HP BL460c Managing the HP BladeSystem c-Class systems, 2nd edition - Page 9

action to maintain the enclosure's ability to operate, including adjusting fan speed, reducing power consumption, or performing shutdowns on some or all subsystems. The Fan Zones tab on the OA Thermal Subsystem page (Figure 8) gives a real-time, single-screen, zone-by-zone view of the thermal operating conditions. Figure 8. Onboard Administrator Thermal Subsystem page via a web GUI Power logic management The Onboard Administrator manages component power allocation and can limit the overall power consumption of the enclosure. This feature is often referred to as power capping. Power measurement sensors are used to accurately monitor how much power is being consumed and how much power is available. Onboard Administrator manages power using real-time measured power data instead of maximum power envelopes. Therefore, customers can deploy more servers and interconnect modules than if the configuration was based only on nameplate power specifications for each component. Note If redundancy mode is either AC Redundant or Power Supply Redundant and power redundancy is lost, any additional power requests from the Onboard Administrator will not be accepted, even if there is enough non-redundant power available. For example, newly inserted server blades will not be allowed to power on. Either the failure must be corrected or the redundancy mode must be changed. 9