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Intel DC3217BY Technical Product Specification - Page 51

Reliability, Environmental

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Technical Reference 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332 Issue 2, Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF for the board is 62,504 hours. 2.8 Environmental Table 20 lists the environmental specifications for the board. Table 20. Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -40 °C to +60 °C 0 °C to +50 °C 50 g trapezoidal waveform Velocity change of 170 inches/s² Half sine 2 millisecond Product Weight (pounds) Free Fall (inches)

Section	Page
Intel® Next Unit of Computing Board D33217CK Technical Product Specification	1
Revision History	2
Disclaimer	2
Board Identification Information	3
Specification Changes or Clarifications	3
Errata	3
Preface	5
Intended Audience	5
What This Document Contains	5
Typographical Conventions	5
Contents	7
1 Product Description	11
1.1 Overview	11
1.1.1 Feature Summary	11
1.1.2 Board Layout (Top)	13
1.1.3 Board Layout (Bottom)	15
1.1.4 Block Diagram	17
1.2 Online Support	18
1.3 Processor	18
1.4 System Memory	19
1.4.1 Memory Configurations	20
1.5 Intel® QS77 Express Chipset	22
1.5.1 Direct Media Interface (DMI)	22
1.5.2 Display Interfaces	22
1.6 Graphics Subsystem	22
1.6.1 Integrated Graphics	22
1.6.2 USB	24
1.7 SATA Interface	24
1.7.1 AHCI Mode	24
1.8 Real-Time Clock Subsystem	25
1.9 Connectivity	25
1.9.1 Thunderbolt™ Technology Interface	25
1.10 Hardware Management Subsystem	25
1.10.1 Hardware Monitoring	26
1.10.2 Fan Monitoring	26
1.10.3 Thermal Solution	26
1.11 Power Management	27
1.11.1 ACPI	27
1.11.2 Hardware Support	29
2 Technical Reference	33
2.1 Memory Resources	33
2.1.1 Addressable Memory	33
2.1.2 Memory Map	35
2.2 Connectors and Headers	35
2.2.1 Back Panel Connectors	36
2.2.2 Connectors and Headers (Bottom)	37
2.3 BIOS Setup Configuration Jumper	44
2.4 Mechanical Considerations	46
2.4.1 Form Factor	46
2.5 Electrical Considerations	47
2.5.1 Power Supply Considerations	47
2.5.2 Fan Header Current Capability	48
2.6 Thermal Considerations	48
2.7 Reliability	51
2.8 Environmental	51
3 Overview of BIOS Features	53
3.1 Introduction	53
3.2 BIOS Flash Memory Organization	54
3.3 System Management BIOS (SMBIOS)	54
3.4 Legacy USB Support	54
3.5 BIOS Updates	55
3.5.1 Language Support	55
3.5.2 Custom Splash Screen	56
3.6 BIOS Recovery	56
3.7 Boot Options	57
3.7.1 Booting Without Attached Devices	57
3.7.2 Changing the Default Boot Device During POST	57
3.8 Hard Disk Drive Password Security Feature	58
3.9 BIOS Security Features	59
4 Error Messages and Blink Codes	61
4.1 Front-panel Power LED Blink Codes	61
4.2 BIOS Error Messages	61
4.3 Port 80h POST Codes	62
5 Regulatory Compliance and Battery Disposal Information	69
5.1 Regulatory Compliance	69
5.1.1 Safety Standards	69
5.1.2 European Union Declaration of Conformity Statement	70
5.1.3 Product Ecology Statements	71
5.1.4 EMC Regulations	73
5.1.5 ENERGY STAR* 5.2, e-Standby, and ErP Compliance	76
5.1.6 Regulatory Compliance Marks (Board Level)	77