Asus P8H61-M LX3 PLUS R2.0 P8H61-M LX3 PLUS R2.0 User's Manual - Page 8

P8H61-M LX3 R2.0 Series specifications summary CPU Chipset Memory Expansion slots Graphics Storage LAN Audio USB Other features LGA1155 socket for Intel® 3rd/2nd Generation Core™ i7 / Core™ i5 / Core™ i3 / Pentium® / Celeron® processors Supports Intel 22nm CPU Supports Intel® Turbo Boost Technology 2.0 * The Intel® Turbo Boost Technology 2.0 support depends on the CPU types. ** Refer to www.asus.com for Intel® CPU support list. Intel® H61 Express Chipset 2 x DIMMs, max. 16GB, DDR3 2200 (O.C.) / 2133 (O.C.) / 2000 (O.C.) / 1866 (O.C.) / 1600 / 1333 / 1066 MHz, non-ECC, unbuffered memory Dual-channel memory architecture * DDR3 1600 MHz and higher memory frequency is supported by Intel® 3rd generation processors. ** Refer to www.asus.com for the latest Memory QVL (Qualified Vendors List). *** W hen you install a total memory of 4GB capacity or more, Windows® 32-bit operating system may only recognize less than 3GB. We recommend a maximum of 3GB system memory if you are using a Windows® 32-bit operating system. 1 x PCI Express 3.0*/2.0 x16 slot with latch 2 x PCI Express 2.0 x1 slots * PCIe 3.0 speed is supported by Intel® 3rd generation Core™ processors. Supports D-Sub with max. resolution of 2048 x 1536 @75Hz Max. UMA Memory: 1748MB Intel® H61 Express Chipset: - 4 x Serial ATA 3.0 Gb/s connectors Realtek® 8111F PCIe Gigabit LAN controller VIA® VT1708S 8-channel* High Definition Audio CODEC - Supports Multi-Streaming * Use a chassis with HD audio module in the front panel to support an 8-channel audio output. 10 x USB 2.0/1.1 ports (6 ports at the mid-board, 4 ports at the back panel) 100% All High-quality Conductive Polymer Capacitors (P8H61-M LX3 PLUS R2.0 only) (continued on the next page) viii