Intel E5472 Data Sheet - Page 80

Thermal Specifications

80

Processor Thermal Features). Systems that implement fan speed control must be

designed to use this data. Systems that do not alter the fan speed only need to

guarantee the case temperature meets the thermal profile specifications.

The Quad-Core Intel® Xeon® Processor X5482, and Quad-Core Intel® Xeon®

Processor E5400 Series, and Quad-Core Intel® Xeon® Processor L5400 Series support

a single Thermal Profile (see

Figure 6-1

, and

Figure 6-3

and

Figure 6-4

;

Table 6-1

, and

Table 6-6

, and

Table 6-8

). With this Thermal Profile, it is expected that the Thermal

Control Circuit (TCC) would only be activated for very brief periods of time when

running the most power-intensive applications. Refer to the

Quad-Core Intel® Xeon®

Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG)

for details on

system thermal solution design, thermal profiles and environmental considerations.

The Quad-Core Intel® Xeon® Processor L5408 supports a Thermal Profile with nominal

and short-term conditions designed to meet NEBS level 3 compliance (see

Figure 6-5

).

Operation at either thermal profile should result in virtually no TCC activation. Refer to

the

Quad-Core Intel® Xeon® Processor L5408 Series in Embedded Applications

Thermal/Mechanical Design Guidelines (TMDG)

.

The Quad-Core Intel® Xeon® Processor X5400 Series supports a dual Thermal Profile,

either of which can be implemented. Both ensure adherence to the Intel reliability

requirements. Thermal Profile A (see

Figure 6-2

;

Table 6-3

) is representative of a

volumetrically unconstrained thermal solution (that is, industry enabled 2U heatsink).

In this scenario, it is expected that the Thermal Control Circuit (TCC) would only be

activated for very brief periods of time when running the most power intensive

applications. Thermal Profile B (see

Figure 6-2

;

Table 6-5

) is indicative of a constrained

thermal environment (that is, 1U form factor). Because of the reduced cooling

capability represented by this thermal solution, the probability of TCC activation and

performance loss is increased. Additionally, utilization of a thermal solution that does

not meet Thermal Profile B will violate the thermal specifications and may result in

permanent damage to the processor. Intel has developed these thermal profiles to

allow customers to choose the thermal solution and environmental parameters that

best suit their platform implementation. Refer to the

Quad-Core Intel® Xeon®

Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG)

for details on

system thermal solution design, thermal profiles and environmental considerations.

The upper point of the thermal profile consists of the Thermal Design Power (TDP)

defined in

Table 6-1

for the Quad-Core Intel® Xeon® Processor X5482,

Table 6-3

for

the Quad-Core Intel® Xeon® Processor X5400 Series,

Table 6-6

for the Quad-Core

Intel® Xeon® Processor E5400 Series, and

Table 6-8

for the Quad-Core Intel® Xeon®

Processor L5400 Series and the associated T

CASE

values. The lower point of the thermal

profile is the T

CASE_MAX

at 0 W power (or no power draw)

Analysis indicates that real applications are unlikely to cause the processor to consume

maximum power dissipation for sustained time periods. Intel recommends that

complete thermal solution designs target the Thermal Design Power (TDP) indicated in

Table 6-2

for the Quad-Core Intel® Xeon® Processor X5482 (C-step) and Quad-Core

Intel® Xeon® Processor X5492,

Table 6-4

and

Table 6-5

for the Quad-Core Intel®

Xeon® Processor X5400 Series,

Table 6-7

for the Quad-Core Intel® Xeon® Processor

E5400 Series and

Table 6-9

Quad-Core Intel® Xeon® Processor L5400 Series instead of

the maximum processor power consumption. The Thermal Monitor feature is intended

to help protect the processor in the event that an application exceeds the TDP

recommendation for a sustained time period. For more details on this feature, refer to

Section 6.2

. To ensure maximum flexibility for future requirements, systems should be

designed to the Flexible Motherboard (FMB) guidelines, even if a processor with lower

Section	Page
Quad-Core Intel® Xeon® Processor 5400 Series	1
1 Introduction	9
1.1 Terminology	10
1.2 State of Data	13
1.3 References	13
2 Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications	15
2.1 Front Side Bus and GTLREF	15
2.2 Power and Ground Lands	16
2.3 Decoupling Guidelines	16
2.3.1 VCC Decoupling	16
2.3.2 VTT Decoupling	16
2.3.3 Front Side Bus AGTL+ Decoupling	16
2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	17
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0])	17
2.4.2 PLL Power Supply	18
2.5 Voltage Identification (VID)	18
2.6 Reserved, Unused, and Test Signals	21
2.7 Front Side Bus Signal Groups	22
2.8 CMOS Asynchronous and Open Drain Asynchronous Signals	24
2.9 Test Access Port (TAP) Connection	24
2.10 Platform Environmental Control Interface (PECI) DC Specifications	24
2.10.1 DC Characteristics	24
2.10.2 Input Device Hysteresis	25
2.11 Mixing Processors	26
2.12 Absolute Maximum and Minimum Ratings	26
2.13 Processor DC Specifications	27
2.13.1 Flexible Motherboard Guidelines (FMB)	27
2.13.2 VCC Overshoot Specification	38
2.13.3 Die Voltage Validation	39
2.14 AGTL+ FSB Specifications	39
3 Mechanical Specifications	43
3.1 Package Mechanical Drawings	43
3.2 Processor Component Keepout Zones	47
3.3 Package Loading Specifications	47
3.4 Package Handling Guidelines	48
3.5 Package Insertion Specifications	48
3.6 Processor Mass Specifications	48
3.7 Processor Materials	48
3.8 Processor Markings	48
3.9 Processor Land Coordinates	49
4 Land Listing	51
4.1 Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments	51
4.1.1 Land Listing by Land Name	51
4.1.2 Land Listing by Land Number	61
5 Signal Definitions	71
5.1 Signal Definitions	71
6 Thermal Specifications	79
6.1 Package Thermal Specifications	79
6.1.1 Thermal Specifications	79
6.1.2 Thermal Metrology	90
6.2 Processor Thermal Features	90
6.2.1 Intel® Thermal Monitor Features	90
6.2.2 On-Demand Mode	92
6.2.3 PROCHOT# Signal	93
6.2.4 FORCEPR# Signal	93
6.2.5 THERMTRIP# Signal	94
6.3 Platform Environment Control Interface (PECI)	94
6.3.1 Introduction	94
6.3.2 PECI Specifications	96
7 Features	97
7.1 Power-On Configuration Options	97
7.2 Clock Control and Low Power States	97
7.2.1 Normal State	98
7.2.2 HALT or Extended HALT State	98
7.2.3 Stop-Grant State	100
7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State	101
7.3 Enhanced Intel SpeedStep® Technology	101
8 Boxed Processor Specifications	103
8.1 Introduction	103
8.2 Mechanical Specifications	105
8.2.1 Boxed Processor Heat Sink Dimensions (CEK)	105
8.2.2 Boxed Processor Heat Sink Weight	113
8.2.3 Boxed Processor Retention Mechanism and Heat Sink Support (CEK)	113
8.3 Electrical Requirements	113
8.3.1 Fan Power Supply (Active CEK)	113
8.3.2 Boxed Processor Cooling Requirements	114
8.4 Boxed Processor Contents	115
9 Debug Tools Specifications	117
9.1 Debug Port System Requirements	117
9.2 Target System Implementation	117
9.2.1 System Implementation	117
9.3 Logic Analyzer Interface (LAI)	117
9.3.1 Mechanical Considerations	118

Intel E5472 Data Sheet - Page 80

The Quad-Core Intel® Xeon® Processor L5408 supports a Thermal Profile with nominal

Page 80 highlights