HP d260 Business Desktop d260 Series, Service Reference Guide, First Edition - Page 46

Memory Modules

Page 46 highlights

Removal and Replacement Procedures - Microtower Type Chassis 6.5 Memory Modules For more information on memory used in these computers refer to Appendix E. Ä CAUTION: The memory module sockets have gold metal contacts. When upgrading the memory, it is important to use memory modules with gold metal contacts to prevent corrosion and/or oxidation resulting from having incompatible metals in contact with each other. Ä CAUTION: Static electricity can damage the electronic components of the computer or optional cards. Before beginning these procedures, ensure that you are discharged of static electricity by briefly touching a grounded metal object. Refer to Chapter 5 for more information. Ä CAUTION: When handling a memory module, be careful not to touch any of the contacts. Doing so may damage the module. 1. Prepare the computer for disassembly (Section 6.1). 2. Remove the right access panel (Section 6.2). Å WARNING: To reduce risk of personal injury from hot surfaces, allow the internal system components to cool before touching. 3. Lay the computer down on its side to make it easier to work on. 6-6 377977-AA1 Service Reference Guide, d260

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6–6
377977-AA1
Service Reference Guide, d260
Removal and Replacement Procedures - Microtower Type Chassis
6.5 Memory Modules
For more information on memory used in these computers refer to
Appendix E
.
Ä
CAUTION:
The memory module sockets have gold metal contacts. When upgrading the memory, it is
important to use memory modules with gold metal contacts to prevent corrosion and/or oxidation
resulting from having incompatible metals in contact with each other.
Ä
CAUTION:
Static electricity can damage the electronic components of the computer or optional cards.
Before beginning these procedures, ensure that you are discharged of static electricity by briefly touching
a grounded metal object. Refer to Chapter 5 for more information.
Ä
CAUTION:
When handling a memory module, be careful not to touch any of the contacts. Doing so
may damage the module.
1. Prepare the computer for disassembly (Section
6.1
).
2. Remove the right access panel (Section
6.2
).
Å
WARNING:
To reduce risk of personal injury from hot surfaces, allow the internal system components to
cool before touching.
3. Lay the computer down on its side to make it easier to work on.