Intel S2600TP Technical Product Specification - Page 150

Thermal Management Technical Product Specification The installation and functionality of several components are used to maintain compute module thermals. They include three compute module fans, air duct, and installed CPU heat sinks. To keep the compute module operating within supported maximum thermal limits, the compute module must meet the following operating and configuration guidelines:  The compute module operating ambient is designed for sustained operation up to 35ºC (ASHRAE Class A2) with short-term excursion-based operation up to 45ºC (ASHRAE Class A4). o The compute module can operate up to 40ºC (ASHRAE Class A3) for up to 900 hours per year. o The compute module can operate up to 45ºC (ASHRAE Class A4) for up to 90 hours per year. o The compute module performance may be impacted when operating within the extended operating temperature range. o There is no long-term system reliability impact when operating at the extended temperature range within the approved limits.  Specific configuration requirements and limitations are documented in the configuration matrix found in the Intel® Server Board S2600TP product family Power Budget and Thermal Configuration Tool, available as a download online at http://www.intel.com/support.  The CPU-1 processor + CPU heat sink must be installed first. The CPU-2 heat sink must be installed at all times, with or without a processor installed.  Memory Slot population requirements - o DIMM Population Rules on CPU-1 - Install DIMMs in order; Channels A, B, C, and D. o DIMM Population Rules on CPU-2 - Install DIMMs in order; Channels E, F, G, and H.  With the compute module operating, the air duct must be installed at all times. 136 Revision 1.0