Home » Intel Manuals » Motherboards » Intel KD875PBZLKPAK10 » Manual Viewer

Intel KD875PBZLKPAK10 Product Specification - Page 79

Thermal Considerations

UPC - 735858160209

View all Intel KD875PBZLKPAK10 manuals

Add to My Manuals
Save this manual to your list of manuals

Page 79 highlights

Technical Reference 2.12 Thermal Considerations CAUTION The use of an Intel Pentium 4 processor operating above 2.80 GHz with this Intel desktop board requires the following: • A chassis with appropriate airflow to ensure proper cooling of the components on the board • A processor fan heatsink that meets the thermal performance targets for Pentium 4 processors operating above 2.80 GHz Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the desktop board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION Ensure that the ambient temperature does not exceed the Desktop Board D875PBZ's maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.14. CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (item A in Figure 27) can reach a temperature of up to 85 °C in an open chassis. 79

Section	Page
Intel® Desktop Board D875PBZ Technical Product Specification	1
Revision History / Disclaimer	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Notes, Cautions, and Warnings	3
Other Common Notation	4
Contents	5
1 Product Description	11
1.1 Overview	12
1.1.1 Feature Summary	12
1.1.2 Manufacturing Options	13
1.1.3 Board Layout	14
1.1.4 Block Diagram	15
1.2 Online Support	16
1.3 Operating System Support	16
1.4 Design Specifications	17
1.5 Processor	20
1.6 System Memory	21
1.6.1 Memory Features	21
1.6.2 Memory Configurations	23
1.7 Intel® 875P Chipset	28
1.7.1 AGP	29
1.7.2 USB	29
1.7.3 IDE Support	30
1.7.4 Real-Time Clock, CMOS SRAM, and Battery	32
1.7.5 Intel® 82802AC Firmware Hub (FWH)	32
1.8 I/O Controller	32
1.8.1 Serial Port	33
1.8.2 Parallel Port	33
1.8.3 Diskette Drive Controller	33
1.8.4 Keyboard and Mouse Interface	33
1.9 Audio Subsystem (Optional)	34
1.9.1 Audio Subsystem Software	34
1.9.2 Intel Flex 6 Audio Subsystem	34
1.9.3 Audio Connectors	36
1.10 LAN Subsystem	37
1.10.1 LAN Subsystem Software	37
1.10.2 Intel® 82547EI Platform LAN Connect Device	37
1.10.3 RJ-45 LAN Connector with Integrated LEDs	37
1.11 Hardware Management Subsystem	38
1.11.1 Hardware Monitoring and Fan Control ASIC	38
1.11.2 Thermal Monitoring	39
1.11.3 Fan Monitoring	40
1.11.4 Chassis Intrusion and Detection	40
1.12 Power Management	40
1.12.1 ACPI	41
1.12.2 Hardware Support	43
2 Technical Reference	49
2.1 Introduction	49
2.2 Memory Resources	49
2.2.1 Addressable Memory	49
2.2.2 Memory Map	51
2.3 DMA Channels	51
2.4 Fixed I/O Map	52
2.5 PCI Configuration Space Map	53
2.6 Interrupts	54
2.7 PCI Interrupt Routing Map	55
2.8 Connectors	57
2.8.1 Back Panel Connectors	58
2.8.2 Internal I/O Connectors	60
2.8.3 External I/O Connectors	68
2.9 Jumper Blocks	72
2.9.1 Front Panel Audio Connector/Jumper Block	72
2.9.2 BIOS Setup Configuration Jumper Block	73
2.10 Mechanical Considerations	74
2.10.1 D875PBZ Form Factor	74
2.10. 2 I/O Shield	75
2.11 Electrical Considerations	77
2.11.1 DC Loading	77
2.11.2 Add-in Board Considerations	77
2.11.3 Fan Connector Current Capability	77
2.11.4 Power Supply Considerations	78
2.12 Thermal Considerations	79
2.13 Reliability	81
2.14 Environmental	81
2.15 Regulatory Compliance	82
2.15.1 Safety Regulations	82
2.15.2 EMC Regulations	82
2.15.3 European Union Declaration of Conformity Statement	83
2.15.4 Product Ecology Statements	83
2.15.5 Product Certification Markings (Board Level)	84
3 Overview of BIOS Features	85
3.1 Introduction	85
3.2 BIOS Flash Memory Organization	85
3.3 Resource Configuration	86
3.3.1 PCI Autoconfiguration	86
3.3.2 PCI IDE Support	86
3.4 System Management BIOS (SMBIOS)	87
3.5 Legacy USB Support	88
3.6 BIOS Updates	88
3.6.1 Language Support	89
3.6.2 Custom Splash Screen	89
3.7 Recovering BIOS Data	89
3.8 Boot Options	90
3.8.1 CD-ROM Boot	90
3.8.2 Network Boot	90
3.8.3 Booting Without Attached Devices	90
3.8.4 Changing the Default Boot Device During POST	91
3.9 Fast Booting Systems with Intel® Rapid BIOS Boot	91
3.9.1 Peripheral Selection and Configuration	91
3.9.2 Intel Rapid BIOS Boot	92
3.10 BIOS Security Features	93
4 BIOS Setup Program	95
4.1 Introduction	95
4.2 Maintenance Menu	96
4.3 Main Menu	97
4.4 Advanced Menu	98
4.4.1 PCI Configuration Submenu	99
4.4.2 Boot Configuration Submenu	100
4.4.3 Peripheral Configuration Submenu	101
4.4.4 Drive Configuration Submenu	103
4.4.5 Floppy Configuration Submenu	107
4.4.6 Event Log Configuration Submenu	108
4.4.7 Video Configuration Submenu	109
4.4.8 USB Configuration Submenu	110
4.4.9 Chipset Configuration Submenu	111
4.4.10 Fan Control Configuration Submenu	114
4.4.11 Hardware Monitoring	115
4.5 Security Menu	116
4.6 Power Menu	117
4.6.1 ACPI Submenu	117
4.7 Boot Menu	118
4.7.1 Boot Device Priority Submenu	119
4.7.2 Hard Disk Drives Submenu	120
4.7.3 Removable Devices Submenu	120
4.7.4 ATAPI CD-ROM Drives Submenu	121
4.8 Exit Menu	121
5 Error Messages and Beep Codes	123
5.1 BIOS Error Messages	123
5.2 Port 80h POST Codes	125
5.3 Bus Initialization Checkpoints	129
5.4 Speaker	130

Match case Limit results 1 per page

Technical Reference

2.12 Thermal Considerations

CAUTION

The use of an Intel Pentium 4 processor operating above 2.80 GHz with this Intel desktop board

requires the following:

•

A chassis with appropriate airflow to ensure proper cooling of the components on the board

•

A processor fan heatsink that meets the thermal performance targets for Pentium 4 processors

operating above 2.80 GHz

Failure to ensure appropriate airflow may result in reduced performance of both the processor

and/or voltage regulator or, in some instances, damage to the desktop board.

For a list of chassis

that have been tested with Intel desktop boards please refer to the following website:

http://developer.intel.com/design/motherbd/cooling.htm

All responsibility for determining the adequacy of any thermal or system design remains solely

with the reader.

Intel makes no warranties or representations that merely following the

instructions presented in this document will result in a system with adequate thermal performance.

CAUTION

Ensure that the ambient temperature does not exceed the Desktop Board D875PBZ

’

s maximum

operating temperature.

Failure to do so could cause components to exceed their maximum case

temperature and malfunction.

For information about the maximum operating temperature, see the

environmental specifications in Section 2.14.

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit.

Failure to do

so may result in damage to the voltage regulator circuit.

The processor voltage regulator area

(item A in Figure 27) can reach a temperature of up to 85

C in an open chassis.