Intel AXXROMBSASMR Hardware User Guide - Page 26

Electrical Characteristics All power is supplied to the Intel® Integrated RAID Module SROMBSASMR through the board-to-board connector via PCI Express* 3.3 V rails. The supply voltages are 3.3 V ± 9 percent from PCI edge connector only. The maximum power for the +3.3 V rail is 18 W. The +12 V rail is not provided by the base card. The +3.3 V rail is used by the 3.3 V logic circuitry and also used to generate the other required voltage rails of +1.5 V and +1.8 V. The +3.3 V auxiliary voltage is used to generate the +12 V standby for the Intel® RAID Smart Battery AXXRSBBU3. The voltage level used in the charging circuitry for the battery pack on the optional Intel® RAID Smart Battery AXXRSBBU3 is +12 V. During fast charging of the battery pack, expected power consumption is 230 mA rise in +12V current. Thermal and Atmospheric Characteristics The thermal and atmospheric characteristics are: • Relative humidity range: 20% to 80% non-condensing • Maximum dew point temperature: 32°C • Airflow must be at least 200 linear feet per minute (SFPM) to avoid operating above the maximum ambient temperature. The storage and transit environment conditions are: • Temperature range from -30°C to 80°C (dry bulb) • Relative humidity range: 5% to 90% non-condensing Safety Characteristics The Intel® Integrated RAID Module SROMBSASMR meets or exceeds the requirements of UL flammability rating V0. Each bare board is marked with the supplier name or trademark, type, and UL flammability rating. 16 Intel® Integrated RAID Module SROMBSASMR Hardware User's Guide