Intel BLKD201GLY2 Product Specification - Page 27
Hardware Management Subsystem, Power Management
UPC - 735858197724
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Product Description 1.10 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The Winbond W83627DHG-B I/O controller is used to implement hardware monitoring and fan control. The features of this I/O controller include: • Internal ambient temperature sensor • Two remote thermal diode sensors for direct monitoring of processor temperature and ambient temperature sensing • Power supply monitoring of four voltages (+5 V, +V_1P8_CORE, +VCCP, and +12 V) to detect levels above or below acceptable values • Thermally monitored closed-loop fan control, for system fan, that can adjust the fan speed or switch the fans on or off as needed • SMBus interface 1.10.1 Fan Monitoring Fan monitoring can be implemented using Intel® Desktop Utilities, LANDesk* software, or third-party software. For information about The functions of the fan connectors Refer to Section 1.11.2.2, page 31 1.11 Power Management Power management is implemented at several levels, including: • Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan connectors ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Resume on Ring ⎯ Wake from USB ⎯ Wake from PS/2 devices ⎯ Power Management Event signal (PME#) wake-up support 27