HP ML150 HP ProLiant Intel-based 100-series G6 server technology - Page 1

HP ML150 - ProLiant - G6 Manual

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HP ProLiant 100-series Intel-based G6 server technology Technology brief, 3rd edition Abstract...3 Introduction...3 Intel Xeon 5500 Series processor technology 3 Multi-level caches ...4 QuickPath Interconnect controller ...4 Hyper Threading...5 Turbo Boost technology...5 Intel Xeon 3400 Series processor technology 6 Memory...8 DDR-3...8 DIMM Choices ...8 Memory Mirroring with DDR-3 ...10 Memory channel interleaving...10 Lockstep memory mode ...10 I/O technologies ...11 PCI Express technology...11 HP Smart Array and SAS/SATA technology 11 SAS-2 standard ...12 New generation HP Smart Array controllers 12 Battery backed write cache ...13 Zero Memory RAID...13 Software RAID ...13 Smart Array Advanced Pack ...13 Networking technologies ...14 Power and thermal technologies ...14 Efficient power delivery...14 Common Slot power supplies...15 Redundant power operation ...16 Voltage regulation ...16 Improved thermal sensors and fan control 16 Phase shedding ...16 Memory phase shedding...16 Dynamic CPU phase shedding ...17 Managing processor technologies...17 QuickPath Interconnect power...17 Disabling processor cores...17 C-state package limit setting ...17 Managing memory technologies ...17 Memory channel interleaving...17 Maximum memory data rates...17 Managing I/O technologies...18

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HP ProLiant 100-series Intel-based G6 server
technology
Technology brief, 3
rd
edition
Abstract
..............................................................................................................................................
3
Introduction
.........................................................................................................................................
3
Intel Xeon 5500 Series processor technology
..........................................................................................
3
Multi-level caches
.............................................................................................................................
4
QuickPath Interconnect controller
.......................................................................................................
4
Hyper Threading
..............................................................................................................................
5
Turbo Boost technology
.....................................................................................................................
5
Intel Xeon 3400 Series processor technology
..........................................................................................
6
Memory
..............................................................................................................................................
8
DDR-3
.............................................................................................................................................
8
DIMM Choices
.............................................................................................................................
8
Memory Mirroring with DDR-3
.....................................................................................................
10
Memory channel interleaving
.......................................................................................................
10
Lockstep memory mode
...............................................................................................................
10
I/O technologies
...............................................................................................................................
11
PCI Express technology
...................................................................................................................
11
HP Smart Array and SAS/SATA technology
......................................................................................
11
SAS-2 standard
..........................................................................................................................
12
New generation HP Smart Array controllers
..................................................................................
12
Battery backed write cache
.........................................................................................................
13
Zero Memory RAID
.....................................................................................................................
13
Software RAID
...........................................................................................................................
13
Smart Array Advanced Pack
........................................................................................................
13
Networking technologies
................................................................................................................
14
Power and thermal technologies
..........................................................................................................
14
Efficient power delivery
...................................................................................................................
14
Common Slot power supplies
.......................................................................................................
15
Redundant power operation
........................................................................................................
16
Voltage regulation
......................................................................................................................
16
Improved thermal sensors and fan control
.........................................................................................
16
Phase shedding
.............................................................................................................................
16
Memory phase shedding
.............................................................................................................
16
Dynamic CPU phase shedding
.....................................................................................................
17
Managing processor technologies
....................................................................................................
17
QuickPath Interconnect power
......................................................................................................
17
Disabling processor cores
............................................................................................................
17
C-state package limit setting
........................................................................................................
17
Managing memory technologies
......................................................................................................
17
Memory channel interleaving
.......................................................................................................
17
Maximum memory data rates
.......................................................................................................
17
Managing I/O technologies
............................................................................................................
18