Dell PowerEdge R750xa EMC Technical Specifications - Page 14
Table 23. Particulate contamination specifications continued
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Table 23. Particulate contamination specifications (continued) Particulate contamination Specifications NOTE: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and non-data center environments. Corrosive dust ● Air must be free of corrosive dust. ● Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE: This condition applies to data center and non-data center environments. Table 24. Gaseous contamination specifications Gaseous contamination Specifications Copper coupon corrosion rate
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Table 23. Particulate contamination specifications (continued)
Particulate contamination
Specifications
NOTE:
Air entering the data center must have MERV11 or MERV13
filtration.
Conductive dust
Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE:
This condition applies to data center and non-data center
environments.
Corrosive dust
●
Air must be free of corrosive dust.
●
Residual dust present in the air must have a deliquescent point less
than 60% relative humidity.
NOTE:
This condition applies to data center and non-data center
environments.
Table 24. Gaseous contamination specifications
Gaseous contamination
Specifications
Copper coupon corrosion rate
<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013.
Silver coupon corrosion rate
<200 Å/month as defined by ANSI/ISA71.04-2013.
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Technical specifications