HP ML150 HP ProLiant G6 Technology Overview - Page 6

Thermal Logic technologies HP is extending Thermal Logic technologies-originally offered on the HP BladeSystem-to all ProLiant ML, DL, and BL G6 servers. Thermal Logic technologies include Dynamic Power Capping, thermal sensors, and common slot power supplies. Together, these technologies double the power efficiency of ProLiant G6 servers compared to the previous generation of servers. Dynamic Power Capping Typically, processors are responsible for about one-third of the power consumed by a server, and indirectly drive the power use and heat generated by other server components. By controlling the processor's power use, you can control power use of the entire system. Dynamic Power Capping takes advantage of this processor-driven model and controls overall server power consumption using two separate mechanisms: changing the processor performance state (P-state) and throttling the processor clock. Dynamic Power Capping allows an administrator to set a maximum power consumption level for one or more ProLiant G6 servers. Then it monitors each server and uses P-states and/or clock throttling to limit processor power use and control overall system power use. If a server exceeds the power use cap set by the administrator, Dynamic Power Capping lowers the server's power use in a controlled manner, regardless of changes in the server workload or environment. If a server experiences a sudden increase in workload, Dynamic Power Capping can bring it back under its power cap in less than half a second, preventing any surge in power demand that could trip a typical data center circuit breaker.1 This allows an administrator to electrically provision a power distribution unit (PDU) or a rack to something less than the combined faceplate power rating of all the servers in the rack. The first step in power capping is to measure the server's power use with Systems Insight Manager or Insight Power Manager; however, only Insight Power Manager monitors server power over time. Administrators can then set individual power caps for servers using HP iLO Advanced or Insight Power Manager (IPM). Using IPM, administrators can also set power caps for groups of ProLiant ML and DL servers and for groups of BladeSystem enclosures. To set a power cap for an individual enclosure, the administrator can use the BladeSystem Onboard Administrator or IPM. To control the power use of a group of servers, IPM separately sums the minimum power use, the maximum power use, and power supply ratings of servers in the group. It then displays these three totals in a graphic user interface. The interface allows the administrator to apply a group power cap that is between the total minimum power use and the total power supply rating. Then IPM assigns each server a proportion of the total power. These individual power caps will remain in place until an administrator changes them through the HP iLO Advanced or IPM interfaces. It gets even better for the HP BladeSystem. Enclosure Dynamic Power Capping is a special implementation of Dynamic Power Capping designed specifically for HP BladeSystem enclosures. Enclosure Dynamic Power Capping monitors the workloads of the individual server blades and then reapportions the individual power caps of the servers after a predetermined monitoring cycle. This allows the busiest server blades to draw more of the total enclosure power. 'Sea of Sensors' In each ProLiant G6 server, up to 32 sensors monitor the internal server environment and make realtime adjustments to optimize power use. For example, the sensors can save power by adjusting fan speeds to prevent overcooling, and they can reduce power to unused I/O and memory sockets. Common Slot Power Supplies Many ProLiant G6 servers have common power slots that accommodate a range of power supplies. This new generation of universal, hot-pluggable power supplies reduces the number of spares and 1 Dynamic Power Capping has been designed and tested to ensure that it can prevent tripping circuit breakers that have a specified trip time of three seconds or longer at 50 degrees C and 150 percent overload. 6