - Page 33
    Thermal Metrology Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink NOTE: Drawing Not to Scale Figure 6. Locations for Measuring Local Ambient Temperature, Passive Heatsink NOTE: Drawing Not to Scale Thermal and Mechanical Design Guidelines 33
  • Intel Q9450 | Design Guidelines - Page 34
    , or by contact between the thermocouple cement and the heatsink base. Appendix D defines a reference procedure for attaching a thermocouple to the IHS of a 775-Land LGA processor package for TC measurement. This procedure takes into account the specific features of the 775-Land LGA package and of
  • Intel Q9450 | Design Guidelines - Page 35
    there are numerous ways to reduce the power consumption of a processor, and Intel is aggressively pursuing low power design techniques. For example, cost, by allowing thermal designs to target TDP. The processor also supports an additional power reduction capability known as Thermal Monitor
  • Intel Q9450 | Design Guidelines - Page 36
    As an output, PROCHOT# will go active when the processor temperature of either core reaches the TCC activation temperature. This indicates the TCC has processor clocks off and then back on with a predetermined duty cycle. The duty cycle is processor specific, and is fixed for a particular processor
  • Intel Q9450 | Design Guidelines - Page 37
    must support VID transitions in order to support TM2. During the voltage change, it will be necessary to transition through multiple VID codes to reach the target operating voltage. Each step will be one VID table entry (i.e., 12.5 mV steps). The processor continues to execute instructions during
  • Intel Q9450 | Design Guidelines - Page 38
    the BIOS setting a bit in an MSR (model specific register). Enabling the Thermal Control Circuit allows the processor to attempt to maintain a safe operating temperature without interrupt which would initiate an OEM supplied interrupt service routine. 38 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 39
    processor. The power reduction mechanism of thermal monitor can also be activated manually steps Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for all processors processor datasheet. A system designed to meet the thermal profile specification published in the processor
  • Intel Q9450 | Design Guidelines - Page 40
    under normal operating conditions. Systems that do not meet these specifications could be subject to more frequent activation of the thermal control regarding THERMTRIP#, refer to the processor datasheet and to Section 4.2.7 of this thermal design guide. Operating System and Application Software
  • Intel Q9450 | Design Guidelines - Page 41
    set on a per-part basis there is no need for the health monitor components to be updated at each processor family. The processor uses the Digital Thermal Sensor (DTS) as the on-die sensor to use for fan speed control (FSC). The DTS replaces the on-die thermal diode used in previous product. The
  • Intel Q9450 | Design Guidelines - Page 42
    is a proprietary single wire bus between the processor and the chipset or other health monitoring device. Intel® Quiet System Technology (Intel® QST), see Chapter 6 and the Intel® Quiet System Technology (Intel® QST) Configuration and Tuning Manual. Intel has worked with many vendors that provide fan
  • Intel Q9450 | Design Guidelines - Page 43
    active air-cooled design, with a fan installed at the top of the heatsink. The thermal technology required for the processor. The Intel® Core™2 Extreme quad-core processor QX6000 series at the 775_VR_CONFIG_05B and Intel® Core™2 Extreme processor QX9000 series require a thermal solution equivalent
  • Intel Q9450 | Design Guidelines - Page 44
    of an acoustic improvement to reduce the fan speed to show the acoustic advantage (its acoustic results are shown in the Table 6). Note: If the heatsink design is used in the Intel® Core™2 Quad processor Q6000 series at 95 W and Intel® Core™2 Quad processor Q9000 and Q8000 series at 95 W for
  • Intel Q9450 | Design Guidelines - Page 45
    energized fan by the user during user servicing. 5.2 Validation Results for Reference Design 5.2.1 Heatsink Performance Table 3 provides the RCFH-4 heatsink performance for the 775_VR_CONFIG 05B processors. Table 4 provides the D60188-001 heatsink performance for the Intel® Core™2 Quad processor
  • Intel Q9450 | Design Guidelines - Page 46
    Intel® Core™2 Quad processor Q9000 and Q8000 series at 95 W Target Thermal Performance, ca (Mean + 3) 0.33 C/W TA Assumption TA = 40 C NOTES: 1. Performance targets (Ψ ca) as measured with a live processor at TDP. Notes 1 5.2.2 Acoustics To optimize acoustic emission by the fan heatsink
  • Intel Q9450 | Design Guidelines - Page 47
    fan speed to support the processor thermal profile, additional acoustic improvements can be achieved at lower processor workload by using the TCONTROL specifications described in Section 2.2.3. Intel recommendation is to use the Fan Specification for 4 Wire PWM Controlled Fans to implement fan
  • Intel Q9450 | Design Guidelines - Page 48
    Intel® Thermal/Mechanical Reference Design Information 5.2.5 Fan Performance for Active Heatsink Thermal Solution The fan power requirements for proper operation are given Table 7. Table 7. Fan Electrical Performance Requirements Requirement Maximum Average fan current draw Fan start-up current
  • Intel Q9450 | Design Guidelines - Page 49
    Intel® Thermal/Mechanical Reference Design Information 5.3 Environmental Reliability Testing 5.3.1 Structural Reliability Testing Structural reliability tests consist of unpackaged, board-level vibration and shock tests of a given
  • Intel Q9450 | Design Guidelines - Page 50
    Intel® Thermal/Mechanical Reference Design Information heatsink or heatsink attach mechanism. 5. No visible physical damage to the processor package. 6. Successful BIOS/Processor/memory test of post-test samples. 7. Thermal compliance testing to demonstrate that the case temperature specification
  • Intel Q9450 | Design Guidelines - Page 51
    Intel® Thermal/Mechanical Reference Design Information 5.3.2 5.3.3 5.4 Power Cycling Thermal performance thermal profile at TDP. Thermal Test Vehicle is used for this test. Recommended BIOS/Processor/Memory Test Procedures This test is to ensure proper operation of the product before and
  • Intel Q9450 | Design Guidelines - Page 52
    and 5.2.4). This allows for appropriate fan inlet airflow to ensure fan performance, and therefore overall cooling solution performance. This is compliant with the recommendations found in both ATX Specification V2.2 and microATX Motherboard Interface Specification V1.2 documents. Figure 61 through
  • Intel Q9450 | Design Guidelines - Page 53
    a high clip stiffness that resists local board curvature under the heatsink, and minimizes, in particular, upward board deflection (Figure 15 design is 191.3 N ± 44.5 N [43 lb ± 10 lb]. Note: Intel reserves the right to make changes and modifications to the design as necessary to the reference
  • Intel Q9450 | Design Guidelines - Page 54
    Intel® attach mechanism consists of:  A metal attach clip that interfaces with the heatsink core, see Appendix F Figure 66 and Figure 67 for the component drawings.  the reference attach mechanism (clip and fasteners) include:  Heatsink/fan mass ≤ 550 g (i.e., total assembly mass, including clip
  • Intel Q9450 | Design Guidelines - Page 55
    Intel® Thermal/Mechanical Reference Design Information Figure 17. Critical Parameters for Interfacing to Reference Clip Fan Fin Array Core See Detail A Clip Fin Array Clip 1.6 mm Core Detail A Figure 18. Critical Core Dimension 1.00 +/- 0.10 mm 1.00 mm min 38.68 +/- 0.30 mm 36.14 +/-
  • Intel Q9450 | Design Guidelines - Page 56
    Intel® Thermal/Mechanical Reference Design Information 56 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 57
    the Intel QST in the ME consult the Intel® Quiet System Technology (Intel® QST) Configuration and Tuning Manual. Intel® Quiet System Technology Algorithm The objective of Intel QST is to minimize the system acoustics by more closely controlling the thermal sensors to the corresponding processor or
  • Intel Q9450 | Design Guidelines - Page 58
    processor heatsink fan and a 2nd fan in the system. By placing a factor in this matrix additional the Intel QST could command the processor thermal solution fan and this 2nd fan , the algorithm will instruct the fan to speed up gradually, but will not abruptly increase the fan speed to respond to
  • Intel Q9450 | Design Guidelines - Page 59
    Fan Speed RPM For a PID algorithm to work, limit temperatures are assigned for each temperature sensor. For Intel QST, the TCONTROL for the processor gain  Kd = derivative gain The Intel® Quiet System Technology (Intel® QST) Configuration and Tuning Manual provides initial values for the each of
  • Intel Q9450 | Design Guidelines - Page 60
    QST Firmware  SST-based thermal sensors to provide board thermal data for Intel QST algorithms  Intel QST firmware Figure 21. Intel® Quiet System Technology Platform Requirements Processor Intel® (G)MCH MMEE DRAM DRAM Intel® ICH8 Controller Link FSC Control SPI SPI Flash SST Sensor Note
  • Intel Q9450 | Design Guidelines - Page 61
    a typical implementation that can support processors with digital thermal sensor or a thermal diode. In this configuration a SST Thermal Sensor has been added to read the on-die thermal diode that is in all of the processors in the 775-land LGA packages shipped before the Intel® Core™2 Duo. With the
  • Intel Q9450 | Design Guidelines - Page 62
    to meet the thermal profile of the processor. Intel QST, by measuring the processor digital thermal sensor will command the fan to reduce speed below the VSF curve in response to processor workload. Conversely if the processor workload increases the FSC will command the fan via the PWM duty cycle to
  • Intel Q9450 | Design Guidelines - Page 63
    heatsink preload to protect against fatigue failure of socket solder joints. Solder ball tensile stress is originally created when, after inserting a processor Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design A.2.1 Heatsink Preload Requirement Limitations Heatsink
  • Intel Q9450 | Design Guidelines - Page 64
    . Height gauges and possibly dial gauges may also be used. Table 8. Board Deflection Configuration Definitions Configuration Parameter d_ref Processor + Socket load plate yes Heatsink no d_BOL yes yes d_EOL yes yes Parameter Name BOL deflection, no preload BOL deflection with preload EOL
  • Intel Q9450 | Design Guidelines - Page 65
    _BOL - d'_ref ≥ 0.09 mm and d_EOL' - d_ref' ≥ 0.15 mm NOTES: 1. The heatsink preload must remain within the static load limits defined in the processor datasheet at all times. 2. Board deflection should not exceed motherboard manufacturer specifications. Thermal and Mechanical Design Guidelines 65
  • Intel Q9450 | Design Guidelines - Page 66
    selected material and board manufacturing process. Check with your motherboard vendor.  Clip stiffness assumed constant - No creep. Using Figure 25, the heatsink preload at beginning of life is defined to comply with d_EOL - d_ref = 0.15 mm depending on clip stiffness assumption. Note that the
  • Intel Q9450 | Design Guidelines - Page 67
    Heatsink Preload Meeting Board Deflection Limit A.2.5 Additional Considerations Intel recommends heatsink preload must remain below the maximum load limit of the package at all times (Refer to processor datasheet) 2. Board deflection should not exceed motherboard manufacturer specifications
  • Intel Q9450 | Design Guidelines - Page 68
    lead to heatsink preloads exceeding package maximum load specification. For Intel will collaborate with vendors participating in its third party test house program to evaluate third party solutions. Vendor information is available in Intel® Core™2 Quad Processor Support Components webpage www.intel
  • Intel Q9450 | Design Guidelines - Page 69
    Intel. Intel is continuously exploring new ways to improve metrology. Updates will be provided later as this document is revised as appropriate. B.2 Test Preparation B.2.1 Heatsink the load cells in place during the heatsink installation on the processor and motherboard (Refer to Figure 27).
  • Intel Q9450 | Design Guidelines - Page 70
    sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results. An alternate method to the load cells are just flush with the heat sink base  Then machine back the heatsink base by around 0.25 mm [0.01"], so that the load cell tips protrude beyond the
  • Intel Q9450 | Design Guidelines - Page 71
    of selected load cell Wax to maintain load cell in position during heatsink installation Load cell protrusion (Note: to be optimized depending on assembly stiffness) Figure 28. Preload Test Configuration Preload Fixture (copper core with milled out pocket) Load Cells (3x) Thermal and Mechanical
  • Intel Q9450 | Design Guidelines - Page 72
    Load Metrology B.2.2 Typical Test Equipment For the heatsink clip load measurement, use equivalent test equipment to used in mechanical shock and vibration testing. Any mechanical device used along with the heatsink attach mechanism will need to be included in the test setup (i.e., back plate,
  • Intel Q9450 | Design Guidelines - Page 73
    must be included, as the goal of the test is to measure the load provided by the actual heatsink mechanism. 2. Install relevant test vehicle (TTV, processor) in the socket 3. Assemble the heatsink reworked with the load cells to motherboard as shown for the reference design example in Figure 28, and
  • Intel Q9450 | Design Guidelines - Page 74
    Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 75
    of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area drop is across the interface and the more efficient the thermal solution (heatsink, fan) must be to achieve the desired cooling. The wetting or filling
  • Intel Q9450 | Design Guidelines - Page 76
    Thermal Interface Management § 76 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 77
    -land LGA package for TC measurement. This procedure takes into account the specific features of the 775-land LGA package and of the LGA775 socket for CD-ROM is available that shows the process in real time. Supporting Test Equipment To apply the reference thermocouple attach procedure, it is
  • Intel Q9450 | Design Guidelines - Page 78
    to follow company standard procedures and wear safety items like glasses for cutting the IHS and gloves for chemical handling. 2. Ask your Intel field sales representative if you need assistance to groove and/or install a thermocouple according to the reference process. Thermal and Mechanical Design
  • Intel Q9450 | Design Guidelines - Page 79
    the thermocouple wire to be routed under the socket lid. This will protect the thermocouple from getting damaged or pinched when removing and installing the heatsink (see Figure 55). Thermal and Mechanical Design Guidelines 79
  • Intel Q9450 | Design Guidelines - Page 80
    Case Temperature Reference Metrology Figure 30. 775-LAND LGA Package Reference Groove Drawing at 6 o'clock Exit 80 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 81
    Case Temperature Reference Metrology Figure 31. 775-LAND LGA Package Reference Groove Drawing at 3 o'clock Exit (Old Drawing) Thermal and Mechanical Design Guidelines 81
  • Intel Q9450 | Design Guidelines - Page 82
  • Intel Q9450 | Design Guidelines - Page 83
    at 6 o'clock Exit on the 775-LAND LGA Package IHS Groove Pin1 indicator When the processor is installed in the LGA775 socket, the groove is parallel to the socket load lever, parts for compliance to specifications before accepting from machine shop. Thermal and Mechanical Design Guidelines 83
  • Intel Q9450 | Design Guidelines - Page 84
    heater, as it can take up to 30 minutes to reach the target temperature of 153 - 155 °C. Note: To avoid damage to the TTV or processor ensure the IHS temperature does not exceed 155 °C. As a complement to the written procedure a video Thermocouple Attach Using Solder - Video CD-ROM is available
  • Intel Q9450 | Design Guidelines - Page 85
    Case Temperature Reference Metrology Figure 35. Bending the Tip of the Thermocouple D.5.2 Thermocouple Attachment to the IHS 6. Clean groove and IHS with Isopropyl Alcohol (IPA) and a lint free cloth removing all residues prior to thermocouple attachment. 7. Place the thermocouple wire inside the
  • Intel Q9450 | Design Guidelines - Page 86
    37. Thermocouple Bead Placement (A) (B) 10. Place the package under the microscope to continue with process. It is also recommended to use a fixture (like processor tray or a plate) to help holding the unit in place for the rest of the attach process. 86 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 87
    to hold the wire inside the groove (see Figure 38). Refer to Figure 39 for detailed bead placement. Figure 38. Position Bead on the Groove Step Kapton* tape Wire section into the groove to prepare for final bead placement Figure 39. Detailed Thermocouple Bead Placement TC Wire with Insulation IHS
  • Intel Q9450 | Design Guidelines - Page 88
    Metrology 12. Place a 3rd piece of tape at the end of the step in the groove as shown in Figure 40. This tape will create This should be the same value as measured during the thermocouple conditioning step D.5.1.step 3 (see Figure 41) Figure 41. Measuring Resistance between Thermocouple and
  • Intel Q9450 | Design Guidelines - Page 89
    Metrology 14. Using a fine point device, place a small amount of flux on the thermocouple bead. Be careful not to move the thermocouple bead during this step (see Figure 42). Ensure the flux remains in the bead area only. Figure 42. Applying Flux to the Thermocouple Bead 15. Cut two small pieces
  • Intel Q9450 | Design Guidelines - Page 90
    Figure 44) Figure 44. Positioning Solder on IHS D.5.3 17. Measure the resistance from the thermocouple end wires again using the DMM (refer to Section D.5.1.step 2) to ensure the bead is still properly contacting the IHS. Solder Process 18. Make sure the thermocouple that monitors the Solder Block
  • Intel Q9450 | Design Guidelines - Page 91
    to get a better view when the solder begins to melt. 23. Lower the Heater block onto the IHS. Monitor the device IHS temperature during this step to ensure the maximum IHS temperature is not exceeded. Note: The target IHS temperature during reflow is 150 °C ±3 °C. At no time should the IHS
  • Intel Q9450 | Design Guidelines - Page 92
    Case Temperature Reference Metrology 24. You may need to move the solder back toward the groove as the IHS begins to heat. Use a fine tip tweezers to push the solder into the end of the groove until a solder ball is built up (see Figure 46 and Figure 47). Figure 46. View Through Lens at Solder
  • Intel Q9450 | Design Guidelines - Page 93
    the device IHS temperature with a handheld meter until it drops below 50° C before moving it to the microscope for the final steps. D.5.4 Cleaning and Completion of Thermocouple Installation 27. Remove the device from the solder station and continue to monitor IHS Temperature with a handheld
  • Intel Q9450 | Design Guidelines - Page 94
    Figure 49. Thermocouple Placed into Groove Case Temperature Reference Metrology 29. Using a blade carefully shave the excess solder above the IHS surface. Only shave in one direction until solder is flush with the groove surface (see Figure 50). Figure 50. Removing Excess Solder Note: Take usual
  • Intel Q9450 | Design Guidelines - Page 95
    Case Temperature Reference Metrology Figure 51. Filling Groove with Adhesive 32. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive and let it set for a couple of minutes (see Figure 52). Figure 52. Application of Accelerant Figure 53. Removing Excess Adhesive from
  • Intel Q9450 | Design Guidelines - Page 96
    the IHS. Note: The adhesive shaving step should be performed while the adhesive is use. D.6 Thermocouple Wire Management When installing the processor into the socket, the thermocouple wire should route or pinched when removing and installing the heatsink. Note: When thermocouple wires are damaged,
  • Intel Q9450 | Design Guidelines - Page 97
    Case Temperature Reference Metrology Figure 55. Thermocouple Wire Management § Thermal and Mechanical Design Guidelines 97
  • Intel Q9450 | Design Guidelines - Page 98
    Case Temperature Reference Metrology 98 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 99
    Fan Speed Control (FSC) circuit input for the Thermal Module Assembly (TMA) fan is from the processor diode then the fan with the component temperature specifications at all operating conditions and located in the exhaust airflow from the chipset heatsink is a reasonable location. It is likely
  • Intel Q9450 | Design Guidelines - Page 100
    thermal sensor location and elevation are reflected in the Flotherm thermal model airflow illustration and pictures (see Figure 56 and Figure 57).The Intel Boxed Boards in BTX form factor have implemented a System Monitor thermal sensor. The following thermal sensor or its equivalent can be used for
  • Intel Q9450 | Design Guidelines - Page 101
    Balanced Technology Extended (BTX) System Thermal Considerations Figure 57. Thermal Sensor Location Illustration Thermal Sensor TMA Airflow MCH Heatsink § Thermal and Mechanical Design Guidelines 101
  • Intel Q9450 | Design Guidelines - Page 102
    Balanced Technology Extended (BTX) System Thermal Considerations 102 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 103
    mechanical enabling components for the processor. Note: Intel reserves the right to make Intel® RCFH4 Reference Solution Assembly Intel® RCFH4 Reference Solution Assembly - Page 2 Figure 74. Intel® D60188-001 Reference Solution Assembly Figure 75. Intel® D60188-001 Reference Solution Heatsink
  • Intel Q9450 | Design Guidelines - Page 104
    00 36.78 41.00 45.26 47.50 ( 19.13 ) SOCKET BALL 1 PACKAGE BOUNDARY NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2 GEOMETRIC CENTER OF CPU PACKAGE / SOCKET HOUSING CAVITY. 3. BOARD COMPONENET KEEP-INS AND MECHANICAL COMPONENET KEEP-OUTS TO BE UTILIZED WITH SUFFICIENT ALLOWANCES FOR PLACEMENT AND SIZE
  • Intel Q9450 | Design Guidelines - Page 105
    THE PRI 6 5 DISCLOSED IN CONFIDENCE AND ITS CONT ENTS OR WRITTEN CONSENT OF INTEL CORPORAT ION. BOARD SECONDARY SIDE D 4X 6.00 4X 10.00 4 COMPONENT VOLUMETRIC KEEP-INS SOCKET BALL 1 SOCKET & PROCESSOR VOLUMETRIC KEEP-IN OUTLINE 3 DWG. NO C40819 SHT. 2 REV 3 1 D ROUTING KEEP-OUTS
  • Intel Q9450 | Design Guidelines - Page 106
    DISCLOSED IN CONFIDENCE AND ITS CONT ENTS OR WRITTEN CONSENT OF INTEL CORPORAT ION. 2X SOCKET & PROCESSOR VOLUMETRIC KEEP-IN 45 X 3.00 29.00 R49.44 REV 3 1 ( 37.60 ) 14.60 6.60 SOCKET HOUSING 1 D CAVITY (CPU PACKAGE) ( 16.87 ) LEVER MOTION SPACE REQUIRED TO RELEASE SOCKET LOAD PLACE (
  • Intel Q9450 | Design Guidelines - Page 107
    Mechanical Drawings Figure 61. Balanced Technology Extended (BTX) Thermal Module Keep Out Volumetric - Sheet 1 Thermal and Mechanical Design Guidelines 107
  • Intel Q9450 | Design Guidelines - Page 108
    Figure 62. Balanced Technology Extended (BTX) Thermal Module Keep Out Volumetric - Sheet 2 Mechanical Drawings 108 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 109
    Mechanical Drawings Figure 63. Balanced Technology Extended (BTX) Thermal Module Keep Out Volumetric - Sheet 3 Thermal and Mechanical Design Guidelines 109
  • Intel Q9450 | Design Guidelines - Page 110
    Figure 64. Balanced Technology Extended (BTX) Thermal Module Keep Out Volumetric - Sheet 4 Mechanical Drawings 110 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 111
    Mechanical Drawings Figure 65. Balanced Technology Extended (BTX) Thermal Module Keep Out Volumetric - Sheet 5 Thermal and Mechanical Design Guidelines 111
  • Intel Q9450 | Design Guidelines - Page 112
    ANGLE PROJECTION DEPARTMENT TMD TITLE R 2200 MISSION COLLEGE BLVD. CORP. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 RCFH4 HS CLIP, 35mm core SIZE DRAWING NUMBER A1 C85609 REV A B SCALE: NONE DO NOT SCALE DRAWING SHEET 1 OF 2 8 7 6 5 4 3 2 1 112 Thermal and Mechanical Design
  • Intel Q9450 | Design Guidelines - Page 113
    Mechanical Drawings Figure 67. ATX Reference Clip - Sheet 2 8 7 6 5 H 4 3 2 DWG. NO C85609 SHT. 2 REV 0 H G F 5.3 [ .209 ] E D C B A 135 7.31 [ .288 ] G 2X R0.5 [ .020 ] 1.65 [ .065 ] 1.06 [ .042 ] 45 X 0.45 0.05 8 [ .018 .001 ] F R0.3 TYP [ .012 ] SECTION D-D 2X R3.6 [ .142
  • Intel Q9450 | Design Guidelines - Page 114
    Figure 68. Reference Fastener - Sheet 1 Mechanical Drawings 114 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 115
    Mechanical Drawings Figure 69. Reference Fastener - Sheet 2 Thermal and Mechanical Design Guidelines 115
  • Intel Q9450 | Design Guidelines - Page 116
    Figure 70. Reference Fastener - Sheet 3 Mechanical Drawings 116 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 117
    Mechanical Drawings Figure 71. Reference Fastener - Sheet 4 Thermal and Mechanical Design Guidelines 117
  • Intel Q9450 | Design Guidelines - Page 118
    Intel® RCFH4 Reference Solution Assembly ( 95 ) [ 3.740 ] ( 90 ) [ 3.543 ] ( 120 ) [ 4.7 ] ( 65.42 ) [ 2.576 ] ( 62.9 ) [ 2.476 ] NOTES: 1. FOR DETAILED SPECIFICATIONS PROJECTION RCH4,HS,CLIP,CORE,FASTENERS RCH4,FAN ASSEMBLY RCFH4,GUARD,WIRE PRESCOTT FMB2 FAN ATTACH RCFH4,MAIN ASSEMBLY
  • Intel Q9450 | Design Guidelines - Page 119
    Intel® RCFH4 Reference Solution Assembly - Page 2 2 ASSEMBLY/INSTALLATION PROCESS RECOMMENDATIONS 1 FAN ATTACH INSTALLATION: INSERT FAN SIMUTANIOUSLY SPREAD REMAINING FANGUARD LEGS TO CLEAR FAN AND EXTRUSION AND ROTATE GUARD TO ENGUAGE REMAINING CUTS IN HEATSINK. 4 CRITICAL TO FUNCTION. 2
  • Intel Q9450 | Design Guidelines - Page 120
    Figure 74. Intel® D60188-001 Reference Solution Assembly Mechanical Drawings 120 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 121
    Mechanical Drawings Figure 75. Intel® D60188-001 Reference Solution Heatsink § Thermal and Mechanical Design Guidelines 121
  • Intel Q9450 | Design Guidelines - Page 122
    Mechanical Drawings 122 Thermal and Mechanical Design Guidelines
  • Intel Q9450 | Design Guidelines - Page 123
    * ITW Fastex* Part Description Intel® RCFH-4 Reference Heatsink Intel® RCFH-4 Reference Heatsink RCFH-4 Fan Assembly Fastener Part Number Contact listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding
  • Intel Q9450 | Design Guidelines - Page 124
    Phone Notes Mitac International Corp Support and Retention Module C54463-001 1 (ASIA Vital Components Co., Ltd) Module Fan Assembly 4 22996930 Extension: 619 AVC* Type II Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties
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Document Number:
315594-013
Intel
®
Core™2 Extreme Quad-
Core Processor and Intel
®
Core™2
Quad Processor
Thermal and Mechanical Design Guidelines
Supporting:
Intel
®
Core™2 Extreme quad-core processor QX6000
Δ
series at 775_VR_CONFIG_05B
Intel
®
Core™2 Quad processor Q6000
Δ
series at 105 W
Intel
®
Core™2 Quad processor Q6000
Δ
series at 95 W
Intel
®
Core™2 Extreme Processor QX9000
series at
775_VR_CONFIG_05B
Intel
®
Core™2 Quad processor Q9000
and Q9000S
series
Intel
®
Core™2 Quad processor Q8000
and Q8000S
series
August 2009