Toshiba PSM30C-0RUU9 User Manual - Page 38
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User's Manual INTRODUCTION System automatic Standby/Hibernation Keypad overlay Power on password Instant security Intelligent power supply Battery save mode Panel power on/off Low battery automatic hibernation Heat dispersal This feature automatically shuts down the system in standby mode or Hibernation mode when there is no input or hardware access for a time specified. You can specify the time and select either System Standby or System Hibernate in the System standby and System hibernate item of the Power Save Mode window in TOSHIBA Power Saver. A ten-key pad is integrated into the keyboard. Refer to the Keypad overlay section in Chapter 5, The Keyboard, for instructions on using the keypad overlay. Two levels of password security, supervisor and user, are available to prevent unauthorized access to your computer. A hot key function blanks the screen and disables the computer providing data security. A microprocessor in the computer's intelligent power supply detects the battery's charge and calculates the remaining battery capacity. It also protects electronic components from abnormal conditions, such as voltage overload from a universal AC adaptor. You can monitor remaining battery capacity. Use the Battery remaining item of the Power Save Modes window in TOSHIBA Power Saver. This feature lets you save battery power. You can specify the Power Save Mode in the Running on batteries item of the Power Save Modes window in TOSHIBA Power Saver. This feature turns power to the computer off when the display panel is closed and turns it back on when the panel is opened. You can specify the setting in the When I close the lid item of the System Power Mode window in TOSHIBA Power Saver. When battery power is exhausted to the point that computer operation cannot be continued, the system automatically enters Hibernation and shuts down. You can specify the setting in the Battery Alarm item of the Alarm window in TOSHIBA Power Saver. The CPU has an internal temperature sensor that automatically activates cooling procedures. Refer to the Heat dispersal section in Chapter 4, Operating Basics, for details on setting the options for cooling methods. 1-8