HP EliteBook Folio 1020 EliteBook Folio 1020 G1 Notebook PC EliteBook Folio 10 - Page 67

Caution

Get HP EliteBook Folio 1020 PDF manuals and user guides View all HP EliteBook Folio 1020 manuals
Add to My Manuals
Save this manual to your list of manuals

Page 67 highlights

2. Remove the heat sink (2). CAUTION: Take extreme care when removing the heat sink. The heatpipe is very fragile and can be easily damaged and bent during removal. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and system board spare part kits. The following illustration shows the replacement thermal material locations. Thermal paste is used on the heat sink (1) and the processor (2). Component replacement procedures 59

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114
  • 115
  • 116
  • 117
  • 118
  • 119
  • 120
  • 121
  • 122
  • 123
  • 124
  • 125
2.
Remove the heat sink
(2)
.
CAUTION:
Take extreme care when removing the heat sink. The heatpipe is very fragile and can be
easily damaged and bent during removal.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the
system board components each time the heat sink is removed. Replacement thermal material is
included with the heat sink, processor, and system board spare part kits.
The following illustration shows the replacement thermal material locations. Thermal paste is used on
the heat sink
(1)
and the processor
(2)
.
Component replacement procedures
59