Intel DQ57TM Intel Desktop Board DQ57TML Technical Product Specification - Page 64

Localized High Temperature Zones, Table 35., Thermal Considerations for Components

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Intel Desktop Board DQ57TML Technical Product Specification Figure 17 shows the locations of the localized high temperature zones. Item A B C Description Processor voltage regulator area Processor Intel Q57 Express Chipset Figure 17. Localized High Temperature Zones Table 35 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 35. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel Q57 Express Chipset 111 oC (under bias) For information about Processor datasheets and specification updates Refer to Section 1.3, page 14 64

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Intel Desktop Board DQ57TML Technical Product Specification
64
Figure 17 shows the locations of the localized high temperature zones.
Item
Description
A
Processor voltage regulator area
B
Processor
C
Intel Q57 Express Chipset
Figure 17.
Localized High Temperature Zones
Table 35 provides maximum case temperatures for the components that are sensitive
to thermal changes.
The operating temperature, current load, or operating frequency
could affect case temperatures.
Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 35.
Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel Q57 Express Chipset
111
o
C (under bias)
For information about
Refer to
Processor datasheets and specification updates
Section 1.3, page 14