HP ProLiant DL288 ISS Technology Update, Volume 7 Number 1 - Newsletter - Page 5

Key technologies in the HP BladeSystem c3000 Enclosure – tower version, Overview

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ISS Technology Update Volume 7, Number 1 Key technologies in the HP BladeSystem c3000 Enclosure - tower version This article summarizes the key technologies in the tower version of the HP BladeSystem c3000 Enclosure, including Thermal Logic power and cooling technologies, interconnect and storage options, HP Virtual Connect, and Onboard Administrator. Detailed information about these technologies, which are also implemented in the rack version of the HP BladeSystem c3000 Enclosure, is available at http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01204885/c01204885.pdf. Overview The c3000 enclosure tower version accommodates c-Class form-factor server/storage blades and interconnect modules. It has the flexibility to hold up to eight half-height (HH) or four full-height (FH) server blades, six Active Cools fans, and six power supplies (Figure 2-1). Both the BladeSystem c3000 tower and rack enclosures are optimized for remote sites, small and medium-sized businesses, and data centers with special power and cooling constraints or data centers with low power and cooling capacities. A major advantage of the tower version is that it requires no rack, which provides greater versatility for deploying blades in environments with constrained space. Also, its built-in wheels make it a very flexible solution. Figure 2-1. Front and back views of the c3000 enclosure - tower version HP Thermal Logic technologies HP Thermal Logic includes the mechanical design features, built-in intelligence, and control capabilities that minimize power and cooling use while maintaining adequate cooling for all devices in the c3000 Enclosure. Thermal Logic technologies allow administrators to view power use and temperature at the server or enclosure level. There are numerous HP Thermal Logic technologies: • Active Cool fans • Parallel Redundant Scalable Enclosure (PARSEC) design • Instant power and thermal monitoring • Pooled power for a variety of power redundancy modes • Dynamic Power Saver mode • Power Regulator • Power workload balancing 5

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ISS Technology Update
Volume 7, Number 1
5
Key technologies in the HP BladeSystem c3000 Enclosure – tower version
This article summarizes the key technologies in the tower version of the HP BladeSystem c3000 Enclosure, including Thermal
Logic power and cooling technologies, interconnect and storage options, HP Virtual Connect, and Onboard Administrator.
Detailed information about these technologies, which are also implemented in the rack version of the HP BladeSystem c3000
Enclosure, is available at
.
Overview
The c3000 enclosure tower version accommodates c-Class form-factor server/storage blades and interconnect modules. It has
the flexibility to hold up to eight half-height (HH) or four full-height (FH) server blades, six Active Cools fans, and six power
supplies (Figure 2-1). Both the BladeSystem c3000 tower and rack enclosures are optimized for remote sites, small and
medium-sized businesses, and data centers with special power and cooling constraints or data centers with low power and
cooling capacities. A major advantage of the tower version is that it requires no rack, which provides greater versatility for
deploying blades in environments with constrained space. Also, its built-in wheels make it a very flexible solution.
Figure 2-1.
Front and back views of the c3000 enclosure - tower version
HP Thermal Logic technologies
HP Thermal Logic includes the mechanical design features, built-in intelligence, and control capabilities that minimize power
and cooling use while maintaining adequate cooling for all devices in the c3000 Enclosure. Thermal Logic technologies allow
administrators to view power use and temperature at the server or enclosure level. There are numerous HP Thermal Logic
technologies:
•
Active Cool fans
•
Parallel Redundant Scalable Enclosure (PARSEC) design
•
Instant power and thermal monitoring
•
Pooled power for a variety of power redundancy modes
•
Dynamic Power Saver mode
•
Power Regulator
•
Power workload balancing