Compaq Presario CQ35-200 Compaq Presario CQ35 Notebook PC - Maintenance and Se - Page 84
service them., and s of the heat sink
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Removal and replacement procedures ✎ The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board each time the fan/heat sink assembly is removed: ■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it. ■ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it. ■ Thermal pads are used on the other system board components 5 and sections of the heat sink 6 that service them. Replacement thermal material is included with all system board, fan/heat sink assembly, and processor spare part kits. Reverse this procedure to install the fan/heat sink assembly. 4-48 Maintenance and Service Guide
4–48
Maintenance and Service Guide
Removal and replacement procedures
✎
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system
board each time the fan/heat sink assembly is removed:
■
Thermal paste is used on the processor
1
and the heat sink section
2
that services it.
■
Thermal pads are used on the Northbridge chip
3
and the heat sink section
4
that services it.
■
Thermal pads are used on the other system board components
5
and sections of the heat sink
6
that
service them.
Replacement thermal material is included with all system board, fan/heat sink assembly, and processor spare
part kits.
Reverse this procedure to install the fan/heat sink assembly.