HP ProLiant SL270s HP ProLiant SL Servers Planning Guide - Page 11

Blanking panels, HP Rack Airflow Optimization Kit, Space requirements, Delivery space requirements

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The free area of a door determines the amount of airflow that can pass through the doors. Rack doors must have a minimum of 63% free area compared to the total area of the door. Some doors appear to have sufficient free area but do not. To prevent air recirculation from the rear of the rack, the computer room air conditioning system must deliver sufficient airflow to the front of the rack to meet the airflow requirements of the installed equipment in the rack. Idle, normally operating, and maximum airflow requirements for server configurations can be obtained from the HP website (http://h18004.www1.hp.com/products/solutions/power). Route cables away from fans and air inlets and outlets to ensure proper airflow. Improperly routed cables can impede airflow, cause the cooling fans to work harder, consume more power, and reduce cooling system efficiency. Blanking panels If the front of the rack is not filled completely with components, unused equipment mounting space between the components can adversely affect cooling within the rack. Cover unused equipment mounting space with blanking panels. Seal air gaps in the rack and between adjacent racks to prevent recirculation of hot-air from the rear of the rack to the front of the rack. Use cable brushes to seal cable entry and exit cutouts and cabinet fillers to seal the space between the cabinets to provide improved cooling efficiency. HP Rack Airflow Optimization Kit The HP Rack Airflow Optimization Kit helps seal air gaps inside the rack, between two bayed racks, and the clearance between the floor and the rack. The kit also prevents hot exhaust air from the rear of the rack from reaching the front of the rack through pressure differential between the hot and cold aisles. This feature maximizes server cold air intake, which improves datacenter cooling efficiency and reduces datacenter power usage. The HP Rack Airflow Optimization Kit supports all HP 10000 Series (G1 and G2) rack heights including 22U, 36U, 42U, and 47U. It also supports 800-mm wide HP racks. Space requirements When deciding where to place your rack: • At least 1219 mm (48 in) of clearance is needed all the way around the pallet and above the rack to enable the removal of the packing material. • At least 1219 mm (48 in) of clearance is needed in front of the rack to enable the door to open completely. • At least 762 mm (30 in) of clearance is needed in the rear of the rack to provide access to components. • At least 380 mm (15 in) of clearance is needed around a power supply to facilitate servicing. For more information, see "Working space for component access". Delivery space requirements There should be enough clearance to move equipment safely from the receiving area to the computer room. Permanent obstructions, such as pillars or narrow doorways, can cause equipment damage. Environmental requirements 11

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Environmental requirements 11
The free area of a door determines the amount of airflow that can pass through the doors. Rack doors must
have a minimum of 63% free area compared to the total area of the door. Some doors appear to have
sufficient free area but do not.
To prevent air recirculation from the rear of the rack, the computer room air conditioning system must deliver
sufficient airflow to the front of the rack to meet the airflow requirements of the installed equipment in the rack.
Idle, normally operating, and maximum airflow requirements for server configurations can be obtained from
the HP website (
).
Route cables away from fans and air inlets and outlets to ensure proper airflow. Improperly routed cables can
impede airflow, cause the cooling fans to work harder, consume more power, and reduce cooling system
efficiency.
Blanking panels
If the front of the rack is not filled completely with components, unused equipment mounting space between
the components can adversely affect cooling within the rack. Cover unused equipment mounting space with
blanking panels.
Seal air gaps in the rack and between adjacent racks to prevent recirculation of hot-air from the rear of the
rack to the front of the rack. Use cable brushes to seal cable entry and exit cutouts and cabinet fillers to seal
the space between the cabinets to provide improved cooling efficiency.
HP Rack Airflow Optimization Kit
The HP Rack Airflow Optimization Kit helps seal air gaps inside the rack, between two bayed racks, and the
clearance between the floor and the rack. The kit also prevents hot exhaust air from the rear of the rack from
reaching the front of the rack through pressure differential between the hot and cold aisles. This feature
maximizes server cold air intake, which improves datacenter cooling efficiency and reduces datacenter
power usage.
The HP Rack Airflow Optimization Kit supports all HP 10000 Series (G1 and G2) rack heights including
22U, 36U, 42U, and 47U. It also supports 800-mm wide HP racks.
Space requirements
When deciding where to place your rack:
•
At least 1219 mm (48 in) of clearance is needed all the way around the pallet and above the rack to
enable the removal of the packing material.
•
At least 1219 mm (48 in) of clearance is needed in front of the rack to enable the door to open
completely.
•
At least 762 mm (30 in) of clearance is needed in the rear of the rack to provide access to components.
•
At least 380 mm (15 in) of clearance is needed around a power supply to facilitate servicing.
For more information, see "Working space for component access".
Delivery space requirements
There should be enough clearance to move equipment safely from the receiving area to the computer room.
Permanent obstructions, such as pillars or narrow doorways, can cause equipment damage.