Asus H61M-E H61M-E User's Manual - Page 13

Product introduction - intel h61 chipset

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Product introduction 1 1.1 Special features 1.1.1 Product highlights LGA1155 socket for Intel® 3rd/2nd Generation Core™ i7 / Core™ i5 / Core™ i3 / Pentium® / Celeron® Processors This motherboard supports the Intel® 3rd/2nd generation Core™ i7 / i5 / i3 / Pentium®/ Celeron® processors in the LGA1155 package, with iGPU, memory, and PCI Express controllers integrated to support onboard graphics out with dedicated chipsets, 2-channel (2 DIMMs) DDR3 memory, and 16 PCI Express 3.0/2.0 lanes. This provides great graphics performance. Intel® 3rd/2nd generation Core™ i7 / i5 / i3 / Pentium® / Celeron® processors are among the most powerful and energy efficient CPUs in the world. Intel® H61 Express Chipset The Intel® H61 Express Chipset is the latest single-chipset design to support the new 1155 socket Intel® 3rd/2nd Generation Core™ i7 / Core™ i5 / Core™ i3 / Pentium® / Celeron® processors. It provides improved performance by utilizing serial point-to-point links, which allows increased bandwidth and stability. Dual-Channel DDR3 2200 (O.C.) / 2133 (O.C.) / 2000 (O.C.) / 1866 (O.C.) / 1600 / 1333 / 1066 MHz support The motherboard supports DDR3 memory that features data transfer rates of 2200 (O.C.)/ 2133 (O.C.) / 2000 (O.C.) / 1866 (O.C.) / 1600 / 1333 / 1066 MHz to meet the higher bandwidth requirements of the latest 3D graphics, multimedia, and Internet applications. The dual-channel DDR3 architecture enlarges the bandwidth of your system memory to boost system performance. * DDR3 1600 MHz and higher memory frequency is supported by Intel® 3rd generation processors. ** Due to the CPU behavior, DDR3 2400/2133/1866/1333/1066 memory modules runs at DDR3 2200/2100/1800/1300/1000 MHz frequencies. PCI Express® 3.0 PCI Express® 3.0 (PCIe 3.0) is the latest PCI Express bus standard with improved encoding schemes that provide twice the performance of the current PCIe 2.0. The total bandwidth for a x16 link reaches a maximum of 32Gb/s, double the 16 Gb/s of PCIe 2.0 (in x16 mode). As such, PCIe 3.0 provides users an unprecendented data speeds, combined with the convenience and seamless transition offerred by complete backward compatibility with PCIe 1.0 and PCIe 2.0 devices. PCIe 3.0 will become a must-have feature for users who wish to improve and optimize graphic performance, as well as have the latest technology available to them. * PCI 3.0 speed is supported by Intel® 3rd generation Core™ processors. ASUS H61M-E 1-1

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1.1
Special features
1.1.1
Product highlights
LGA1155 socket for Intel
®
3rd/2nd Generation Core™ i7 / Core™ i5 / Core™ i3
/ Pentium
®
/ Celeron
®
Processors
This motherboard supports the Intel
®
3rd/2nd generation Core™ i7 / i5 / i3 / Pentium
®
/
Celeron
®
processors in the LGA1155 package, with iGPU, memory, and PCI Express
controllers integrated to support onboard graphics out with dedicated chipsets, 2-channel
(2 DIMMs) DDR3 memory, and 16 PCI Express 3.0/2.0 lanes. This provides great graphics
performance. Intel
®
3rd/2nd generation Core™ i7 / i5 / i3 / Pentium
®
/ Celeron
®
processors
are among the most powerful and energy efficient CPUs in the world.
Intel
®
H61 Express Chipset
The Intel
®
H61 Express Chipset is the latest single-chipset design to support the new 1155
socket Intel
®
3rd/2nd Generation Core™ i7 / Core™ i5 / Core™ i3 / Pentium
®
/ Celeron
®
processors. It provides improved performance by utilizing serial point-to-point links, which
allows increased bandwidth and stability.
Dual-Channel DDR3 2200 (O.C.) / 2133 (O.C.) / 2000 (O.C.) / 1866 (O.C.) / 1600 /
1333 / 1066 MHz support
The motherboard supports DDR3 memory that features data transfer rates of 2200 (O.C.)/
2133 (O.C.) / 2000 (O.C.) / 1866 (O.C.) / 1600 / 1333 / 1066 MHz to meet the higher
bandwidth requirements of the latest 3D graphics, multimedia, and Internet applications. The
dual-channel DDR3 architecture enlarges the bandwidth of your system memory to boost
system performance.
*
DDR3 1600 MHz and higher memory frequency is supported by Intel
®
3rd generation processors.
** Due to the CPU behavior, DDR3 2400/2133/1866/1333/1066 memory modules runs at DDR3
2200/2100/1800/1300/1000 MHz frequencies.
PCI Express
®
3.0
PCI Express
®
3.0 (PCIe 3.0) is the latest PCI Express bus standard with improved encoding
schemes that provide twice the performance of the current PCIe 2.0. The total bandwidth
for a x16 link reaches a maximum of 32Gb/s, double the 16 Gb/s of PCIe 2.0 (in x16 mode).
As such, PCIe 3.0 provides users an unprecendented data speeds, combined with the
convenience and seamless transition offerred by complete backward compatibility with PCIe
1.0 and PCIe 2.0 devices. PCIe 3.0 will become a must-have feature for users who wish to
improve and optimize graphic performance, as well as have the latest technology available to
them.
* PCI 3.0 speed is supported by Intel
®
3rd generation Core™ processors.
Product introduction
1
ASUS H61M-E
1-1