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Seagate ST32000646SS Constellation ES.2 SAS Product Manual - Page 40

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components should never be exposed to condensing water on the surface of the printed circuit board assembly (PCBA) or exposed to an ambient relative humidity greater than 95%. Materials used in cabinet fabrication, such as vulcanized rubber, that can outgas corrosive compounds should be minimized or eliminated. The useful life of any electronic equipment may be extended by replacing materials near circuitry with sulfide-free alternatives. 7.5.8 Electromagnetic susceptibility See Section 3.1.1.1. 32 Constellation ES.2 SAS Product Manual, Rev. C

Section	Page
1.0 Seagate Technology support services	9
2.0 Scope	10
3.0 Applicable standards and reference documentation	11
3.1 Standards	11
3.1.1 Electromagnetic compatibility	11
3.1.1.1 Electromagnetic susceptibility	11
3.1.2 Electromagnetic compliance	12
3.1.3 European Union Restriction of Hazardous Substances (RoHS)	13
3.1.4 China Restriction of Hazardous Substances (RoHS) Directive	13
3.2 Reference documents	14
4.0 General description	15
4.1 Standard features	16
4.2 Media description	16
4.3 Performance	16
4.4 Reliability	17
4.5 Formatted capacities	17
4.6 Programmable drive capacity	17
4.7 Factory-installed options	17
5.0 Performance characteristics	18
5.1 Internal drive characteristics	18
5.2 Seek performance characteristics	18
5.2.1 Access time	18
5.2.2 Format command execution time for 512-byte sectors (minutes)	19
5.2.3 General performance characteristics	19
5.3 Start/stop time	19
5.4 Prefetch/multi-segmented cache control	20
5.5 Cache operation	20
5.5.1 Caching write data	21
5.5.2 Prefetch operation	21
6.0 Reliability specifications	22
6.1 Error rates	22
6.1.1 Recoverable Errors	22
6.1.2 Unrecoverable Errors	22
6.1.3 Seek errors	23
6.1.4 Interface errors	23
6.2 Reliability and service	23
6.2.1 Annualized Failure Rate (AFR) and Mean Time Between Failure (MTBF)	23
6.2.2 Preventive maintenance	23
6.2.3 Hot plugging the drive	23
6.2.4 S.M.A.R.T.	24
6.2.5 Thermal monitor	25
6.2.6 Drive Self Test (DST)	26
6.2.6.1 DST failure definition	26
6.2.6.2 Implementation	26
6.2.7 Product warranty	28
7.0 Physical/electrical specifications	29
7.1 PowerChoiceTM power management	29
7.1.1 PowerChoice reporting methods	30
7.2 AC power requirements	30
7.3 DC power requirements	30
7.3.1 Conducted noise immunity	32
7.3.2 Power sequencing	32
7.3.3 Current profiles	33
7.4 Power dissipation	34
7.5 Environmental limits	36
7.5.1 Temperature	36
7.5.2 Relative humidity	36
7.5.3 Effective altitude (sea level)	37
7.5.4 Shock and vibration	37
7.5.4.1 Shock	37
7.5.4.2 Vibration	39
7.5.5 Acoustics	39
7.5.6 Air cleanliness	39
7.5.7 Corrosive environment	39
7.5.8 Electromagnetic susceptibility	40
7.6 Mechanical specifications	41
8.0 About FIPS	42
9.0 About self-encrypting drives	43
9.1 Data encryption	43
9.2 Controlled access	43
9.2.1 Admin SP	43
9.2.2 Locking SP	43
9.2.3 Default password	44
9.3 Random number generator (RNG)	44
9.4 Drive locking	44
9.5 Data bands	44
9.6 Cryptographic erase	44
9.7 Authenticated firmware download	45
9.8 Power requirements	45
9.9 Supported commands	45
9.10 RevertSP	45
10.0 Defect and error management	46
10.1 Drive internal defects/errors	46
10.2 Drive error recovery procedures	46
10.3 SAS system errors	47
10.4 Background Media Scan	47
10.5 Media Pre-Scan	48
10.6 Deferred Auto-Reallocation	48
10.7 Idle Read After Write	48
10.8 Protection Information (PI)	49
10.8.1 Levels of PI	49
10.8.2 Setting and determining the current Type Level	49
10.8.3 Identifying a Protection Information drive	49
11.0 Installation	50
11.1 Drive orientation	50
11.2 Cooling	51
11.3 Drive mounting	52
11.4 Grounding	52
12.0 Interface requirements	53
12.1 SAS features	53
12.1.1 task management functions	53
12.1.2 task management responses	53
12.2 Dual port support	54
12.3 SCSI commands supported	55
12.3.1 Inquiry data	59
12.3.2 Mode Sense data	59
12.4 Miscellaneous operating features and conditions	62
12.4.1 SAS physical interface	63
12.4.2 Physical characteristics	66
12.4.3 Connector requirements	66
12.4.4 Electrical description	66
12.4.5 Pin descriptions	66
12.4.6 SAS transmitters and receivers	67
12.4.7 Power	67
12.5 Signal characteristics	67
12.5.1 Ready LED Out	67
12.5.2 Differential signals	68
12.6 SAS-2 Specification Compliance	68
12.7 Additional information	68
Numerics	69
A	69
B	69
C	69
D	69
E	70
F	70
G	70
H	70
I	70
J	70
K	70
L	71
M	71
N	71
O	71
P	71
Q	72
R	72
S	72
T	72
U	73
V	73
W	73

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Constellation ES.2 SAS Product Manual, Rev. C

components should never be exposed to condensing water on the surface of the printed circuit board assembly

(PCBA) or exposed to an ambient relative humidity greater than 95%. Materials used in cabinet fabrication,

such as vulcanized rubber, that can outgas corrosive compounds should be minimized or eliminated. The

useful life of any electronic equipment may be extended by replacing materials near circuitry with sulfide-free

alternatives.

7.5.8

Electromagnetic susceptibility

See Section 3.1.1.1.