Intel E5472 Data Sheet - Page 12

• Processor core - Processor core with integrated L1 cache. L2 cache and system bus interface are shared between the two cores on the die. All AC timing and signal integrity specifications are at the pads of the system bus interface. • Front Side Bus (FSB) - The electrical interface that connects the processor to the chipset. Also referred to as the processor system bus or the system bus. All memory and I/O transactions, as well as interrupt messages, pass between the processor and chipset over the FSB. • Dual Independent Bus (DIB) - A front side bus architecture with one processor on each of several processor buses, rather than a processor bus shared between two processor agents. The DIB architecture provides improved performance by allowing increased FSB speeds and bandwidth. • Flexible Motherboard Guidelines (FMB) - Estimate of the maximum values the Quad-Core Intel® Xeon® Processor 5400 Series will have over certain time periods. Actual specifications for future processors may differ. • Functional Operation - Refers to the normal operating conditions in which all processor specifications, including DC, AC, FSB, signal quality, mechanical and thermal are satisfied. • Storage Conditions - Refers to a non-operational state. The processor may be installed in a platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. Under these conditions, processor lands should not be connected to any supply voltages, have any I/Os biased or receive any clocks. Upon exposure to "free air" (that is, unsealed packaging or a device removed from packaging material) the processor must be handled in accordance with moisture sensitivity labeling (MSL) as indicated on the packaging material. • Priority Agent - The priority agent is the host bridge to the processor and is typically known as the chipset. • Symmetric Agent - A symmetric agent is a processor which shares the same I/O subsystem and memory array, and runs the same operating system as another processor in a system. Systems using symmetric agents are known as Symmetric Multiprocessing (SMP) systems. • Integrated Heat Spreader (IHS) - A component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface. • Thermal Design Power (TDP) - Processor thermal solutions should be designed to meet this target. It is the highest expected sustainable power while running known power intensive applications. TDP is not the maximum power that the processor can dissipate. • Intel®64 Architecture - An enhancement to Intel's IA-32 architecture that allows the processor to execute operating systems and applications written to take advantage of the 64-bit extension technology. • Enhanced Intel SpeedStep® Technology - Technology that provides power management capabilities to servers and workstations. • Platform Environment Control Interface (PECI) - A proprietary one-wire bus interface that provides a communication channel between Intel processor and external thermal monitoring devices, for use in fan speed control. PECI communicates readings from the processor's digital thermometer. PECI replaces the thermal diode available in previous processors. • Intel® Virtualization Technology - Processor virtualization, which when used in conjunction with Virtual Machine Monitor software enables multiple, robust independent software environments inside a single platform. 12