ASRock B560M Pro4 User Manual - Page 9
Specifications
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1.2 Specifications Platform CPU • Micro ATX Form Factor • Solid Capacitor design • Supports 10th Gen Intel® CoreTM Processors and 11th Gen Intel® CoreTM Processors (LGA1200) • Digi Power design • 8 Power Phase design • Supports Intel® Turbo Boost Max 3.0 Technology Chipset • Intel® B560 Memory • Dual Channel DDR4 Memory Technology • 4 x DDR4 DIMM Slots • 11th Gen Intel® CoreTM Processors support DDR4 non-ECC, un-buffered memory up to 4800+(OC)* • 10th Gen Intel® CoreTM Processors support DDR4 non-ECC, un-buffered memory up to 4600+(OC)* * 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 2933; CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666. * 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933; CoreTM (i5/i3), Pentium® and Celeron® support DDR4 up to 2666. * Please refer to Memory Support List on ASRock's website for more information. (http://www.asrock.com/) • Supports ECC UDIMM memory modules (operate in non- ECC mode) • Max. capacity of system memory: 128GB • Supports Intel® Extreme Memory Profile (XMP) 2.0 Expansion 11th Gen Intel® CoreTM Processors Slot • 2 x PCI Express x16 Slots (PCIE1/PCIE3: single at Gen4x16 (PCIE1); dual at Gen4x16 (PCIE1) / Gen3x4 (PCIE3)) 10th Gen Intel® CoreTM Processors • 2 x PCI Express x16 Slots (PCIE1/PCIE3: single at Gen3x16 (PCIE1); dual at Gen3x16 (PCIE1) / Gen3x4 (PCIE3)) * Supports NVMe SSD as boot disks • 1 x PCI Express 3.0 x1 Slot • Supports AMD Quad CrossFireXTM and CrossFireXTM • 1 x M.2 Socket (Key E), supports type 2230 WiFi/BT module and Intel® CNVi (Integrated WiFi/BT) 2 English