Intel BLKD945GCPE Product Specification - Page 52

Reliability

Page 52 highlights

Intel Desktop Board D945GCPE Technical Product Specification Table 24 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 24. Thermal Considerations for Components Component Processor Intel 82945GC GMCH Intel 82801GB ICH7 Maximum Case Temperature For processor case temperature, see processor datasheets and processor specification updates 99 oC (under bias) 110 oC (under bias, without heatsink) 99 oC (under bias, with heatsink) For information about Processor datasheets and specification updates Refer to Section 1.2, page 15 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the D945GCPE board is 57,845 hours. 52

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Intel Desktop Board D945GCPE Technical Product Specification
52
Table 24 provides maximum case temperatures for the components that are sensitive
to thermal changes.
The operating temperature, current load, or operating frequency
could affect case temperatures.
Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 24. Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel 82945GC GMCH
99
o
C (under bias)
Intel 82801GB ICH7
110
o
C (under bias, without heatsink)
99
o
C (under bias, with heatsink)
For information about
Refer to
Processor datasheets and specification updates
Section 1.2, page 15
2.7
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates.
The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991.
The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ÂșC.
The MTBF for the
D945GCPE board is 57,845 hours.