Intel BFCBASE Data Sheet - Page 101
Table 6-7., Dual-Core Intel® Xeon® Processor 7200 Series Thermal Specifications, Dual-
UPC - 735858197373
View all Intel BFCBASE manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 101 highlights
Thermal Specifications Table 6-7. Dual-Core Intel® Xeon® Processor 7200 Series Thermal Specifications Core Frequency Launch to FMB Thermal Design Power (W) 80 Minimum TCASE (°C) 5 Maximum TCASE (°C) See Figure 6-4; Table 6-8; Notes 1, 2, 3, 4, 5, 6 Notes: 1. These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at specified ICC. Please refer to the loadline specifications in Section 2. 2. Maximum Power is the highest power the processor will dissipate, regardless of its VID. Maximum Power is measured at maximum TCASE. 3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE. 4. These specifications are based pre-silicon estimates and simulations. These specifications will be updated with characterized data from silicon measurements in a future release of this document. 5. Power specifications are defined at all VIDs found in Table 2-3. The Dual-Core Intel® Xeon® Processor 7200 Series may be shipped under multiple VIDs for each frequency. 6. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements. Figure 6-4. Dual-Core Intel® Xeon® Processor 7200 Series Thermal Profile Temperature (C) Thermal P rofile 70.0 65.0 60.0 55.0 50.0 Tcase = 0.238 x Pow er + 45 45.0 40.0 35.0 30.0 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 Pow er (W) Notes: 1. Please refer to Table 6-8 for discrete points that constitute the thermal profile. 2. Implementation of Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet processor Thermal Profile will result in increased probability of TCC activation and may incur measurable performance loss. (See Section 6.2 for details on TCC activation). Document Number: 318080-002 101