Intel BFCBASE Data Sheet - Page 98
Table 6-3., Quad-Core Intel® Xeon® X7350 Processor Thermal Specifications, Quad-Core
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Thermal Specifications Table 6-3. Quad-Core Intel® Xeon® X7350 Processor Thermal Specifications Core Frequency Launch to FMB Thermal Design Power (W) 130 Minimum TCASE (°C) 5 Maximum TCASE (°C) See Figure 6-2; Table 6-4; Notes 1, 2, 3, 4, 5, 6 Notes: 1. These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at specified ICC. Please refer to the loadline specifications in Section 2. 2. Maximum Power is the highest power the processor will dissipate, regardless of its VID. Maximum Power is measured at maximum TCASE. 3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE. 4. These specifications are based pre-silicon estimates and simulations. These specifications will be updated with characterized data from silicon measurements in a future release of this document. 5. Power specifications are defined at all VIDs found in Table 2-3. The Intel® Xeon® X7350 Processor may be shipped under multiple VIDs for each frequency. 6. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements. Figure 6-2.Quad-Core Intel® Xeon® X7350 Processor Thermal Profile 70.00 Therm al Profile 6 0 .0 0 Temperature (C) 50.00 4 0 .0 0 Tcase= 0.162 x Pow er + 45 3 0 .0 0 2 0 .0 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 Power( W ) Notes: 1. Thermal Profile is representative of a volumetrically unconstrained platform. Please refer to Table 6-4 for discrete points that constitute the thermal profile. 2. Implementation of Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet processor Thermal Profile will result in increased probability of TCC activation and may incur measurable performance loss. (See Section 6.2 for details on TCC activation). 3. Refer to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide for system and environmental implementation details. 98 Document Number: 318080-002