Dell OptiPlex 7080 Small Form Factor Setup and Specifications - Page 21

Environmental, Energy Star and Trusted Platform Module (TPM), Computer environment

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Table 16. Security (continued) Security options Microsoft 10 Device Guard and Credential Guard (Enterprise SKU) Microsoft Windows Bitlocker Local hard drive data wipe through BIOS (Secure Erase) Encryption - SED Hard Drive (Opal FIPS) Trusted Platform Module TPM 2.0 Intel Secure Boot Intel Authenticate OptiPlex 7080 Small Form Factor Supported Supported Supported Supported Supported Supported Supported Environmental Table 17. Environmental specifications Feature Recyclable packaging BFR/PVC-free chassis MultiPack packaging Energy-Efficient Power Supply ENV0424 compliant Yes No Yes (US only) (optional) Standard Yes NOTE: Wood‐based fiber packaging contains a minimum of 35% recycled content by total weight of wood‐based fiber. Packaging that contains without wood‐based fiber can be claimed as Not Applicable. Energy Star and Trusted Platform Module (TPM) Table 18. Energy Star and TPM Features ENERGY STAR qualified configurations available Trusted Platform Module (TPM) 2.01,2 Discrete TPM EPEAT Gold and Silver compliant configurations available Specifications Compliant configurations available Integrated on system board Onboard Compliant configurations available NOTE: 1TPM 2.0 is FIPS 140-2 certified. 2TPM is not available in all countries. Computer environment Airborne contaminant level: G1 as defined by ISA-S71.04-1985 Technical specifications 21

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Table 16. Security  (continued)
Security options
OptiPlex 7080 Small Form Factor
Microsoft 10 Device Guard and Credential Guard
(Enterprise SKU)
Supported
Microsoft Windows Bitlocker
Supported
Local hard drive data wipe through BIOS (Secure
Erase)
Supported
Encryption - SED Hard Drive (Opal FIPS)
Supported
Trusted Platform Module TPM 2.0
Supported
Intel Secure Boot
Supported
Intel Authenticate
Supported
Environmental
Table 17. Environmental specifications 
Feature
Recyclable packaging
Yes
BFR/PVC—free chassis
No
MultiPack packaging
Yes (US only) (optional)
Energy-Efficient Power Supply
Standard
ENV0424 compliant
Yes
NOTE:
Wood
‐
based fiber packaging contains a minimum of 35% recycled content by total weight of wood
‐
based fiber.
Packaging that contains without wood
‐
based fiber can be claimed as Not Applicable.
Energy Star and Trusted Platform Module (TPM)
Table 18. Energy Star and TPM 
Features
Specifications
ENERGY STAR qualified configurations available
Compliant configurations available
Trusted Platform Module (TPM) 2.0
1,2
Integrated on system board
Discrete TPM
Onboard
EPEAT Gold and Silver compliant configurations available
Compliant configurations available
NOTE:
1
TPM 2.0 is FIPS 140-2 certified.
2
TPM is not available in all countries.
Computer environment
Airborne contaminant level:
G1 as defined by ISA-S71.04-1985
Technical specifications
21