Intel BX80570E8400 Mechanical Design Guidelines - Page 39
Balanced Technology Extended, BTX Thermal/Mechanical, Design Information
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Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.1 Overview of the BTX Reference Design The reference thermal module assembly is a Type II BTX compliant design and is compliant with the reference BTX motherboard keep-out and height recommendations defined in Section 6.6. The solution comes as an integrated assembly. An isometric view of the assembly is provided in Figure 5-4. 5.1.1 Target Heatsink Performance Table 5-1 provides the target heatsink performance for the processor with the BTX boundary conditions. The results will be evaluated using the test procedure described in Section 5.2. The table also includes a TA assumption of 35.5 °C for the Intel reference thermal solution at the processor fan heatsink inlet discussed in Section 3.3. The analysis assumes a uniform 35 °C external ambient temperature to the chassis of across the fan inlet, resulting in a temperature rise, TR, of 0.5 °C. Meeting TA and ΨCA targets can maximize processor performance (refer to Sections 2.2, 2.4. and Chapter 4). Minimizing TR can lead to improved acoustics. Table 5-1. Balanced Technology Extended (BTX) Type II Reference TMA Performance Processor Thermal Requirements, Ψca (Mean + 3σ) Assum TAption Notes Intel Core™2 Duo processor E8000 series with 6 MB cache Intel Core™2 Duo processor E7000 series with 3 MB cache /Intel Pentium® dual-core processor E6000, E5000 series with 2 MB cache / Intel® Celeron® processor E3000 series with 1 MB cache 0.57 °C/W 0.594 °C/W 35.5 °C 1,2,3 35.5 °C 1,2,3 NOTES: 1. Performance targets (Ψ ca) as measured with a live processor at TDP. 2. The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium® dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor E3000 series is due to a slight difference in the die size. 3. This data is pre-silicon data, and subject to change with the post silicon validate results. Thermal and Mechanical Design Guidelines 39