Sony STR-GX80ES Technical Background - Page 14

Molecular Bonding

Page 14 highlights

be isolated from other circuits. On big amps, you'll usually find the output transistors bonded to heavy aluminum heat sinks somewhere at the back or sides of the chassis. Thanks to the cool running of Sony's S-Master Pro amplifier, the MOS FETs are located where the circuit topology is shortest and simplest-lined up side-by-side, right in the middle of the power amplifier circuit board. In fact, the transistors can be so close together that the STR-DA7100ES amplifier section is some 70% smaller than the DA9000ES amp section! And the board itself is located in the middle of the DA7100ES chassis. As a result, the music is less exposed to vibration, radiated hum and noise. Operation is cool and consistent. And nothing intrudes between you and the sound. Transistor heat Transistor packing Transistor location Transistor heat radiation Heat sinks Space requirements Amplifier board location Overall chassis topology Traditional amplifier Major design concern Widely separated Away from heat-sensitive parts From the bottom Massive radiating fins made of die cast aluminum (on the better amplifiers) Major, for high powered amplifiers Isolated, to protect other circuits from heat Circuitous, because of output transistor heat STR-DA7100ES Minor issue Close together Surface mount directly on the amplifier circuit board From the top A single sheet of metal 70% smaller than the STRDA9000ES-and far, far smaller than analog amps of comparable power Wherever it makes the most sense for the shortest possible signal paths Short, simple and straight Molecular Bonding Even inside the MOS FET output transistors, Sony innovations are at work. Sony uses a new refinement of our molecular bonding technique to attach the transistor leads. In the STR-DA9000ES, the MOS FETs use "double wire molecular bonding" with two bonding wires, each rated for 15 amps of current. As a result, the DA9000ES MOS FET binding wires had 30 amp capacity. This was sufficient for the transistor's rated instantaneous current supply of 24 amps. The bare transistor for the STR-DA9000ES MOS FET, showing the double wire molecular bonding. ES Receivers v1.0 Page 14

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ES Receivers v1.0
Page 14
be isolated from other circuits.
On big amps, you'll usually find the output
transistors bonded to heavy aluminum heat sinks somewhere at the back or
sides of the chassis.
Thanks to the cool running of Sony's S-Master Pro
amplifier, the MOS FETs are located where the circuit topology is shortest and
simplest—lined up side-by-side, right in the middle of the power amplifier circuit
board.
In fact, the transistors can be so close together that the STR-DA7100ES
amplifier section is some 70% smaller than the DA9000ES amp section!
And the
board itself is located in the middle of the DA7100ES chassis.
As a result, the music is less exposed to vibration, radiated hum and
noise.
Operation is cool and consistent.
And nothing intrudes between you and
the sound.
Traditional amplifier
STR-DA7100ES
Transistor heat
Major design concern
Minor issue
Transistor packing
Widely separated
Close together
Transistor location
Away from heat-sensitive parts
Surface mount directly on the
amplifier circuit board
Transistor heat radiation
From the bottom
From the top
Heat sinks
Massive radiating fins made of
die cast aluminum (on the
better amplifiers)
A single sheet of metal
Space requirements
Major, for high powered
amplifiers
70% smaller than the STR-
DA9000ES—and far, far
smaller than analog amps of
comparable power
Amplifier board location
Isolated, to protect other
circuits from heat
Wherever it makes the most
sense for the shortest possible
signal paths
Overall chassis topology
Circuitous, because of output
transistor heat
Short, simple and straight
Molecular Bonding
Even inside the MOS FET output transistors, Sony innovations are at
work.
Sony uses a new refinement of our molecular bonding technique to attach
the transistor leads.
In the STR-DA9000ES, the MOS FETs use "double wire
molecular bonding" with two bonding wires, each rated for 15 amps of current.
As a result, the DA9000ES MOS FET binding wires had 30 amp capacity.
This
was sufficient for the transistor's rated instantaneous current supply of 24 amps.
The bare transistor for the STR-DA9000ES MOS FET, showing the
double wire molecular bonding.