ViewSonic VB-WIFI-004 User Guide English - Page 9

Declara°on of RoHS2 Compliance

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Declaration of RoHS2 Compliance This product has been designed and manufactured in compliance with Directive 2011/65/EU of the European Parliament and the Council on restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS2 Directive) and is deemed to comply with the maximum concentration values issued by the European Technical Adaptation Committee (TAC) as shown below: Substance Lead (Pb) Mercury (Hg) Cadmium (Cd) Hexavalent Chromium (Cr6⁺) Polybrominated biphenyls (PBB) Polybrominated diphenyl ethers (PBDE) Bis(2-Ethylhexyl) phthalate (DEHP) Benzyl butyl phthalate (BBP) Dibutyl phthalate (DBP) Diisobutyl phthalate (DIBP) Proposed Maximum Concentration 0.1% 0.1% 0.01% 0.1% 0.1% Actual Concentration < 0.1% < 0.1% < 0.01% < 0.1% < 0.1% 0.1% < 0.1% 0.1% < 0.1% 0.1% < 0.1% 0.1% < 0.1% 0.1% < 0.1% Certain components of products as stated above are exempted under the Annex III of the RoHS2 Directives as noted below. Examples of exempted components are: • Copper alloy containing up to 4% lead by weight. • Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead). • Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. • Lead in dielectric ceramic in capacitors for a rated voltage of 125V AC or 250V DC or higher. 9

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9
Declara°on of RoHS2 Compliance
This product has been designed and manufactured in compliance with Direc°ve
2011/65/EU of the European Parliament and the Council on restric°on of the use
of certain hazardous substances in electrical and electronic equipment (RoHS2
Direc°ve) and is deemed to comply with the maximum concentra°on values issued
by the European Technical Adapta°on Commi±ee (TAC) as shown below:
Substance
Proposed Maximum
Concentra°on
Actual Concentra°on
Lead (Pb)
0.1%
< 0.1%
Mercury (Hg)
0.1%
< 0.1%
Cadmium (Cd)
0.01%
< 0.01%
Hexavalent Chromium (Cr6⁺)
0.1%
< 0.1%
Polybrominated biphenyls (PBB)
0.1%
< 0.1%
Polybrominated diphenyl ethers
(PBDE)
0.1%
< 0.1%
Bis(2-Ethylhexyl) phthalate
(DEHP)
0.1%
< 0.1%
Benzyl butyl phthalate (BBP)
0.1%
< 0.1%
Dibutyl phthalate (DBP)
0.1%
< 0.1%
Diisobutyl phthalate (DIBP)
0.1%
< 0.1%
Certain components of products as stated above are exempted under the Annex
III of the RoHS2 Direc°ves as noted below. Examples of exempted components
are:
• Copper alloy containing up to 4% lead by weight.
Lead in high mel°ng temperature type solders (i.e. lead-based alloys containing
85% by weight or more lead).
• Electrical and electronic components containing lead in a glass or ceramic other
than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or
ceramic matrix compound.
• Lead in dielectric ceramic in capacitors for a rated voltage of 125V AC or 250V DC
or higher.