HP Mini 210-1033VU HP Mini 2102, HP Mini 210, and Compaq Mini 210 - Maintenanc - Page 76
and the fan/heat sink assembly
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4. Remove the fan/heat sink assembly (3). NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board components, it may be necessary to move the fan/heat sink assembly from side to side to detach it from the system board. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board each time the fan/heat sink assembly is removed: Thermal paste is used on the processor (1) and the fan/heat sink assembly section (2) that services it. Reverse this procedure to install the fan/heat sink assembly. 68 Chapter 4 Removal and replacement procedures
4.
Remove the fan/heat sink assembly
(3)
.
NOTE:
Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and system board components, it may be necessary to move the fan/heat sink assembly
from side to side to detach it from the system board.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed: Thermal paste is
used on the processor
(1)
and the fan/heat sink assembly section
(2)
that services it.
Reverse this procedure to install the fan/heat sink assembly.
68
Chapter 4
Removal and replacement procedures