Intel S2400LP Technical Product Specification - Page 149

Environmental Limits Specification

Page 149 highlights

Intel®Server Boards S2400LP TPS Environmental Limits Specification 8. Environmental Limits Specification Operation of the server board at conditions beyond those shown in the following table may cause permanent damage to the system. Exposure to absolute maximum rating conditions for extended periods may affect long term system reliability. Note: The Energy Star compliance is at systems level, but not board level. Use of Intel® boards alone does not guarantee Energy Star compliance. Table 76. Server Board Design Specifications Operating Temperature Non-Operating Temperature DC Voltage Shock (Unpackaged) Shock (Packaged) = 20 to = 40 to = 80 to = 100 to = 120 pounds Vibration (Unpackaged) 0ºC to 55ºC 1 (32ºF to 131ºF) at product airflow specification -40ºC to 70ºC (-40ºF to 158ºF) ± 5% of all nominal voltages Trapezoidal, 50 G, 170 inches/sec 36 inches 30 inches 24 inches 18 inches 12 inches 9 inches 5 Hz to 500 Hz 3.13 g RMS random Note: Chassis design must provide proper airflow to avoid exceeding the Intel® Xeon® processor maximum case temperature. 9.1 Processor Thermal Design Power (TDP) Support To allow optimal operation and long-term reliability of Intel processor-based systems, the processor must remain within the defined minimum and maximum case temperature (TCASE) specifications. Thermal solutions not designed to provide sufficient thermal capability may affect the long-term reliability of the processor and system. The server board is designed to support the Intel® Xeon® Processor E5-2400 product family TDP guidelines up to and including 95W. Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible, if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits. Revision 1.0 135 Intel order number G52803-001

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Intel®
Server Boards S2400LP TPS
Environmental Limits Specification
Revision 1.0
Intel order number G52803-001
135
8.
Environmental Limits Specification
Operation of the server board at conditions beyond those shown in the following table may cause
permanent damage to the system. Exposure to absolute maximum rating conditions for extended periods
may affect long term system reliability.
Note:
The
Energy Star
compliance is at systems level, but not board level. Use of Intel
®
boards alone
does not guarantee
Energy Star
compliance.
Table 76. Server Board Design Specifications
Operating Temperature
C to 55º
C
1
(32º
F to 131º
F) at product
airflow specification
Non-Operating Temperature
-40º
C to 70º
C (-40º
F to 158º
F)
DC Voltage
± 5% of all nominal voltages
Shock (Unpackaged)
Trapezoidal, 50 G, 170 inches/sec
Shock (Packaged)
<20 pounds
>= 20 to <40 pounds
>= 40 to <80 pounds
>= 80 to <100 pounds
>= 100 to <120 pounds
>= 120 pounds
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
Vibration (Unpackaged)
5 Hz to 500 Hz 3.13 g RMS random
Note:
Chassis design must provide proper airflow to avoid exceeding the Intel
®
Xeon
®
processor maximum case
temperature.
9.1
Processor Thermal Design Power (TDP) Support
To allow optimal operation and long-term reliability of Intel processor-based systems, the
processor must remain within the defined minimum and maximum case temperature (T
CASE
)
specifications. Thermal solutions not designed to provide sufficient thermal capability may affect
the long-term reliability of the processor and system.
The server board is designed to support
the Intel
®
Xeon
®
Processor E5-2400 product family TDP guidelines up to and including 95W.
Disclaimer Note:
Intel Corporation server boards contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel ensures through its own
chassis development and testing that when Intel server building blocks are used together, the
fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel developed server
building blocks to consult vendor datasheets and operating parameters to determine the amount
of airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.