Sony HCD-MD515 Service Manual - Page 4

Servicing, Notes

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TABLE OF CONTENTS SELF DIAGNOSTICS 2 1. SERVICING NOTES 4 2. GENERAL 6 3. DISASSEMBLY 8 4. TEST MODE 21 5. ELECTRICAL ADJUSTMENTS MD Section 24 CD Section 29 6. DIAGRAMS 6-1. Printed Wiring Board - BD (CD) Section 31 6-2. Schematic Diagram - BD (CD) Section 33 6-3. Printed Wiring Boards - BD (MD) Section 36 6-4. Schematic Diagram - BD (MD) Section 39 6-5. Schematic Diagram - SUB Section 44 6-6. Printed Wiring Board - SUB Section 49 6-7. Printed Wiring Boards - MAIN Section 52 6-8. Schematic Diagram - MAIN Section 55 6-9. Schematic Diagram -PANEL Section 60 6-10. Printed Wiring Boards - PANEL Section 65 6-11. Printed Wiring Boards - CD (Motor/ Sensor) Section 67 6-12. Schematic Diagram - CD (Motor/ Sensor) Section 69 6-13. Printed Wiring Boards - MD (Motor/ Sensor) Section 71 6-14. Schematic Diagram - MD (Motor/ Sensor) Section 73 6-15. Printed Wiring Boards - POWER/AMPLIFIER Section 75 6-16. Schematic Diagram - POWER/AMPLIFIER Section 77 6-17. Printed Wiring Boards - DETACHABLE CONTROLLER Section (RM-MD515 79 6-18. Schematic Diagram - DETACHABLE CONTROLLER Section (RM-MD515 81 6-19. IC Pin Function Description 92 7. EXPLODED VIEWS 107 8. ELECTRICAL PARTS LIST 117 SECTION 1 SERVICING NOTES NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. Notes on chip component replacement • Never reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing • Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing. • Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). • Be careful not to apply force on the conductor when soldering or unsoldering SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. - 4 -

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– 4 –
TABLE
OF
CONTENTS
SELF
DIAGNOSTICS
......................................................
2
1.
SERVICING
NOTES
...............................................
4
2.
GENERAL
...................................................................
6
3.
DISASSEMBLY
.........................................................
8
4.
TEST
MODE
..............................................................
21
5.
ELECTRICAL
ADJUSTMENTS
MD Section
.....................................................................
24
CD Section
......................................................................
29
6.
DIAGRAMS
6-1.
Printed Wiring Board
– BD (CD) Section –
..................
31
6-2.
Schematic Diagram – BD (CD) Section –
......................
33
6-3.
Printed Wiring Boards
– BD (MD) Section –
...............
36
6-4.
Schematic Diagram
– BD (MD) Section –
....................
39
6-5.
Schematic Diagram – SUB Section –
.............................
44
6-6.
Printed Wiring Board
– SUB Section –
.........................
49
6-7.
Printed Wiring Boards
– MAIN Section –
....................
52
6-8.
Schematic Diagram – MAIN Section –
..........................
55
6-9.
Schematic Diagram –PANEL Section –
.........................
60
6-10.
Printed Wiring Boards
– PANEL Section –
..................
65
6-11.
Printed Wiring Boards
– CD (Motor/ Sensor) Section –
....................................
67
6-12.
Schematic Diagram
– CD (Motor/ Sensor) Section –
.....................................
69
6-13.
Printed Wiring Boards
– MD (Motor/ Sensor) Section –
....................................
71
6-14.
Schematic Diagram
– MD (Motor/ Sensor) Section –
....................................
73
6-15.
Printed Wiring Boards
– POWER/AMPLIFIER Section –
.................................
75
6-16.
Schematic Diagram
– POWER/AMPLIFIER Section –
.................................
77
6-17.
Printed Wiring Boards
– DETACHABLE
CONTROLLER Section
(RM-MD515)
–
..............................................................
79
6-18.
Schematic Diagram
– DETACHABLE
CONTROLLER Section
(RM-MD515) –
...............................................................
81
6-19.
IC Pin Function Description
...........................................
92
7.
EXPLODED
VIEWS
...............................................
107
8.
ELECTRICAL
PARTS
LIST
..............................
117
NOTES
ON
HANDLING
THE OPTICAL
PICK-UP
BLOCK
OR
BASE
UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES
ON
LASER
DIODE
EMISSION
CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block.
Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering
SAFETY-RELATED
COMPONENT
WARNING!!
COMPONENTS
IDENTIFIED
BY
MARK
!
OR
DOTTED
LINE
WITH
MARK
!
ON
THE
SCHEMATIC
DIAGRAMS
AND
IN
THE
PARTS
LIST
ARE
CRITICAL
TO
SAFE
OPERATION.
REPLACE
THESE
COMPONENTS
WITH
SONY
PARTS
WHOSE
PART
NUMBERS
APPEAR
AS
SHOWN
IN
THIS
MANUAL
OR
IN
SUPPLEMENTS
PUB-
LISHED
BY
SONY.
SECTION
1
SERVICING
NOTES