Intel DC3217BY Technical Product Specification - Page 11
Product Description - sata
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1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 2 summarizes the major features of the board. Table 2. Feature Summary Form Factor Processor Memory Chipset 4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters) • Soldered-down Intel® Core™ i3-3217U processor with up to 17 W TDP ― Integrated graphics ― Integrated memory controller • Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM) sockets • Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SO-DIMMs • Support for 1 Gb, 2 Gb, and 4 Gb memory technology • Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb memory technology • Support for non-ECC memory • Support for 1.35 V low voltage JEDEC memory Intel® QS77 Express Chipset consisting of the Intel® QS77 Express Platform Controller Hub (PCH) Connectivity Graphics Audio Peripheral Interfaces Expansion Capabilities BIOS Thunderbolt™ Technology Interface • Integrated graphics support for processors with Intel® Graphics Technology: ― One High Definition Multimedia Interface* (HDMI*) back panel connector Intel® High Definition Audio via the HDMI v1.4a interface • USB 2.0 ports: ― Three front panel ports (via one dual-port internal header and one front panel connector) ― Two ports are implemented with vertical back panel connectors ― One port is reserved for the PCI Express* Half-Mini Card ― One port is reserved for the PCI Express Full-Mini Card • SATA port: ― One internal mSATA port (PCI Express Full-Mini Card) for SSD support • One PCI Express Half-Mini Card connector • One PCI Express Full-Mini Card connector • Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device • Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and System Management BIOS (SMBIOS) continued 11