Intel BOXD915GEV Product Specification - Page 7

Error Messages and Beep Codes, s

Page 7 highlights

Contents 3.6 BIOS Updates ...88 3.6.1 Language Support 88 3.6.2 Custom Splash Screen 88 3.7 Boot Options ...89 3.7.1 CD-ROM Boot 89 3.7.2 Network Boot 89 3.7.3 Booting Without Attached Devices 89 3.7.4 Changing the Default Boot Device During POST 89 3.8 Fast Booting Systems with Intel® Rapid BIOS Boot 90 3.8.1 Peripheral Selection and Configuration 90 3.8.2 Intel Rapid BIOS Boot 90 3.9 BIOS Security Features 91 4 Error Messages and Beep Codes 4.1 BIOS Error Messages 93 4.2 Port 80h POST Codes 95 4.3 Bus Initialization Checkpoints 99 4.4 Speaker...100 4.5 BIOS Beep Codes ...100 Figures 1 Board Components ...14 2 Block Diagram ...16 3. Memory Channel and DIMM Configuration 19 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs 20 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs 20 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs 21 7. Single Channel (Asymmetric) Mode Configuration with One DIMM 22 8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs 22 9. Front/Back Panel Audio Connector Options for High Definition Audio Subsystem......30 10. High Definition Audio Subsystem Block Diagram 30 11. LAN Connector LED Locations 31 12. LAN Connector LED Locations 32 13. Thermal Monitoring ...35 14. Location of the Standby Power Indicator LED 42 15. Detailed System Memory Address Map 52 16. Back Panel Connectors 60 17. Component-side Connectors 62 18. Connection Diagram for Front Panel Connector 68 19. Connection Diagram for Front Panel USB Connectors 70 20. Connection Diagram for IEEE 1394a Connectors 70 21. Location of the Jumper Block 71 22. Board Dimensions ...72 23. I/O Shield Dimensions 73 24. Processor Heatsink Airflow 76 25. Localized High Temperature Zones 77 vii

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Contents
vii
3.6
BIOS Updates
............................................................................................................
88
3.6.1
Language Support
........................................................................................
88
3.6.2
Custom Splash Screen
................................................................................
88
3.7
Boot Options
..............................................................................................................
89
3.7.1
CD-ROM Boot
..............................................................................................
89
3.7.2
Network Boot
...............................................................................................
89
3.7.3
Booting Without Attached Devices
...............................................................
89
3.7.4
Changing the Default Boot Device During POST
.........................................
89
3.8
Fast Booting Systems with Intel
®
Rapid BIOS Boot
....................................................
90
3.8.1
Peripheral Selection and Configuration
........................................................
90
3.8.2
Intel Rapid BIOS Boot
..................................................................................
90
3.9
BIOS Security Features
..............................................................................................
91
4
Error Messages and Beep Codes
4.1
BIOS Error Messages
................................................................................................
93
4.2
Port 80h POST Codes
................................................................................................
95
4.3
Bus Initialization Checkpoints
.....................................................................................
99
4.4
Speaker
....................................................................................................................
100
4.5
BIOS Beep Codes
....................................................................................................
100
Figures
1
Board Components
....................................................................................................
14
2
Block Diagram
............................................................................................................
16
3.
Memory Channel and DIMM Configuration
.................................................................
19
4.
Dual Channel (Interleaved) Mode Configuration with Two DIMMs
..............................
20
5.
Dual Channel (Interleaved) Mode Configuration with Three DIMMs
...........................
20
6.
Dual Channel (Interleaved) Mode Configuration with Four DIMMs
.............................
21
7.
Single Channel (Asymmetric) Mode Configuration with One DIMM
............................
22
8.
Single Channel (Asymmetric) Mode Configuration with Three DIMMs
........................
22
9.
Front/Back Panel Audio Connector Options for High Definition Audio Subsystem
......
30
10.
High Definition Audio Subsystem Block Diagram
........................................................
30
11.
LAN Connector LED Locations
...................................................................................
31
12.
LAN Connector LED Locations
...................................................................................
32
13.
Thermal Monitoring
....................................................................................................
35
14.
Location of the Standby Power Indicator LED
............................................................
42
15.
Detailed System Memory Address Map
......................................................................
52
16.
Back Panel Connectors
..............................................................................................
60
17.
Component-side Connectors
......................................................................................
62
18.
Connection Diagram for Front Panel Connector
.........................................................
68
19.
Connection Diagram for Front Panel USB Connectors
...............................................
70
20.
Connection Diagram for IEEE 1394a Connectors
.......................................................
70
21.
Location of the Jumper Block
.....................................................................................
71
22.
Board Dimensions
......................................................................................................
72
23.
I/O Shield Dimensions
................................................................................................
73
24.
Processor Heatsink Airflow
.........................................................................................
76
25.
Localized High Temperature Zones
............................................................................
77