Intel Q9450 Design Guidelines - Page 26

Processor Thermal/Mechanical Information

26

Thermal and Mechanical Design Guidelines

reviewed in depth in the

Balanced Technology Extended (BTX) System Design Guide

v1.0.

Note:

The 550g mass limit for ATX solutions is based on the capabilities of the reference

design components that retain the heatsink to the board and apply the necessary

preload. Any reuse of the clip and fastener in derivative designs should not exceed

550g. ATX Designs that have a mass of greater than 550g should analyze the preload

as discussed in

Appendix A and retention limits of the fastener.

2.3.3

Package IHS Flatness

The package IHS flatness for the product is specified in the datasheet and can be used

as a baseline to predict heatsink performance during the design phase.

Intel recommends testing and validating heatsink performance in full mechanical

enabling configuration to capture any impact of IHS flatness change due to combined

socket and heatsink loading. While socket loading alone may increase the IHS

warpage, the heatsink preload redistributes the load on the package and improves the

resulting IHS flatness in the enabled state.

2.3.4

Thermal Interface Material

Thermal interface material application between the processor IHS and the heatsink

base is generally required to improve thermal conduction from the IHS to the

heatsink. Many thermal interface materials can be pre-applied to the heatsink base

prior to shipment from the heatsink supplier and allow direct heatsink attach, without

the need for a separate thermal interface material dispense or attach process in the

final assembly factory.

All thermal interface materials should be sized and positioned on the heatsink base in

a way that ensures the entire processor IHS area is covered. It is important to

compensate for heatsink-to-processor attach positional alignment when selecting the

proper thermal interface material size.

When pre-applied material is used, it is recommended to have a protective application

tape over it. This tape must be removed prior to heatsink installation.

Section	Page
1 Introduction	11
1.1 Document Goals and Scope	11
1.1.1 Importance of Thermal Management	11
1.1.2 Document Goals	11
1.1.3 Document Scope	12
1.2 References	13
1.3 Definition of Terms	14
2 Processor Thermal/Mechanical Information	17
2.1 Mechanical Requirements	17
2.1.1 Processor Package	17
2.1.2 Heatsink Attach	19
2.1.2.1 General Guidelines	19
2.1.2.2 Heatsink Clip Load Requirement	19
2.1.2.3 Additional Guidelines	20
2.2 Thermal Requirements	20
2.2.1 Processor Case Temperature	20
2.2.2 Thermal Profile	21
2.2.3 TCONTROL	23
2.3 Heatsink Design Considerations	24
2.3.1 Heatsink Size	25
2.3.2 Heatsink Mass	25
2.3.3 Package IHS Flatness	26
2.3.4 Thermal Interface Material	26
2.4 System Thermal Solution Considerations	27
2.4.1 Chassis Thermal Design Capabilities	27
2.4.2 Improving Chassis Thermal Performance	27
2.4.3 Summary	28
2.5 System Integration Considerations	28
3 Thermal Metrology	29
3.1 Characterizing Cooling Performance Requirements	29
3.1.1 Example	31
3.2 Processor Thermal Solution Performance Assessment	31
3.3 Local Ambient Temperature Measurement Guidelines	32
3.4 Processor Case Temperature Measurement Guidelines	34
4 Thermal Management Logic and Thermal Monitor Feature	35
4.1 Processor Power Dissipation	35
4.2 Thermal Monitor Implementation	35
4.2.1 PROCHOT# Signal	36
4.2.2 Thermal Control Circuit	36
4.2.2.1 Thermal Monitor	36
4.2.2.2 Thermal Monitor 2 (TM2)	37
4.2.3 Operation and Configuration	38
4.2.4 On-Demand Mode	39
4.2.5 System Considerations	39
4.2.6 Operating System and Application Software Considerations	40
4.2.7 THERMTRIP# Signal	40
4.2.8 Cooling System Failure Warning	40
4.2.9 Digital Thermal Sensor	41
4.2.10 Platform Environmental Control Interface (PECI)	42
5 Intel® Thermal/Mechanical Reference Design Information	43
5.1 ATX Reference Design Requirements	43
5.2 Validation Results for Reference Design	45
5.2.1 Heatsink Performance	45
5.2.2 Acoustics	46
5.2.3 Altitude	47
5.2.4 Reference Heatsink Thermal Validation	47
5.2.5 Fan Performance for Active Heatsink Thermal Solution	48
5.3 Environmental Reliability Testing	49
5.3.1 Structural Reliability Testing	49
5.3.1.1 Random Vibration Test Procedure	49
5.3.1.2 Shock Test Procedure	49
5.3.2 Power Cycling	51
5.3.3 Recommended BIOS/Processor/Memory Test Procedures	51
5.4 Material and Recycling Requirements	51
5.5 Safety Requirements	52
5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	52
5.7 Reference Attach Mechanism	53
5.7.1 Structural Design Strategy	53
5.7.2 Mechanical Interface to the Reference Attach Mechanism	54
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration and Tuning	62

Intel Q9450 Design Guidelines - Page 26

Package IHS Flatness, Thermal Interface Material - review

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