Intel DH67CF Product Specification - Page 9

Regulatory Compliance and Battery Disposal Information, s, Tables

Page 9 highlights

Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance 77 5.1.1 Safety Standards 77 5.1.2 European Union Declaration of Conformity Statement 78 5.1.3 Product Ecology Statements 79 5.1.4 EMC Regulations 81 5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance 84 5.1.6 Regulatory Compliance Marks (Board Level 85 5.2 Battery Disposal Information 86 Figures 1. Major Board Components 13 2. Block Diagram 15 3. Memory Channel and DIMM Configuration 20 4. Back Panel Audio Connectors 28 5. LAN Connector LED Locations 30 6. Thermal Sensors and Fan Headers 32 7. Location of the Standby Power LED 39 8. Detailed System Memory Address Map 42 9. Back Panel Connectors 44 10. Component-side Connectors and Headers 45 11. Connection Diagram for Front Panel Header 50 12. Connection Diagram for Front Panel USB 2.0 Headers 52 13. Location of the Jumper Block 53 14. Board Dimensions 55 15. Localized High Temperature Zones 58 Tables 1. Feature Summary 11 2. Components Shown in Figure 1 14 3. Supported Memory Configurations 18 4. HDMI Port Status Conditions 22 5. DVI Port Status Conditions 22 6. Audio Jack Support 27 7. LAN Connector LED States 30 8. Effects of Pressing the Power Switch 33 9. Power States and Targeted System Power 34 10. Wake-up Devices and Events 35 11. System Memory Map 43 12. Component-side Connectors and Headers Shown in Figure 10 46 13. Front Panel Audio Header for Intel HD Audio 47 14. Front Panel Audio Header for AC '97 Audio 47 15. Front Panel USB 2.0 Headers 47 16. SATA Connectors 47 17. S/PDIF Header 48 ix

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Contents
ix
5
Regulatory Compliance and Battery Disposal Information
5.1
Regulatory Compliance
.....................................................................
77
5.1.1
Safety Standards
..................................................................
77
5.1.2
European Union Declaration of Conformity Statement
................
78
5.1.3
Product Ecology Statements
...................................................
79
5.1.4
EMC Regulations
..................................................................
81
5.1.5
ENERGY STAR* 5.0, e-Standby, and ErP Compliance
.................
84
5.1.6
Regulatory Compliance Marks (Board Level)
.............................
85
5.2
Battery Disposal Information
.............................................................
86
Figures
1.
Major Board Components
..................................................................
13
2.
Block Diagram
................................................................................
15
3.
Memory Channel and DIMM Configuration
...........................................
20
4.
Back Panel Audio Connectors
............................................................
28
5.
LAN Connector LED Locations
............................................................
30
6.
Thermal Sensors and Fan Headers
.....................................................
32
7.
Location of the Standby Power LED
....................................................
39
8.
Detailed System Memory Address Map
...............................................
42
9.
Back Panel Connectors
.....................................................................
44
10. Component-side Connectors and Headers
...........................................
45
11. Connection Diagram for Front Panel Header
........................................
50
12. Connection Diagram for Front Panel USB 2.0 Headers
...........................
52
13. Location of the Jumper Block
.............................................................
53
14. Board Dimensions
...........................................................................
55
15. Localized High Temperature Zones
.....................................................
58
Tables
1.
Feature Summary
............................................................................
11
2.
Components Shown in Figure 1
.........................................................
14
3.
Supported Memory Configurations
.....................................................
18
4.
HDMI Port Status Conditions
.............................................................
22
5.
DVI Port Status Conditions
................................................................
22
6.
Audio Jack Support
..........................................................................
27
7.
LAN Connector LED States
................................................................
30
8.
Effects of Pressing the Power Switch
..................................................
33
9.
Power States and Targeted System Power
...........................................
34
10. Wake-up Devices and Events
............................................................
35
11. System Memory Map
.......................................................................
43
12. Component-side Connectors and Headers Shown in Figure 10
................
46
13. Front Panel Audio Header for Intel HD Audio
........................................
47
14. Front Panel Audio Header for AC ’97 Audio
..........................................
47
15. Front Panel USB 2.0 Headers
............................................................
47
16. SATA Connectors
.............................................................................
47
17. S/PDIF Header
................................................................................
48