Dell PowerEdge R750xa EMC Technical Specifications - Page 13

Particulate and gaseous contamination specifications, Table 21. Processor and heat sink matrix

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Table 21. Processor and heat sink matrix Heat sink 2U HPR HSK Processor TDP For all processor TDP Table 22. Thermal restriction matrix Configuration Minimum Front GPU TDP 70 W SW x 4 Front drives x1 SAS/SATA CPU TDP/ cTDP 105 W 120 W 135 W 150 W 165 W 185 W 205 W 220 W 250 W 270 W Typical 250 W DW x 4 x8 SAS/SATA Maximum 300 W DW x 4 x8 NVMe HPR GOLD fan with 2U HPR HSK Ambient temperature 35°C NOTE: Six fans are required for all the configurations. NOTE: T4 GPU card is supported on riser 2 (R2a slot 3/6) with maximum power loading. NOTE: Xeon(R) 8368Q supports only processor liquid cooling. NOTE: Only ASHRAE A2 category ambient temperature is supported. NOTE: For all memory configuration only HPR GOLD fan with 2U HPR HSK is used. NOTE: BPS DIMMs supported only at 30°C ambient temperature. NOTE: 128 GB LRDIMM, 64 GB RDIMM, 32 GB RDIMM, 16 GB RDIMM and 8 GB RDIMM supports at 35°C ambient temperature. Particulate and gaseous contamination specifications The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer. Table 23. Particulate contamination specifications Particulate contamination Specifications Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Technical specifications 13

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Table 21. Processor and heat sink matrix
Heat sink
Processor TDP
2U HPR HSK
For all processor TDP
Table 22. Thermal restriction matrix
Configuration
Minimum
Typical
Maximum
Ambient
temperature
Front GPU TDP
70 W SW x 4
250 W DW x 4
300 W DW x 4
Front drives
x1 SAS/SATA
x8 SAS/SATA
x8 NVMe
CPU TDP/
cTDP
105 W
HPR GOLD fan with 2U HPR HSK
35°C
120 W
135 W
150 W
165 W
185 W
205 W
220 W
250 W
270 W
NOTE:
Six fans are required for all the configurations.
NOTE:
T4 GPU card is supported on riser 2 (R2a slot 3/6) with maximum power loading.
NOTE:
Xeon(R) 8368Q supports only processor liquid cooling.
NOTE:
Only ASHRAE A2 category ambient temperature is supported.
NOTE:
For all memory configuration only HPR GOLD fan with 2U HPR HSK is used.
NOTE:
BPS DIMMs supported only at 30°C ambient temperature.
NOTE:
128 GB LRDIMM, 64 GB RDIMM, 32 GB RDIMM, 16 GB RDIMM and 8 GB RDIMM supports at 35°C ambient
temperature.
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous
contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage
or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of
the customer.
Table 23. Particulate contamination specifications
Particulate contamination
Specifications
Air filtration
Data center air filtration as defined by ISO Class 8 per ISO 14644-1
with a 95% upper confidence limit.
NOTE:
The ISO Class 8 condition applies to data center
environments only. This air filtration requirement does not apply
to IT equipment designed to be used outside a data center, in
environments such as an office or factory floor.
Technical specifications
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