ASRock H670M Pro RS User Manual - Page 10
Specifications, English
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1.2 Specifications Platform CPU • Micro ATX Form Factor • Solid Capacitor design • Supports 12th Gen Intel® CoreTM Processors (LGA1700) • Digi Power design • 7 Power Phase design • Supports Intel® Hybrid Technology • Supports Intel® Turbo Boost Max 3.0 Technology Chipset • Intel® H670 Memory • Dual Channel DDR4 Memory Technology • 4 x DDR4 DIMM Slots • Supports DDR4 non-ECC, un-buffered memory up to 4800+(OC)* * Supports DDR4 3200 natively. * Please refer to Memory Support List on ASRock's website for more information. (http://www.asrock.com/) • Supports ECC UDIMM memory modules (operate in non- ECC mode) • Max. capacity of system memory: 128GB • Supports Intel® Extreme Memory Profile (XMP) 2.0 Expansion Slot • 2 x PCIe x16 Slots (PCIE1/PCIE3: single at Gen4x16 (PCIE1); dual at Gen4x16 (PCIE1) / Gen3x4 (PCIE3))* * Supports NVMe SSD as boot disks • 1 x PCIe Gen3x1 Slot • Supports AMD Quad CrossFireXTM and CrossFireXTM • 1 x M.2 Socket (Key E), supports type 2230 WiFi/BT PCIe WiFi module English Graphics • Intel® UHD Graphics Built-in Visuals and the VGA outputs can be supported only with processors which are GPU integrated. • Intel® Xe Graphics Architecture (Gen 12) • Dual graphics output: support HDMI and DisplayPort 1.4 ports by independent display controllers 2