HP ML150 HP ProLiant ML 150 G6 Processor Installation Card
HP ML150 - ProLiant - G6 Manual
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- HP ML150 | HP ProLiant ML 150 G6 Processor Installation Card - Page 1
refer to the documentation referenced on the HP ProLiant ML150 G6 Server Easy set-up CD . Kit contents • Processor • Processor heat-sink • System fan • Processor Option Kit Document Important safety information Read the installation instructions completely before beginning the installation procedure - HP ML150 | HP ProLiant ML 150 G6 Processor Installation Card - Page 2
-tighten heatsink mounting screws. Figure 5 Installing the heatsink assembly Figure 6-2 Install the system fan 18. Reinstall the air baffle. 19. Reinstall the access panel and tighten the thumbscrews. 20. Return the server to the upright position. 21. Connect the power cables to the power supplies
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HP ProLiant ML150
G6 Server
Processor Option kit
Installation Instructions
Legal notices
© Copyright 2009 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only
warranties for HP products and services are set forth in the express warranty
statements accompanying such products and services. Nothing herein should
be construed as constituting an additional warranty. HP shall not be liable for
technical or editorial errors or omissions contained herein.
Overview
This document contains instructions for installing the optional
Processor Option Kit in the HP ProLiant ML150 G6 Server.
For more information on preparing the server for installation, refer to
the documentation referenced on the HP ProLiant ML150 G6 Server
Easy set-up CD .
Kit contents
•
Processor
•
Processor heat-sink
•
System fan
•
Processor Option Kit Document
Important safety information
Read the installation instructions completely before beginning the
installation procedure. Refer to the document titled
Important Safety
Information
on the Easy set-up CD.
CAUTION:
Electrostatic discharge (ESD) can damage
electronic components. Be sure you are properly
grounded (earthed) before beginning an installation
procedure.
Installation guidelines
This installation is to be performed by qualified personnel who are
knowledgeable of the procedures, precautions, and hazards
associated with equipment containing hazardous energy circuits.
Figure 1
Chassis layout
Item
Description
1
Power supply unit
2
Processor 1
3
Processor 2
4
System board
5
Air baffle
Figure 2 System board
Item
Description
1
CPU 1
2
CPU 2
3
SYS FAN 1 J54
4
SYS FAN 2 J44 (Redundant)
5
SYS FAN 3 J38
Installing the Processor
1.
Back up the server data.
2.
Shut down the operating system (OS) in an orderly manner as
directed in the OS instructions.
3.
If the server is on, press the power button to power down the
server.
4.
Disconnect the power cord from the system chassis.
5.
If necessary, unlock the chassis.
6.
Release the rear thumbscrews and remove the access panel.
7.
Remove the air baffle by pulling up slightly on the four tabs to
release the baffle from the chassis and lift the air baffle away
from the system board and chassis.
Figure 3
Removing the air baffle
8.
Place the server on its side with the open side up.
9.
Press the load lever, and released from retention tab.
10.
Lift the load lever to a 135
°
angle, and lift load plate to a 100
°
angle.
11.
Remove cover from CPU socket
12.
Holding the processor by the edges, insert the processor into
the socket(2)
13.
Close the retention plate (
3
) and lower and engage the load
lever (
4
) to fully seat the processor.
Figure 4
Installing a processor
Part number 530773-001
March 2009 (First Edition)
If the heatsink is to be reused, carefully place the heatsink in a
position where the base (processor contact area) will not come in
contact with foreign matter.
Ensure that the processor is correctly positioned with the
orientation notch on the socket and that the pins are
aligned correctly with the socket holes (Figure 4,
1
).
After you install the processor, the heatsink must be
reinstalled on top of the processor socket. The thermal
grease applied on the contact surfaces of the processor
provides the necessary thermal bonding to allow the
heatsink to draw away heat from the processor.