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Intel MFSYS25V2 Technical Product Specification - Page 53

Appendix D: Supported Intel, Modular Server System

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Appendix D: Supported Intel® Modular Server System Intel® Compute Module MFS5520VI TPS Appendix D: Supported Intel® Modular Server System The Intel® Compute Module MFS5520VI is supported in the following chassis: ƒ Intel® Modular Server System MFSYS25 ƒ Intel® Modular Server System MFSYS25V2 ƒ Intel® Modular Server System MFSYS35 This section provides a high-level pictorial overview of the Intel® Modular Server System MFSYS25. For more details, refer to the Intel® Modular Server System Technical Product Specification (TPS). A Shared hard drive storage bay B I/O cooling fans C Empty compute module bay D Compute module cooling fans E Compute module midplane connectors Figure 10. Intel® Modular Server System MFSYS25 46 Revision 1.5 Intel order number: E64311-007

Section	Page
Revision History	2
Table of Contents	3
List of Figures	5
List of Tables	6
1. Introduction	8
1.1 Chapter Outline	8
1.2 Intel® Compute Module Use Disclaimer	8
2. Product Overview	9
2.1 Intel® Compute Module MFS5520VI Feature Set	9
2.2 Compute Module Layout	10
2.2.1 Connector and Component Locations	10
2.2.2 External I/O Connector Locations	10
2.2.3 Compute Module Mechanical Drawings	12
3. Functional Architecture	13
3.1 Intel® Xeon® processor	14
3.1.1 Processor Support	14
3.1.1.1 Processor Population Rules	14
3.1.2 Mixed Processor Configuration	14
3.1.3 Turbo Mode	16
3.1.4 Hyper-Threading	16
3.1.5 Intel® QuickPath Interconnect	16
3.1.6 Unified Retention System Support	17
3.2 Memory Subsystem	18
3.2.1 Intel® QuickPath Memory Controller	18
3.2.1.1 Intel® Compute Module MFS5520VI Supported Memory	18
3.2.2 Publishing Compute Module Memory	18
3.2.3 Memory Map and Population Rules	19
3.2.3.1 Memory Subsystem Nomenclature	19
3.2.4 Memory RAS	20
3.2.4.1 RAS Features	20
3.2.4.2 Channel Independent Mode	20
3.2.4.3 Channel Mirroring Mode	20
3.2.4.3.1 Minimum DDR3 DIMM Population for Channel Mirroring	21
3.2.4.3.2 Mirroring DIMM Population Rules Variance across Nodes	21
3.2.5 Memory Upgrade Rules	22
3.3 Intel® 5520 Chipset IOH	24
3.4 Intel® 82801JR I/O Controller Hub (ICH10R)	24
3.4.1 PCI Subsystem	25
3.4.2 USB 2.0 Support	25
3.5 Integrated Baseboard Management Controller	26
3.5.1 Floppy Disk Controller	28
3.5.2 Keyboard and Mouse Support	28
3.5.3 Wake-up Control	28
3.6 Video Support	28
3.6.1 Video Modes	28
3.7 Network Interface Controller (NIC)	29
3.7.1 Direct Cache Access (DCA)	29
3.8 Intel® Virtualization Technology for Directed I/O (Intel® VT-d)	29
4. Connector/Header Locations and Pin-outs	30
4.1 Board Connector Information	30
4.2 Power Connectors	30
4.3 I/O Connector Pin-out Definition	31
4.3.1 VGA Connector	31
4.3.2 I/O Mezzanine Card Connector	31
4.3.3 Midplane Signal Connector	35
4.3.4 Serial Port Connector	36
4.3.5 USB 2.0 Connectors	36
5. Jumper Block Settings	38
5.1 Recovery Jumper Blocks	38
5.1.1 CMOS Clear and Password Clear Usage Procedure	39
5.1.2 Integrated BMC Force Update Procedure	39
5.1.3 Integrated BMC Initialization	40
6. Product Regulatory Requirements	41
6.1 Product Regulatory Requirements	41
6.2 Product Regulatory Compliance and Safety Markings	41
6.3 Product Environmental/Ecology Requirements	41
Appendix A: Integration and Usage Tips	42
Appendix B: Integrated BMC Sensor Tables	43
Appendix C: POST Error Messages and Handling	49
Appendix D: Supported Intel® Modular Server System	53
Glossary	54