Dell PowerEdge C4140 EMC Technical Specifications - Page 12

Particulate and gaseous contamination specifications, Table 18. Configuration G

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Table 18. Configuration G CPU Power Dissipation / GPU Power (4x) 2x 70 W 2x 85 W 325 W 23 22 300 W 25 24 275 W 27 26 250 W 28 27 225 W 30 29 200 W 30 30 2x 105 W 20 22 23 25 27 29 2x 125 W 19 21 23 25 27 29 2x 130 W 18 21 23 25 27 29 2x 140 W 18 20 22 24 26 28 2x 150 W 2x 165 W 18 17 19 18 21 20 23 22 25 24 27 26 Table 19. Configuration K CPU Power Dissipation / NVLink SXM2 2x 70 W 300W 25 2x 85 W 24 2x 105 W 2x 125 W 22 21 2x 130 W 20 2x 140 W 19 2x 150 W 18 2x 165 W 18 Table 20. Configuration M CPU Power Dissipation / NVLink SXM2 2x 70 W 2x 85 W 300W 24 24 2x 105 W 23 2x 125 W 2x 130 W 23 22 2x 140 W 22 2x 150 W 20 2x 165 W 20 Particulate and gaseous contamination specifications The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer. Table 21. Particulate contamination specifications Particulate contamination Specifications Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have the MERV11 or MERV13 filtration. Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and non-data center environments. Corrosive dust • Air must be free of corrosive dust. • Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE: This condition applies to data center and non-data center environments. 12 Technical specifications

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Table 18. Configuration G
CPU Power
Dissipation /
GPU Power
(4x)
2x 70 W
2x 85 W
2x 105 W
2x 125 W
2x 130 W
2x 140 W
2x 150 W
2x 165 W
325 W
23
22
20
19
18
18
18
17
300 W
25
24
22
21
21
20
19
18
275 W
27
26
23
23
23
22
21
20
250 W
28
27
25
25
25
24
23
22
225 W
30
29
27
27
27
26
25
24
200 W
30
30
29
29
29
28
27
26
Table 19. Configuration K
CPU Power
Dissipation /
NVLink SXM2
2x 70 W
2x 85 W
2x 105 W
2x 125 W
2x 130 W
2x 140 W
2x 150 W
2x 165 W
300W
25
24
22
21
20
19
18
18
Table 20. Configuration M
CPU Power
Dissipation /
NVLink SXM2
2x 70 W
2x 85 W
2x 105 W
2x 125 W
2x 130 W
2x 140 W
2x 150 W
2x 165 W
300W
24
24
23
23
22
22
20
20
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If
the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to
rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 21. Particulate contamination specifications
Particulate contamination
Specifications
Air filtration
Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a
95% upper confidence limit.
NOTE:
This condition applies to data center environments only.
Air filtration requirements do not apply to IT equipment designed
to be used outside a data center, in environments such as an
office or factory floor.
NOTE:
Air entering the data center must have the MERV11 or
MERV13 filtration.
Conductive dust
Air must be free of conductive dust, zinc whiskers, or other conductive
particles.
NOTE:
This condition applies to data center and non-data center
environments.
Corrosive dust
Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less than
60% relative humidity.
NOTE:
This condition applies to data center and non-data center
environments.
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Technical specifications